公开(公告)号：US20110051381A1

公开(公告)日：2011-03-03

申请号：US12869184

申请日：2010-08-26

Applicant: Takahiro Sugiyama ,  Hideki Nounen

Inventor： Takahiro Sugiyama ,  Hideki Nounen

IPC: H05K1/00 ,  H01R43/20

CPC classification number: H01R12/62 ,  H01R13/035 ,  H01R13/2414 ,  H01R13/2478 ,  H05K3/0061 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/0715 ,  H05K2201/10234 ,  H05K2201/10409 ,  H05K2201/2009

Abstract: There is provided a flexible harness adapted to be detachably connected to electrode pads of an electric/electronic component. The flexible harness according to the present invention comprises: a flexible insulator film; a conductor pattern formed on the flexible insulator film; a terminal plane which is an end region of the conductor pattern; and ball-like contact bumps formed on the terminal plane. Each contact bump includes a core made of an elastically deformable resin and an electrical conductor layer surrounding the core.

Abstract translation: 提供了适于可拆卸地连接到电气/电子部件的电极焊盘的柔性线束。 根据本发明的柔性线束包括：柔性绝缘膜; 形成在柔性绝缘膜上的导体图案; 作为导体图案的端部区域的端子平面; 以及形成在端子平面上的球状接触凸点。 每个接触凸块包括由可弹性变形的树脂制成的芯和围绕芯的电导体层。

公开(公告)号：US20110008056A1

公开(公告)日：2011-01-13

申请号：US12923259

申请日：2010-09-10

Applicant: Takatoshi Yagisawa

Inventor： Takatoshi Yagisawa

IPC: H04B10/04 ,  H05K1/03

CPC classification number: H05K1/147 ,  G02B6/4201 ,  G02B6/4246 ,  H01P1/047 ,  H01P3/003 ,  H05K1/0219 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/4629 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/1034

Abstract: A connection device includes a ground electrode layer that is provided in a substrate, a first transmission path that is provided on the ground electrode layer via a dielectric layer, and a plurality of leads that are connected to the first transmission path and the ground electrode layer or the first transmission path and a plane that is electrically connected to the ground electrode layer. The plurality of leads are fitted into through-holes that are provided in a second transmission path and a ground electrode on a flexible substrate to be electrically connected.

Abstract translation: 连接装置包括设置在基板中的接地电极层，经由电介质层设置在接地电极层上的第一传输路径和与第一传输路径和接地电极层连接的多个引线 或第一传输路径和电连接到接地电极层的平面。 多个引线装配在设置在第二传输路径上的通孔中，并且柔性基板上的接地电极被电连接。

公开(公告)号：US20110000702A1

公开(公告)日：2011-01-06

申请号：US12920110

申请日：2009-03-10

Applicant: Akira Oikawa

Inventor： Akira Oikawa

IPC: H05K1/03

CPC classification number: H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09681 ,  H05K2201/09909

Abstract: A signal line (2) is formed on one surface of a base substrate (1), and a cover lay film (3) is laminated further. A plurality of projections (4) made of an insulating material are formed at substantially regular intervals vertically and laterally on an upper surface of the above-mentioned cover lay film and a ground layer (5), for example, made of a silver paste is formed on the above-mentioned cover lay film except for the arranged position of each of the above-mentioned projections.In this case, a film thickness of the ground layer made of said conductive paste is formed to be less than a height of a top of said projection arranged at an insulating layer, so that an openings (gaps) substantially in the shape of a mesh can be formed at the ground layer made of the conductive paste because of the existence of the projection.Thus, it is possible to provide a circuit board achieving the similar effect to that of a ground plane having gaps substantially in the shape of a mesh.

Abstract translation: 信号线（2）形成在基底（1）的一个表面上，并且覆盖膜（3）被进一步层压。 由绝缘材料制成的多个突起（4）在上述覆盖膜的上表面上以垂直和横向大致规则的间隔形成，并且例如由银膏制成的接地层（5） 形成在上述盖板上，除了每个上述突起的布置位置。 在这种情况下，由所述导电膏制成的接地层的膜厚度形成为小于布置在绝缘层上的所述突起的顶部的高度，从而形成基本上为网状的开口（间隙） 可以由于存在投影而在由导电浆料制成的接地层处形成。 因此，可以提供一种电路板，其实现与具有基本上为网状形状的间隙的接地平面类似的效果。

公开(公告)号：US20100326706A1

公开(公告)日：2010-12-30

申请号：US12797285

申请日：2010-06-09

Applicant: Kiyomi Muro ,  Sadahiro Tamai

Inventor： Kiyomi Muro ,  Sadahiro Tamai

IPC: H05K1/00

CPC classification number: H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0715

Abstract: According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.

Abstract translation: 根据一个实施例，电子设备包括柔性印刷线路板。 印刷布线板包括：导电层，包括信号线和接地线;层叠在导电层上的第二绝缘层，并且包括开到地线上方的开口;覆盖信号线并电连接到接地线的接地层 以及覆盖所述接地层的第三绝缘层。 接地层包括第一和第二导电浆料。 将第一导电膏填充在开口中以覆盖暴露于开口底部的接地线。 施加第二导电浆料以连续地覆盖第一导电浆料和第二绝缘层。 第二导电糊具有比第一导电糊更小的体积电阻率。

公开(公告)号：US20100315790A1

公开(公告)日：2010-12-16

申请号：US12789341

申请日：2010-05-27

Applicant: Toshikazu Imaoka ,  Tetsuro Sawai ,  Atsushi Saita ,  Takeshi Yamaguchi

Inventor： Toshikazu Imaoka ,  Tetsuro Sawai ,  Atsushi Saita ,  Takeshi Yamaguchi

IPC: H05K1/18 ,  H05K1/16

CPC classification number: H01L23/49838 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/645 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2225/06568 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/3011 ,  H05K1/0218 ,  H05K1/165 ,  H05K3/4685 ,  H05K2201/0715 ,  H01L2924/00

Abstract: A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.

Abstract translation: 电路基板结构中的第一布线层设置有第一电感器和第二电感器。 电介质层设置有分别电连接到第一电感器和第二电感器的第一通孔和第二通孔。 第二布线层设置有：电连接第一通孔和第二通孔的桥; 以及设置在桥周围的导电图案，导电图案的外边缘位于第一布线图案的外边缘的外侧，第二布线图案位于第一布线层的外侧。 桥作为共面线，抑制电磁场的产生。

公开(公告)号：US20100314164A1

公开(公告)日：2010-12-16

申请号：US12568471

申请日：2009-09-28

Applicant: Chung-Lun WU ,  Fu-An Chu ,  Ja-Ee Li

Inventor： Chung-Lun WU ,  Fu-An Chu ,  Ja-Ee Li

IPC: H05K9/00 ,  H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0221 ,  H05K1/0245 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/0715 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.

Abstract translation: 提供了一种柔性印刷电路及其制造方法。 至少一根信号线设置在塑料基板上。 两条接地线平行设置在信号线的两侧。 提供屏蔽层，与塑料基板接触以形成室，其中信号线和接地线被包裹在其中。 在信号线和屏蔽层之间实现柔性介电层以提供电隔离。

公开(公告)号：US20100258337A1

公开(公告)日：2010-10-14

申请号：US12430133

申请日：2009-04-27

Applicant: SHOU-KUO HSU ,  CHIA-NAN PAI

Inventor： SHOU-KUO HSU ,  CHIA-NAN PAI

IPC: H05K1/00

CPC classification number: H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/0969

Abstract: A flexible printed circuit board (FPCB) includes a signal layer, upper and lower ground layers, and two dielectric layers. The signal layer includes a differential pair comprising two transmission lines to transmit a pair of differential signals. The dielectric layers are located on and under the signal layer to sandwich the signal layer. The upper ground layer is attached to the dielectric layer on the signal layer, opposite to the signal layer. The lower ground layer is attached to the dielectric layer under the signal layer, opposite to the signal layer. Each ground layer includes a grounded sheet made of conductive material. Two voids are defined in each ground layer and located at opposite sides of the corresponding grounded sheet. Distances between the middle line of the grounded sheet of each ground layer and middle lines of the two transmission lines are equal.

Abstract translation: 柔性印刷电路板（FPCB）包括信号层，上下接地层和两个电介质层。 信号层包括差分对，该差分对包括用于发送一对差分信号的两条传输线。 电介质层位于信号层之上和之下，以夹住信号层。 上层接地层与信号层的电介质层相连，与信号层相反。 下部接地层附着在与信号层相反的信号层下面的电介质层上。 每个接地层包括由导电材料制成的接地片。 在每个接地层中定义两个空隙，并且位于相应接地片的相对侧。 每个接地层的接地片的中间线与两条传输线的中间线之间的距离相等。

公开(公告)号：US20100244281A1

公开(公告)日：2010-09-30

申请号：US12750597

申请日：2010-03-30

Applicant: Katsuhiko HAYASHI ,  Tatsuo KATAOKA

Inventor： Katsuhiko HAYASHI ,  Tatsuo KATAOKA

IPC: H01L23/498 ,  H05K1/16 ,  H05K1/00

CPC classification number: H01L23/49572 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H05K1/0209 ,  H05K1/0393 ,  H05K3/4652 ,  H05K2201/0715 ,  H05K2201/10681 ,  H01L2224/0401

Abstract: Objects of the present invention is to provide a flexible printed wiring board which has a simple structure, which can be produced at low cost, and which can effectively dissipate heat generated by semiconductor chips, and to provide a semiconductor device employing the flexible printed wiring board. The flexible printed wiring board of the invention has an insulating substrate, and a wiring pattern formed of a conductor layer and provided on one surface of the insulating substrate, wherein the wiring pattern includes inner leads for mounting a semiconductor chip and outer leads for input and output wire connection, and a metal layer is adhered to the wiring pattern via an insulating adhesion layer.

Abstract translation: 本发明的目的是提供一种柔性印刷布线板，其结构简单，可以低成本地制造，并且可以有效地散发由半导体芯片产生的热量，并且提供一种使用柔性印刷线路板的半导体器件 。 本发明的柔性印刷电路板具有绝缘基板和由导体层形成并布置在绝缘基板的一个表面上的布线图案，其中布线图形包括用于安装半导体芯片的内引线和用于输入的外引线， 输出线连接，并且金属层经由绝缘粘合层粘附到布线图案。

公开(公告)号：US20100201464A1

公开(公告)日：2010-08-12

申请号：US12764262

申请日：2010-04-21

Applicant: Joo-Yeol LEE

Inventor： Joo-Yeol LEE

IPC: H01P3/08

CPC classification number: H01P3/003 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09236

Abstract: Disclosed herein is a flat uniform transmission line having an electromagnetic shielding function. The flat uniform transmission line includes a strip transmission line, an insulating layer, and electromagnetic shielding layers. The strip transmission line is formed on a dielectric layer made of functional polymer material, and includes a plurality of strip lines. The plurality of strip lines are configured to be a ground line, or to transmit signals. The insulating layer is formed on the strip transmission line. The electromagnetic shielding layers are respectively formed on the insulating layer and beneath the strip transmission line.

Abstract translation: 这里公开了具有电磁屏蔽功能的扁平均匀传输线。 扁平均匀传输线包括带状传输线，绝缘层和电磁屏蔽层。 带状传输线形成在由功能聚合物材料制成的电介质层上，并且包括多条带状线。 多条带状线被配置为接地线或发送信号。 绝缘层形成在带状传输线上。 电磁屏蔽层分别形成在绝缘层上和带状传输线下方。

公开(公告)号：US07750434B2

公开(公告)日：2010-07-06

申请号：US11336091

申请日：2006-01-20

Applicant: Toshikazu Imaoka ,  Tetsuro Sawai ,  Atsushi Saita ,  Takeshi Yamaguchi ,  Makoto Tsubonoya ,  Kazunari Kurokawa

Inventor： Toshikazu Imaoka ,  Tetsuro Sawai ,  Atsushi Saita ,  Takeshi Yamaguchi ,  Makoto Tsubonoya ,  Kazunari Kurokawa

IPC: H01L27/08

CPC classification number: H01L23/49838 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/645 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2225/06568 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/3011 ,  H05K1/0218 ,  H05K1/165 ,  H05K3/4685 ,  H05K2201/0715 ,  H01L2924/00

Abstract: A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.

Abstract translation: 电路基板结构中的第一布线层设置有第一电感器和第二电感器。 电介质层设置有分别电连接到第一电感器和第二电感器的第一通孔和第二通孔。 第二布线层设置有：电连接第一通孔和第二通孔的桥; 以及设置在桥周围的导电图案，导电图案的外边缘位于第一布线图案的外边缘的外侧，第二布线图案位于第一布线层的外侧。 该桥作为共面线，抑制电磁场的产生。