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111.发明授权
公开(公告)号：US5438223A
公开(公告)日：1995-08-01
申请号：US030865
申请日：1993-03-12
Applicant: Kazumi Higashi , Amane Mochizuki , Masako Maeda
Inventor： Kazumi Higashi , Amane Mochizuki , Masako Maeda
IPC: H01L23/498 , H05K3/32 , H01L23/48 , H01L29/40 , H01L29/41
CPC classification number: H05K3/321 , H01L23/49827 , H01L2224/83101 , H01L2924/01019 , H01L2924/01079 , H05K2201/0154 , H05K2201/09945 , H05K2201/10378
Abstract: An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400.degree. C. of not higher than 1.times.10.sup.8 poise is disclosed. The film is interposed between materials to be connected to provide a connection structure.
Abstract translation: 一种各向异性导电粘合剂膜，其具有在厚度方向独立地通过绝缘膜的细通孔，所述膜的前表面和后表面上的每个通孔的两个端部的至少一个端部被阻挡 公开了具有比通孔的开口部的面积大的基底面积的凸起状金属突起，其中，绝缘膜包括在400℃下的熔融粘度为1×10 8泊以下的热塑性聚酰亚胺树脂。 该膜介于待连接的材料之间以提供连接结构。
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公开(公告)号：US5174766A
公开(公告)日：1992-12-29
申请号：US810444
申请日：1991-12-19
Applicant: Tetsuo Yoshizawa , Susumu Kadokura
Inventor： Tetsuo Yoshizawa , Susumu Kadokura
CPC classification number: H01R12/714 , H05K3/321 , H01L2224/81101 , H01R13/2414 , H01R4/04 , H05K2201/0209 , H05K2201/09945 , H05K2201/10378 , H05K2201/10992 , H05K2203/135
Abstract: An electrical connecting member comprising a holder made of electrically insulative material and a plurality of conductive members electrically insulated from each other and embedded in the holder and having ends exposed from the holder, and wherein a conductive adhesive layer eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method is disposed on the end of each conductive member exposed from one surface of the holder. A conductive adhesive layers and the other ends of the conductive members exposed from the other surface of the holder are flush with or protruded from the surfaces of the holder.
Abstract translation: 一种电连接构件，包括由电绝缘材料制成的保持器和彼此电绝缘并且嵌入在保持器中并且具有从保持器露出的端部的多个导电构件，并且其中由粘合树脂溶液共晶形成的导电粘合剂层包括 通过电泳法将粉碎金属粉末和金属化陶瓷粉末中的一种或两种设置在从保持器的一个表面露出的每个导电构件的端部上。 从保持器的另一个表面露出的导电性粘合剂层和导电性构件的另一端与保持件的表面齐平或突出。
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公开(公告)号：US5087494A
公开(公告)日：1992-02-11
申请号：US684606
申请日：1991-04-12
Applicant: Clyde D. Calhoun , James G. Berg , David C. Koskenmaki , Robert M. Swinehart
Inventor： Clyde D. Calhoun , James G. Berg , David C. Koskenmaki , Robert M. Swinehart
CPC classification number: C09J7/02 , C09J7/00 , H05K3/323 , C09J2201/28 , H05K2201/09945 , H05K2203/0113 , H05K2203/0156 , H05K2203/0338 , H05K3/102 , Y10T428/14 , Y10T428/24413 , Y10T428/24843 , Y10T428/24876 , Y10T428/28 , Y10T428/2826 , Y10T428/2848 , Y10T428/2857
Abstract: An edhesive tape has a flexible carrier web that has a low-adhesion face formed with a predetermined pattern of dimples, each of which contains a plurality of electrically conductive particles that can either be loose or bound together into clusters by a binder. An adhesive layer covers said face and deposited particles and can be a pressure-sensitive adhesive or a heat-activatable adhesive. When the adhesive layer is separated from the carrier web, it carries along the particles. When the particle-bearing adhesive layer is used to bond together two arrays of electrodes, facing pairs of the electrodes are electrically interconnected either by single particles or by clusters of the particles. When a binder is used to bind the electrically conductive particles into clusters, the binder can add to the strength of the adhesive bond between the electrode-bearing surfaces.
Abstract translation: 胶带具有柔性载体网，其具有形成有预定图案的凹坑的低粘附面，每个凹坑包含可以通过粘合剂松散或粘合在一起成簇状的多个导电颗粒。 粘合剂层覆盖所述表面和沉积的颗粒，并且可以是压敏粘合剂或可热激活的粘合剂。 当粘合剂层与载体网分离时，其沿着颗粒携带。 当使用含有颗粒的粘合剂层将两个电极阵列接合在一起时，面对成对的电极通过单个颗粒或颗粒的簇电互连。 当使用粘合剂将导电颗粒结合成簇时，粘合剂可以增加电极承载表面之间的粘合剂粘合强度。
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公开(公告)号：US5059262A
公开(公告)日：1991-10-22
申请号：US515178
申请日：1990-04-26
Applicant: Clyde D. Calhoun , David C. Koskenmaki
Inventor： Clyde D. Calhoun , David C. Koskenmaki
CPC classification number: H05K3/323 , H01R4/04 , H05K2201/09945 , H05K2201/10234 , H05K2203/0338
Abstract: The present invention provides a method of making a sheet material adapted to make bonded electrical connections to an array of closely-spaced conductive terminal pads. The method comprises the steps of providing a thin, flexible, insulating substrate, and squirting a plurality of fine molten strands onto the substrate to form metal strands. The metal strands individually have a cross-section with an area of about 100 to 100,000 .mu.m.sup.2 and the cross-section having a flat section and an arcuate portion. An adhesive or conductive adhesive may be coated over the metal strands, or the adhesive may be provided on the substrate and the conductors imbedded into the adhesive by pressure or heat-sinking the conductors into the adhesive layer.
Abstract translation: 本发明提供了一种制造片材的方法，该片材适于制成与紧密间隔的导电端子焊盘阵列的结合电连接。 该方法包括以下步骤：提供薄的，柔性的，绝缘的基底，并将许多细的熔融线喷射到基底上以形成金属线。 金属股单独地具有面积为约100至100,000平方米的横截面，并且横截面具有平坦部分和弓形部分。 可以将粘合剂或导电粘合剂涂覆在金属线上，或者可以通过压力或将导体热沉入粘合剂层中将粘合剂设置在基底和嵌入粘合剂中的导体上。
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公开(公告)号：US5045249A
公开(公告)日：1991-09-03
申请号：US150485
申请日：1988-02-09
Applicant: Sungho Jin , John J. Mottine, Jr. , Robert L. Opila, Jr. , Richard C. Sherwood , Thomas H. Tiefel , William C. Vesperman
Inventor： Sungho Jin , John J. Mottine, Jr. , Robert L. Opila, Jr. , Richard C. Sherwood , Thomas H. Tiefel , William C. Vesperman
CPC classification number: H05K3/323 , H01R12/714 , H01R4/04 , H01L2224/83851 , H01L2224/83902 , H01R12/52 , H01R13/2414 , H05K2201/0314 , H05K2201/083 , H05K2201/09945 , H05K2203/104 , H05K2203/1189
Abstract: Electrical interconnections are made by means of a layer or sheet medium comprising chains of magnetically aligned, electrically conducting particles in a nonconducting matrix material. End particles of chains protrude from a surface of the medium, thereby enhancing electrical contact properties of the medium. The medium can be used for temporary as well as permanent connections; in the latter case the use of a nonconductive adhesive material is convenient for physical attachment to contacts on both sides of the medium.
Abstract translation: 电互连通过在非导电基体材料中包含磁性排列的导电颗粒链的层或片介质制成。 链的末端颗粒从介质的表面突出，从而增强介质的电接触性能。 该介质可用于临时和永久连接; 在后一种情况下，使用非导电粘合剂材料便于物理连接到介质两侧的触点。
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Patent Agency Ranking
公开(公告)号：US4715117A
公开(公告)日：1987-12-29
申请号：US839730
申请日：1986-03-14
Applicant: Eyo Enomoto
Inventor： Eyo Enomoto
IPC: H05K3/46 , H05K1/00 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/18 , H05K3/38 , H05K3/42 , H01K3/22 , H01K3/10
CPC classification number: H05K1/0306 , H05K1/0287 , H05K3/0055 , H05K2201/09581 , H05K2201/09609 , H05K2201/09945 , H05K2203/1394 , H05K3/181 , H05K3/386 , H05K3/426 , H05K3/429 , Y10T29/49163 , Y10T29/49165
Abstract: A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.
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公开(公告)号：US4631100A
公开(公告)日：1986-12-23
申请号：US671672
申请日：1984-11-15
Applicant: Peter P. Pellegrino
Inventor： Peter P. Pellegrino
CPC classification number: H05K3/46 , H05K1/0287 , H05K3/429 , H05K1/0298 , H05K2201/0376 , H05K2201/09454 , H05K2201/09718 , H05K2201/09945 , H05K2203/107 , H05K2203/175 , H05K3/06 , Y10S428/901 , Y10T29/49156 , Y10T29/49158 , Y10T428/12396
Abstract: The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain. While contact printing or image exposure systems may be used to expose the photoresist, computer controlled raster scan laser printers offer the combination of speed and versatility, as the predetermined starting matrix of the invention is highly conductive to computer aided design, and the percentage of circuit board area required for exposure is very small compared to normal copper-clad board fabrication techniques. For multilayer printed circuit boards, registration apertures are provided in each board layer for alignment purposes. Interconnects between boards are made by drilling through selective pads and plating the through holes to interconnect the various board layers. Isolation of any layer of any plated through hole may be obtained by either isolation of the pad (removal of all pad interconnects) at the through hole, or alternatively by etching a larger diameter in the pad which region will be filled with laminating adhesive during the lamination process to insulate the pad from the through hole copper plating.
Abstract translation: 本发明考虑制造具有预定图案的焊盘和互连导电路径的印刷电路板坯料，优选（但不一定）与绝缘衬底的表面齐平。 为了制造任何所需电路结构的成品电路板，印刷电路板坯体被涂覆有光致抗蚀剂并暴露，使得在显影光刻胶和根据显影图案进行蚀刻时，焊盘之间的互连导电路径将被选择性地蚀刻 使得仅保留用于所需电路图案的那些互连。 尽管接触式印刷或图像曝光系统可用于曝光光致抗蚀剂，但计算机控制的光栅扫描激光打印机提供速度和多功能性的组合，因为本发明的预定起始矩阵对于计算机辅助设计是高度导电的，并且电路的百分比 与正常的铜包覆板制造技术相比，曝光所需的板面积非常小。 对于多层印刷电路板，在每个板层中设置配准孔用于对准目的。 板之间的互连是通过选择性焊盘钻孔和电镀通孔来互连各个板层而制成的。 任何电镀通孔的任何层的隔离可以通过在通孔处隔离焊盘（去除所有焊盘互连）来获得，或者通过蚀刻焊盘中的较大直径来获得，该区域将在层压粘合剂期间填充层压粘合剂 层压工艺使焊盘与通孔镀铜绝缘。
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公开(公告)号：US4610908A
公开(公告)日：1986-09-09
申请号：US730256
申请日：1985-05-06
Applicant: Robert S. Reylek , James G. Berg
Inventor： Robert S. Reylek , James G. Berg
CPC classification number: H05K3/323 , H01R4/04 , H05K2201/09945 , H05K2201/1025 , H05K2203/1189 , H05K3/361 , Y10T428/24355 , Y10T428/24372 , Y10T428/24479 , Y10T428/24521 , Y10T428/24579 , Y10T428/24612 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24959 , Y10T428/25 , Y10T428/28 , Y10T428/2813 , Y10T428/2887 , Y10T428/2891
Abstract: Insulated sheet material useful for making bonded electrical connections, especially to sets of small side-by-side terminal pads. In one typical form, the sheet material is an elongated tape comprising an elongated insulating web; a plurality of narrow spaced parallel elongated electrically conductive stripes on the web; electrically conductive adhesive disposed over the stripes comprising a layer of adhesive material in which are dispersed a monolayer of rather thick electrically conductive particles; and a thin electrically insulating layer disposed over the conductive adhesive and which is nontacky or poorly tacky at room temperature, provides high electrical resistance throughout the layer to the conductive particles, softens to an adhesive and flowable condition upon heating to an elevated temperature, and upon cooling to room temperature assumes a firm and substantially nonflowable condition. Such a connector tape is readily handleable and free from conductive bonding at room temperature but when laid over a set of adjacent spaced terminal pads with the electrically conductive stripes in registry with the pads, and pressed and heated, the conductive particles penetrate through the insulating layer to make electrical connection to the pads.
Abstract translation: 用于制造粘结电连接的绝缘片材料，特别是小型并排端子焊盘的组合。 在一种典型形式中，片材是包括细长绝缘网的细长带; 在幅材上的多个窄间隔的平行细长的导电条纹; 布置在条纹之上的导电粘合剂包括一层粘合剂材料，其中分散有相当厚的导电颗粒的单层; 以及设置在导电粘合剂上并且在室温下不粘或不良粘性的薄的电绝缘层，在整个层向导电颗粒提供高电阻，在加热到高温时软化到粘合剂和可流动状态，并且在 冷却至室温呈现稳固且基本上不可流动的状态。 这种连接器带易于处理并且在室温下没有导电接合，但是当放置在一组相邻间隔的端子焊盘上，导电条与焊盘对准并被加压和加热时，导电颗粒穿过绝缘层 以使电连接到焊盘。
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公开(公告)号：US4524239A
公开(公告)日：1985-06-18
申请号：US413456
申请日：1982-08-31
Applicant: Francois Rouge
Inventor： Francois Rouge
CPC classification number: H05K1/0287 , H05K1/0298 , H05K2201/09609 , H05K2201/09945 , H05K3/429
Abstract: A multi-layer blank for an electrical circuit board has at least one internal layer, which may constitute a common power supply or ground plane. The inner layer consists of an electrically conductive network extending throughout the area of the inner layer and formed by the repetition of an elementary predetermined pattern in two orthogonal directions. The elementary pattern has such a shape that adjacent patterns are in electrical contact so that the network is equipotential. The pattern is also of such a shape that there is formed a first regular grid of predetermined pitch p whose nodes constitute insulated sites and a second grid off-set by p/2 from the first grid in at least one of the orthogonal directions. The second grid has the same pitch p as the first one and has nodes one at least of which per elementary pattern is insulated while the other ones belong to the conducting network.
Abstract translation: 用于电路板的多层坯体具有至少一个内部层，其可以构成公共电源或接地平面。 内层由在内层的整个区域延伸并通过沿两个正交方向重复基本预定图案形成的导电网络组成。 基本图案具有相邻图案电接触的形状，使得网络是等电位的。 该图案也具有这样一种形状，其中形成有节点构成绝缘位置的预定间距p的第一规则网格，并且在至少一个正交方向上形成由第一格栅从p / 2偏移的第二栅格。 第二格栅具有与第一栅格相同的间距p，并且具有至少每个基本图案绝缘的节点，而另一个网格属于导电网络。
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公开(公告)号：US4521262A
公开(公告)日：1985-06-04
申请号：US439333
申请日：1983-01-10
Applicant: Peter P. Pellegrino
Inventor： Peter P. Pellegrino
CPC classification number: H05K3/429 , H05K1/0287 , H05K1/029 , H05K1/116 , H05K1/0298 , H05K2201/0376 , H05K2201/09454 , H05K2201/09718 , H05K2201/09945 , H05K2203/107 , H05K2203/175 , H05K3/06 , Y10T29/49165
Abstract: The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain. While contact printing or image exposure systems may be used to expose the photoresist, computer controlled raster scan laser printers offer the combination of speed and versatility, as the predetermined starting matrix of the invention is highly conducive to computer aided design, and the percentage of circuit board area required for exposure is very small compared to normal copper-clad board fabrication techniques. For multilayer printed circuit boards, registration apertures are provided in each board layer for alignment purposes. Interconnects between boards are made by drilling through selective pads and plating the through holes to interconnect the various board layers. Isolation of any layer of any plated through hole may be obtained by either isolation of the pad (removal of all pad interconnects) at the through hole, or alternatively by etching a larger diameter in the pad which region will be filled with laminating adhesive during the lamination process to insulate the pad from the through hole copper plating.
Abstract translation: 本发明考虑制造具有预定图案的焊盘和互连导电路径的印刷电路板坯料，优选（但不一定）与绝缘衬底的表面齐平。 为了制造任何所需电路结构的成品电路板，印刷电路板坯体被涂覆有光致抗蚀剂并暴露，使得在显影光刻胶和根据显影图案进行蚀刻时，焊盘之间的互连导电路径将被选择性地蚀刻 使得仅保留用于所需电路图案的那些互连。 虽然接触式印刷或图像曝光系统可用于曝光光致抗蚀剂，但是由于本发明的预定起始矩阵高度有利于计算机辅助设计，所以计算机控制的光栅扫描激光打印机提供了速度和多功能性的组合，并且电路的百分比 与正常的铜包覆板制造技术相比，曝光所需的板面积非常小。 对于多层印刷电路板，在每个板层中设置配准孔用于对准目的。 板之间的互连是通过选择性焊盘钻孔和电镀通孔来互连各个板层而制成的。 任何电镀通孔的任何层的隔离可以通过在通孔处隔离焊盘（去除所有焊盘互连）来获得，或者通过蚀刻焊盘中的较大直径来获得，该区域将在层压粘合剂期间填充层压粘合剂 层压工艺使焊盘与通孔镀铜绝缘。
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