公开(公告)号：US20050017375A1

公开(公告)日：2005-01-27

申请号：US10885623

申请日：2004-07-08

Applicant: Shun-Fu Ko ,  Yi-Chuan Ding

Inventor： Shun-Fu Ko ,  Yi-Chuan Ding

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L21/48 ,  H01L23/52

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09736 ,  H05K2201/09745 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A ball grid array package substrate includes a substrate body having a surface. A least a ball pad and a solder mask are formed on the surface of the substrate body. The solder mask has an opening corresponding to the ball pads to enable the ball pad to have an exposed surface out of the opening of the solder mask. A patterned reinforcing metal layer is formed on the exposed surface of ball pads along a sidewall of the opening of the solder mask so that the sidewall of the opening will not directly contact the solder balls. Solder balls can be reflowed on the ball pads and the patterned reinforcing metal layers to increase jointing area and improve the shear strength of the solder balls.

Abstract translation: 球栅阵列封装衬底包括具有表面的衬底主体。 在基板主体的表面上形成至少一个焊盘和焊接掩模。 焊接掩模具有对应于球焊盘的开口，以使球垫能够将暴露的表面从焊料掩模的开口外部排出。 在焊盘的暴露的表面上沿着焊料掩模的开口的侧壁形成图案化的加强金属层，使得开口的侧壁将不直接接触焊球。 焊球可以在球垫和图案化的加强金属层上回流，以增加接合面积并提高焊球的剪切强度。

公开(公告)号：US06822169B2

公开(公告)日：2004-11-23

申请号：US10163221

申请日：2002-06-05

Applicant: Masahiro Kataoka

Inventor： Masahiro Kataoka

IPC: H05K100

CPC classification number: H05K3/363 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10984 ,  Y10T29/49149

Abstract: A flexible printed circuit board (“FPCB”) that has a through hole in the pattern layer between the cover layer and base layer, the diameter of the through hole in the pattern layer of FPCB is smaller than that of the holes in the cover layer and the base layer of another printed circuit board (“PCB”). The holes in the cover layer and base layer are oriented toward the solder land part of the FPCB. The difference in diameter increases the connecting area for soldering a FPCB to another PCB leading to an accurate and strong solder.

Abstract translation: 柔性印刷电路板（“FPCB”）在覆盖层和基层之间的图案层中具有通孔，FPCB的图案层中的通孔的直径小于覆盖层中的孔的直径 和另一印刷电路板（“PCB”）的基底层。 覆盖层和基层中的孔朝FPCB的焊盘部分取向。 直径的差异增加了将FPCB焊接到另一个PCB的连接区域，从而导致精确而强大的焊料。

公开(公告)号：US06788546B1

公开(公告)日：2004-09-07

申请号：US09936962

申请日：2001-12-27

Applicant: Philippe Steiert ,  Gerhard Staufert

Inventor： Philippe Steiert ,  Gerhard Staufert

IPC: H05K702

CPC classification number: H01L25/16 ,  H01L23/538 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/117 ,  H05K2201/09736 ,  H05K2201/10272 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The invention is related to a multi-chip-module and to a method for its manufacture. The module comprises a base carrier, on which at least in some areas signal conductor tracks and signal contact surfaces arranged at least in a single layer are located, and with at least one semiconductor component operating in the signal range and connected with the signal conductor track and signal contact surfaces. The purpose is to achieve a high degree of integration with a multi-chip-module of this type. To do so, in addition at least in some areas on the base carrier power conductor tracks and power contact surfaces arranged in at least one layer are located. Furthermore, at least one power electronics component operating in the power range is provided, which is connected with at least one power conductor track, at least one power contact surface and at least one signal conductor track. The power conductor tracks have a larger cross section than the signal conductor tracks at least on the basis of greater thickness dimensions.

Abstract translation: 本发明涉及一种多芯片模块及其制造方法。 该模块包括基底载体，至少在一些区域中信号至少在单层中布置的导体迹线和信号接触表面位于其中，并且至少一个半导体元件在信号范围内工作并与信号导体轨道连接 和信号接触面。 目的是实现与这种类型的多芯片模块的高度集成。 为此，另外至少在基座载体上的一些区域中，布置在至少一层中的导体轨道和功率接触表面被定位。 此外，提供了在功率范围内工作的至少一个电力电子部件，其与至少一个电力导体轨道，至少一个电力接触表面和至少一个信号导体轨道连接。 至少基于更大的厚度尺寸，电力导体轨道具有比信号导体轨迹更大的横截面。

公开(公告)号：US20040163844A1

公开(公告)日：2004-08-26

申请号：US10784226

申请日：2004-02-24

Applicant: Sony Chemicals Corp.

Inventor： Masanori Takeuchi

IPC: G06F007/00 ,  G06F017/30 ,  H05K001/00

CPC classification number: H05K3/4617 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K3/002 ,  H05K3/06 ,  H05K3/202 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The flexible wiring board has a first wiring film and a second wiring film. Because the first wiring film has a larger thickness than the second wiring film, the sectional area and electrical resistance of the first wiring film can be enlarged because of the larger film thickness even in a case where the first and second wiring films have almost the same width. Therefore, a high current can flow through the first wiring film, although the wiring film has a small width. As a result, a high density of the flexible wiring board can be easily achieved.

Abstract translation: 柔性布线板具有第一布线膜和第二布线膜。 由于第一布线膜的厚度比第二布线膜厚，因此即使在第一布线膜和第二布线膜几乎相同的情况下，也可以扩大第一布线膜的截面积和电阻， 宽度。 因此，尽管布线膜的宽度小，但是高电流可以流过第一布线膜。 结果，可以容易地实现柔性布线板的高密度化。

公开(公告)号：US20040124493A1

公开(公告)日：2004-07-01

申请号：US10475267

申请日：2003-10-20

Inventor： Ah Lim Chua

IPC: H01L029/00

CPC classification number: H05K3/4611 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/162 ,  H05K3/243 ,  H05K2201/09672 ,  H05K2201/09736 ,  H05K2203/0369

Abstract: Upper, inner and lower sections (182, 180 and 184) of a PCB (100) are formed with each section having a substrate (140, 150 and 160) having patterned layers of metallization (105 and 110, 115 and 120, and 125 and 130), respectively Some of the patterned layers of metallization (110, 115, 120, and 125) have thicker portions(171, 173) and part (188) of portion(186), and thinner portions(172, 174, 187, 190, 191, 192 and 193). The resultant thinner portion(175 and 194)in the prepreg layers (145 and 155) with the respective thicker portions of metallization provide decoupling capacitors, while the resultant thicker portions (196 and 198), for example, provide a lower capacitance for improved trace impedance for the signal traces (191 and 192).

Abstract translation: PCB（100）的上部，内部和下部（182,180和184）形成，每个部分具有具有图案化的金属化层（105和110,115和120以及125）的衬底（140,150和160） 金属化（110,115,120和125）的一些图案化层具有部分（186）的较厚部分（171,173）和部分（188）以及更薄部分（172,174,187） ，190,191,192和193）。 预浸料层（145和155）中所形成的较薄部分（175和194）与金属化的较厚部分提供去耦电容器，而所得到的较厚部分（196和198）例如提供较低电容以改善痕迹 信号迹线（191和192）的阻抗。

公开(公告)号：US06735052B2

公开(公告)日：2004-05-11

申请号：US10259005

申请日：2002-09-27

Applicant: Christopher G. Dunn ,  Nathan P. Kreutter

Inventor： Christopher G. Dunn ,  Nathan P. Kreutter

IPC: G11B548

CPC classification number: H05K1/0281 ,  G11B5/4826 ,  G11B5/484 ,  H05K1/056 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/2009

Abstract: A disk drive suspension assembly including an elongated polymeric base member having a plurality of traces formed directly on a first surface thereof and a reference voltage layer formed on a second surface thereof. A support member is formed directly on at least a portion of the reference voltage layer. The plurality of traces overlay at least a portion of the reference voltage layer. The reference voltage layer is formed from a first electrically conductive material and the support member is formed from a second electrically conductive material. The first electrically conductive material providing substantially greater electrical conductivity and substantially less tensile strength than the second electrically conductive material. The support member includes a head gimbal portion having a first thickness and a load beam portion having a second thickness. The second thickness is substantially greater than the first thickness.

Abstract translation: 一种磁盘驱动器悬架组件，其包括细长的聚合物基底构件，其具有直接形成在其第一表面上的多个迹线和在其第二表面上形成的参考电压层。 支撑构件直接形成在参考电压层的至少一部分上。 多个迹线覆盖参考电压层的至少一部分。 参考电压层由第一导电材料形成，并且支撑构件由第二导电材料形成。 第一导电材料提供比第二导电材料显着更大的导电性和显着更小的拉伸强度。 支撑构件包括具有第一厚度的头部万向节部分和具有第二厚度的负载梁部分。 第二厚度基本上大于第一厚度。

公开(公告)号：US06714384B2

公开(公告)日：2004-03-30

申请号：US09456746

申请日：1999-12-07

Applicant: Adam Karl Himes ,  Kevin Jon Schulz

Inventor： Adam Karl Himes ,  Kevin Jon Schulz

IPC: G11B548

CPC classification number: H05K1/028 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09736

Abstract: A printed circuit head interconnect of a head gimbal assembly (HGA) has different material thicknesses in different regions of the printed circuit head interconnect. The printed circuit head interconnect includes a lamination sheet of materials having dielectric materials and conductive materials. The regions which need to have a lower stiffness are made thinner than the rest of the regions. The rest of the regions are made thick and robust enough to support the HGA. A method of reducing the thicknesses of the printed circuit head interconnect includes applying a resist mask pattern having a plurality of openings with different sizes so as to obtain different thicknesses of the materials in different regions of the printed circuit head interconnect.

Abstract translation: 头万向节组件（HGA）的印刷电路头互连在印刷电路头互连的不同区域中具有不同的材料厚度。 印刷电路头互连件包括具有介电材料和导电材料的材料层压片。 需要具有较低刚度的区域比其余区域薄。 其余的区域制作得足够坚固，足以支持HGA。 减小印刷电路头互连的厚度的方法包括施加具有不同尺寸的多个开口的抗蚀剂掩模图案，以便在印刷电路头互连的不同区域中获得不同厚度的材料。

公开(公告)号：US06627091B1

公开(公告)日：2003-09-30

申请号：US09743567

申请日：2001-01-10

Applicant: Jozef Van Puymbroeck

Inventor： Jozef Van Puymbroeck

IPC: H05K306

CPC classification number: H05K1/0265 ,  H05K3/0032 ,  H05K3/0082 ,  H05K3/027 ,  H05K3/062 ,  H05K3/064 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0305 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/0505

Abstract: A method for producing printed circuit boards having coarse conductor structures and at least one region having fine conductor structures. The coarse conductor structures and the fine conductor structures are etched out of a metal layer in a common etching process. An etching resist patterned by means of photolithography is used in the region of the coarse conductor structures, and an etching resist patterned with the aid of a laser beam is used in the region of the fine conductor structures.

Abstract translation: 一种制造具有粗导体结构的印刷电路板和至少一个具有细导体结构的区域的方法。 在常见的蚀刻工艺中，粗糙导体结构和细导体结构被从金属层中蚀刻掉。 在粗导体结构的区域中使用通过光刻法图案化的抗蚀剂抗蚀剂，并且在细导体结构的区域中使用借助于激光束图案化的抗蚀剂。

公开(公告)号：US20030116831A1

公开(公告)日：2003-06-26

申请号：US10033831

申请日：2001-12-26

Inventor： James A. McCall ,  Steven M. Stahlberg ,  David N. Shykind

IPC: H01L023/495

CPC classification number: H05K1/0243 ,  H01L23/647 ,  H01L2924/15173 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/025 ,  H05K1/0293 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10734

Abstract: In some embodiments, the invention includes system comprising a circuit board including a circuit board trace. This system includes a packaged chip supported by the circuit board including, the packaged chip having a package, wherein the circuit board trace is connected to the package in a circuit board breakout region, and wherein the circuit board trace includes a fan-out trace section having an impedance Zo1, a matching region trace section having an impedance Zo2, and a package trace compensation section having an impedance Zo3, wherein an effective impedance of the matching region trace section and the package trace compensation section is approximately equal to impedance Zo1, where Zo3

Abstract translation: 在一些实施例中，本发明包括包括电路板迹线的电路板的系统。 该系统包括由电路板支撑的封装芯片，包括具有封装的封装芯片，其中电路板迹线在电路板突出区域中连接到封装，并且其中电路板迹线包括扇出迹线部分 具有阻抗Zo1，具有阻抗Zo2的匹配区域迹线部分和具有阻抗Zo3的封装迹线补偿部分，其中匹配区域迹线部分和封装迹线补偿部分的有效阻抗近似等于阻抗Zo1，其中 Zo3

公开(公告)号：US06540527B1

公开(公告)日：2003-04-01

申请号：US09561401

申请日：2000-04-28

Applicant: Vladimir K. Tamarkin

Inventor： Vladimir K. Tamarkin

IPC: H01R1200

CPC classification number: H05K3/225 ,  H01R12/62 ,  H01R12/714 ,  H01R12/721 ,  H01R31/06 ,  H05K1/0292 ,  H05K1/0393 ,  H05K1/117 ,  H05K1/141 ,  H05K3/061 ,  H05K3/108 ,  H05K3/325 ,  H05K3/365 ,  H05K3/42 ,  H05K2201/049 ,  H05K2201/09736 ,  H05K2201/10719 ,  H05K2203/175 ,  Y10S439/957

Abstract: This invention provides a method for producing an adapter for use with an LGA device. The method includes providing a flexible substrate having a conductive base layer. The method also includes forming a plurality of openings through the flexible substrate. The method further includes defining on the flexible substrate a plurality of vias extending through the openings in the flexible substrate, a plurality of conductive pads electrically connected to the vias, and a plurality of conductive paths extending between adjacent pads, wherein spaces are defined between the pads and the paths to prevent direct contact between the pads and the paths, each of the paths being connected to at least one of a plurality of peripheral pads provided on the flexible substrate. The conductive base layer substantially covers a portion of the substrate surface area. A portion of the base layer may be removed such that remaining portions form conductive branch traces used to connect selected conductive pads with selected conductive paths.

Abstract translation: 本发明提供一种用于制造用于LGA装置的适配器的方法。 该方法包括提供具有导电基底层的柔性基底。 该方法还包括通过柔性基底形成多个开口。 该方法还包括在柔性基板上限定延伸穿过柔性基板中的开口的多个通孔，电连接到通孔的多个导电焊盘以及在相邻焊盘之间延伸的多个导电路径，其中间隔限定在 垫和路径以防止垫和路径之间的直接接触，每个路径连接到设置在柔性基板上的多个外围垫中的至少一个。 导电基层基本上覆盖基板表面区域的一部分。 可以去除基底层的一部分，使得剩余部分形成用于将所选择的导电焊盘与选定的导电路径连接的导电支路迹线。