公开(公告)号：US10076040B2

公开(公告)日：2018-09-11

申请号：US15460271

申请日：2017-03-16

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORPORATION

Inventor： Yi-Feng Pu ,  Po-Yu Cheng ,  Tzu-Shu Lin

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/284 ,  H05K1/0216 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/303 ,  H05K3/4688 ,  H05K2201/0129 ,  H05K2201/09009 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2203/0285 ,  H05K2203/085 ,  H05K2203/1311 ,  H05K2203/1322

Abstract: A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.

公开(公告)号：US20170349767A1

公开(公告)日：2017-12-07

申请号：US15175303

申请日：2016-06-07

Applicant: Raytheon Company

Inventor： David R. Smith ,  Thomas M. Deppert ,  William C. Mollberg ,  Frank A. Wolf

IPC: C09D7/12 ,  C09D183/04 ,  C09D165/04 ,  C09D163/00 ,  C09D133/02 ,  C23C26/00 ,  C09D175/04 ,  C08K5/29

CPC classification number: C09D7/63 ,  C08K5/29 ,  C09D133/02 ,  C09D163/00 ,  C09D165/04 ,  C09D175/04 ,  C09D183/04 ,  C23C26/00 ,  H05K3/285 ,  H05K2201/0769 ,  H05K2201/09872 ,  H05K2203/121

Abstract: A coating for mitigating metal whiskers on a metal surface includes a polymeric coating material; and a metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential (E°) that is greater than a metal in the metal surface.

公开(公告)号：US20170245374A1

公开(公告)日：2017-08-24

申请号：US14779731

申请日：2014-03-25

Applicant: SEMBLANT LIMITED

Inventor： Elizabeth Williams-Duncan

IPC: H05K3/28 ,  H05K1/18

CPC classification number: H05K3/282 ,  H01L21/32138 ,  H01L23/552 ,  H01L23/562 ,  H01L23/564 ,  H01L2224/80007 ,  H01L2224/81007 ,  H01L2224/82007 ,  H01L2224/83007 ,  H01L2224/84007 ,  H01L2224/85007 ,  H01L2224/86007 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2203/095 ,  H05K2203/1322 ,  H05K2203/1333 ,  H05K2203/1377

Abstract: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).

公开(公告)号：US20170159178A1

公开(公告)日：2017-06-08

申请号：US15361293

申请日：2016-11-25

Applicant: HZO, Inc.

Inventor： Layton Baker ,  Yang Yun ,  Chien-Lan Hsueh

IPC: C23C16/455 ,  C23C16/40

CPC classification number: C23C16/45555 ,  B05D1/60 ,  B05D7/50 ,  C23C28/00 ,  C23C28/042 ,  C23C28/42 ,  H05K3/284 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/1322 ,  H05K2203/1476

Abstract: Described herein is a multi-layer thin film stack including a first ALD layer of a first metal oxide deposited on a substrate surface of a substrate, a first parylene layer covering the first ALD layer, and a second ALD layer of a second metal oxide covering the first parylene layer. The multi-layer thin film stack further includes a second parylene layer covering the second ALD layer.

公开(公告)号：US20170086312A1

公开(公告)日：2017-03-23

申请号：US15268373

申请日：2016-09-16

Applicant: Syed Taymur Ahmad ,  Bruce Acton

Inventor： Syed Taymur Ahmad ,  Bruce Acton

IPC: H05K5/00 ,  G06F1/16 ,  H04B1/3888 ,  H05K3/28

CPC classification number: H04B1/3888 ,  G06F1/1616 ,  G06F1/1626 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed, such as smart phones, computers, and gaming devices.

公开(公告)号：US20170086288A1

公开(公告)日：2017-03-23

申请号：US14862159

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Gong Ouyang ,  Shaowu Huang ,  Kai Xiao

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/30 ,  H01P3/08 ,  H01P11/00

CPC classification number: H01P3/081 ,  H01P3/04 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0245 ,  H05K2201/09036 ,  H05K2201/09872

Abstract: A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

公开(公告)号：US09565771B1

公开(公告)日：2017-02-07

申请号：US14794728

申请日：2015-07-08

Applicant: Brian A. Stumm ,  Eric Sari

Inventor： Brian A. Stumm ,  Eric Sari

IPC: A61N5/00 ,  H05K3/00

CPC classification number: H05K3/0091 ,  B05D3/0209 ,  B05D3/0263 ,  B05D3/067 ,  B41M7/0045 ,  H05K3/287 ,  H05K2201/09872 ,  H05K2203/0776 ,  H05K2203/111 ,  H05K2203/1545 ,  H05K2203/163

Abstract: A machine can include a conveyor that receives and conveys a circuit assembly treated with a UV curable coating material; a UV zone that includes LED-based UV radiation sources; a circuit assembly sensor; a heating zone; and a controller that controls power to at least one of the LED-based UV radiation sources based at least in part on information from the circuit assembly sensor.

Abstract translation: 机器可以包括接收和传送用UV可固化涂层材料处理的电路组件的输送机; 包括基于LED的紫外线辐射源的UV区域; 电路组件传感器; 加热区; 以及至少部分地基于来自电路组件传感器的信息来控制至少一个基于LED的UV辐射源的功率的控制器。

公开(公告)号：US20160316555A1

公开(公告)日：2016-10-27

申请号：US15138040

申请日：2016-04-25

Applicant: NHK SPRING CO., LTD.

Inventor： Yukie YAMADA

IPC: H05K1/02 ,  H05K3/02 ,  H05K3/46

CPC classification number: H05K1/028 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/60 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/09872 ,  H05K2203/0323

Abstract: Provided is a wiring thin plate capable of suppressing deterioration of an electric characteristic and variation in thickness of an aerial wiring portion while advancing reduction of rigidity of the aerial wiring portion. The wiring thin plate includes an aerial wiring portion including wiring traces and passing over an airspace, aerial base layers provided at the respective wiring traces in the aerial wiring portion and being apart from each other, and an aerial cover layer provided in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers to interspaces between adjacent aerial base layers of said aerial base layers.

Abstract translation: 提供一种能够抑制天线布线部的刚性降低的同时能够抑制电气特性的恶化和空中布线部的厚度变化的布线薄板。 布线薄板包括布线迹线和通过空域的天线布线部分，设置在天线布线部分中的各个布线迹线处并彼此分开的天线基底层，以及设置在天线布线部分中的空中覆盖层 并且跨越通过天线基层的天线布线部分的布线迹线跨越所述空中基层的相邻空中基层之间的间隙。

公开(公告)号：US20160192481A1

公开(公告)日：2016-06-30

申请号：US14698488

申请日：2015-04-28

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0373 ,  H05K1/0209 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/09872

Abstract: A method and structure are provided for implementing a conformal coating composition for high current applications. A copper particulate filler material layer is added over a standard conformal coating layer of a circuit component. The added layer aids in dispersing the heat away from the circuit component. The copper particulate filler material reacts with sulfur bearing gasses and prevents corrosive agents from reacting with the underlying component metallurgy, thus extending the product life.

公开(公告)号：US09326384B2

公开(公告)日：2016-04-26

申请号：US14227391

申请日：2014-03-27

Applicant: The United States of America Navy as represented by the Secretary of the Navy

Inventor： Nishkamraj Deshpande

IPC: H05K3/00 ,  H05K3/22 ,  H05K3/28

CPC classification number: H05K3/28 ,  H05K3/284 ,  H05K2201/0251 ,  H05K2201/0257 ,  H05K2201/0769 ,  H05K2201/09872

Abstract: The present invention relates application of conformal coatings made up of nano-fiber, nano-particle, and/or nano-capsule materials to be applied on electrical component parts in general and printed circuit boards (PCB) in particular. A conformal coating material, such as Parlyne, can be combined with nano-materials to produce desired results. Benefits of this invention include enhancement of conventional conformal coatings performance in terms of properties such as mechanical, electrical, magnetic and in particular to prevent or obstruct the growth of tin whiskers or any other manufacturing defect that can develop on the surface of a PCB.

Abstract translation: 本发明涉及将纳米纤维，纳米颗粒和/或纳米胶囊材料构成的保形涂层应用于一般的电子部件和特别是印刷电路板（PCB）上。 可将适形涂层材料（如Parlyne）与纳米材料结合以产生所需结果。 本发明的优点包括在诸如机械，电气，磁性的特性方面增强常规的保形涂层性能，特别是防止或阻碍锡晶须的生长或可能在PCB表面上发展的任何其它制造缺陷。