公开(公告)号：US20050087588A1

公开(公告)日：2005-04-28

申请号：US10695187

申请日：2003-10-28

Applicant: William Weigler ,  Robert Babula ,  James Herbold ,  Thomas Gall ,  Steven Sharkey

Inventor： William Weigler ,  Robert Babula ,  James Herbold ,  Thomas Gall ,  Steven Sharkey

IPC: B23K1/018 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/3457 ,  B23K1/018 ,  B23K2101/42 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0101 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/42 ,  H05K2201/10204 ,  H05K2203/046 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

Abstract translation: 用于从电路基板垂直去除多余焊料的方法包括使用具有可焊接润湿的多个焊盘和通孔的牺牲电路基板。 牺牲电路衬底的焊盘和通孔被放置成垂直靠近电路衬底的多余焊料。 多余的焊料被加热直到它是液体，其中多余的焊料被垂直地焊接到焊盘上并进入牺牲电路衬底的通孔中。 此后，牺牲电路基板从电路基板的附近被提起，同时焊料处于液体中，取出多余的焊料，但在电路基板上留下预定的量。

公开(公告)号：US20040245996A1

公开(公告)日：2004-12-09

申请号：US10453595

申请日：2003-06-04

Inventor： Andrew H. Barr ,  Ken G. Pomaranski ,  Dale J. Shidla

IPC: G01R031/08

CPC classification number: H05K1/0268 ,  G01R27/205 ,  G01R31/046 ,  G01R31/31715 ,  H05K2201/10204 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: An apparatus and a method for detecting high impedance failures in system interconnects. The apparatus and method may measure resistance of a connection of one or more representative sets of pins on a partitioned chip to a circuit board and determine if the measured resistance of each of the one or more representative sets of pins is less than a threshold value. The measuring step is executed while the circuit board is operating.

Abstract translation: 用于检测系统互连中的高阻抗故障的装置和方法。 该装置和方法可以测量分隔芯片上的一个或多个代表性的引脚组与电路板的连接的电阻，并且确定一个或多个代表性引脚组中的每一个的测量电阻是否小于阈值。 测量步骤在电路板工作时执行。

公开(公告)号：US06665736B1

公开(公告)日：2003-12-16

申请号：US09624436

申请日：2000-07-21

Applicant: Chen-Ming Fan

Inventor： Chen-Ming Fan

IPC: G06F300

CPC classification number: G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  G06F13/409 ,  H05K1/023 ,  H05K1/0262 ,  H05K1/0286 ,  H05K1/14 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10204

Abstract: A computer motherboard selectively uses various memories in the light of a dummy card. The computer motherboard comprises a serial resistor, and a first slot and a second slot for holding various memories, respectively. Various memories can be configured on the motherboard without additional settings by means of predefined dummy card or/and rearranging the location of the serial resistor.

Abstract translation: 计算机主板根据虚拟卡选择性地使用各种存储器。 计算机主板分别包括串联电阻器和用于保持各种存储器的第一时隙和第二时隙。 可以在主板上配置各种存储器，而无需通过预定义的虚拟卡进行额外的设置或/或重新排列串行电阻的位置。

公开(公告)号：US20030061709A1

公开(公告)日：2003-04-03

申请号：US09964747

申请日：2001-09-28

Inventor： Tom E. Pearson ,  George Arrigotti ,  Christopher D. Combs ,  Raiyomand F. Aspandiar

IPC: H05K003/36 ,  B23P019/00

CPC classification number: H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract translation: 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US20020113330A1

公开(公告)日：2002-08-22

申请号：US10026337

申请日：2001-12-20

Inventor： Jesse L. Pedigo

IPC: B29B017/00 ,  B29C037/00

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.

Abstract translation: 一种包括扫气叶片，印刷线路板接收部分和适于相对于彼此移动扫气叶片和印刷线路板接收部分的移动机构的系统，以及一种去除多余填充材料的方法，包括提供印刷线路板 在印刷电路板的表面上填充孔和至少一些多余的填充材料，提供包括清扫刀片的系统，将印刷线路板定位在系统中，并且使扫气刀片穿过至少一部分印刷 布线板以使清扫刀片从印刷线路板去除多余的填充材料的至少一部分的方式。

公开(公告)号：US20020084305A1

公开(公告)日：2002-07-04

申请号：US10026338

申请日：2001-12-20

Inventor： Jesse L. Pedigo

IPC: B23K005/22 ,  B23K001/08 ,  B23K037/06

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.

Abstract translation: 一种包括扫气叶片，印刷线路板接收部分和适于相对于彼此移动扫气叶片和印刷线路板接收部分的移动机构的系统，以及一种去除多余填充材料的方法，包括提供印刷线路板 在印刷电路板的表面上填充孔和至少一些多余的填充材料，提供包括清扫刀片的系统，将印刷线路板定位在系统中，并且使扫气刀片穿过至少一部分印刷 布线板以使清扫刀片从印刷线路板去除多余的填充材料的至少一部分的方式。

公开(公告)号：US6045368A

公开(公告)日：2000-04-04

申请号：US88010

申请日：1998-06-01

Applicant: Jonathan Cadenhead ,  Terry Richard Fleegle ,  Michael Carlos Menard

Inventor： Jonathan Cadenhead ,  Terry Richard Fleegle ,  Michael Carlos Menard

IPC: H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R12/62 ,  H05K3/363 ,  H05K2201/10204 ,  H05K2201/10242 ,  H05K2203/167 ,  H05K3/341 ,  H05K3/4015 ,  Y10S439/931 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: An electrical circuit includes a substrate having at least two alignment pads on the substrate that are accurately aligned with a first set of electrical interconnect pads, and also includes a corresponding number of alignment posts that are cylindrical and have flat bases that are geometrically similar to and smaller than a corresponding shape of each of the at least two alignment pads by a predetermined solder fillet radius. Each of the at least two alignment posts is reflow soldered to one of the at least two alignment pads. An electrical part can be accurately aligned to the substrate using the alignment posts, during attachment of the electrical part.

Abstract translation: 电路包括具有至少两个对准焊盘的衬底，衬底上的至少两个对准焊盘与第一组电互连衬垫精确对准，并且还包括相应数量的对准柱，其为圆柱形并且具有几何等同于 小于所述至少两个对准焊盘中的每一个的相应形状，并通过预定的焊料圆角半径。 所述至少两个对准柱中的每一个被回流焊接到所述至少两个对准焊盘中的一个。 在电气部件的附接期间，可以使用对准柱将电气部件精确地对准到基板。

公开(公告)号：US5460680A

公开(公告)日：1995-10-24

申请号：US183920

申请日：1994-01-19

Applicant: Shoji Yamaguchi ,  Akira Yamada ,  Yasuo Furuhashi ,  Fumiaki Baba

Inventor： Shoji Yamaguchi ,  Akira Yamada ,  Yasuo Furuhashi ,  Fumiaki Baba

IPC: H05K3/38 ,  B29C33/68 ,  B29C37/00 ,  H05K1/18 ,  H05K3/46 ,  B32B31/04 ,  B32B31/20

CPC classification number: B29C37/005 ,  B32B37/0023 ,  B32B37/04 ,  B32B37/1284 ,  B32B37/26 ,  H05K3/4697 ,  B29C33/68 ,  B29L2031/3425 ,  B32B2457/08 ,  H05K1/183 ,  H05K2201/0129 ,  H05K2201/10204 ,  H05K2203/063 ,  H05K2203/1147 ,  Y10T156/16

Abstract: A method for producing multi-layer printed board. The method includes heating a hole board as a top layer, an adhesive sheet, and a bottom layer board. The adhesive sheet includes a mold release sheet and a thermoplastic resin sheet which begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

Abstract translation: 一种多层印刷电路板的制造方法。 该方法包括加热作为顶层的孔板，粘合片和底层板。 粘合片包括脱模片和在低于粘合剂的熔融温度的温度下开始软化的热塑性树脂片。 当热塑性树脂片材冷却时，收缩控制构件控制收缩。

公开(公告)号：US5164916A

公开(公告)日：1992-11-17

申请号：US861276

申请日：1992-03-31

Applicant: Andrew L. Wu ,  Derrick D. DaCosta ,  Stephen R. Coe ,  Donald C. Pierce ,  E. William Bruce, II

Inventor： Andrew L. Wu ,  Derrick D. DaCosta ,  Stephen R. Coe ,  Donald C. Pierce ,  E. William Bruce, II

IPC: G11C5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/181 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10204 ,  H05K2203/1572 ,  H05K3/30 ,  H05K3/366

Abstract: A high-density memory module has thirty-two memory integrated circuit chips, sixteen decoupling capacitors, and two resistors mounted on a double-sided multi-layer printed wiring board having a series of edge terminals for connection to a motherboard. One side of the board has a first 2.times.8 rectangular matrix of the chips, and the other side of the board has a second 2.times.8 matrix of the chips. The chips are grouped into four "strings," each of which includes eight chips which receive the same row address strobe and column address strobe. Each string is selected by a unique row address strobe. All four strings share a common data bus. Two of the strings share a first column address strobe and a first address bus, and the other two strings share a second column address strobe and a second address bus, to facilitate four-way interleaved memory access. Address, data, power, and ground terminals are distributed and dispersed along the series of edge terminals, but terminals for one address bus is disposed between a first half and a second half of the terminals for the other address bus. One of the two resistors is used for indicating the type of the memory chips in the memory module, and the other resistor is interconnected with similar resistors in other memory modules on the motherboard to provide a combined resistance indicating the number of memory modules on the motherboard.

Abstract translation: 高密度存储器模块具有32个存储器集成电路芯片，16个去耦电容器和安装在双面多层印刷电路板上的两个电阻器，其具有用于连接到母板的一系列边缘端子。 板的一侧具有芯片的第一个2x8矩形矩阵，并且板的另一侧具有芯片的第二个2x8矩阵。 这些芯片被分成四个“串”，每个“串”包括八个芯片，其接收相同的行地址选通和列地址选通。 每个字符串由唯一的行地址选通选择。 所有四个串共享一个公共数据总线。 两个串共享第一列地址选通和第一地址总线，另外两个字符串共享第二列地址选通和第二地址总线，以便于四路交错存储器访问。 地址，数据，电源和接地端子沿着一系列边缘端子分布和分散，但是用于一个地址总线的端子设置在用于另一地址总线的端子的前半部分和后半部分之间。 两个电阻器中的一个用于指示存储器模块中的存储器芯片的类型，另一个电阻器与主板上的其他存储器模块中的类似电阻器互连，以提供指示主板上的存储器模块数量的组合电阻 。

公开(公告)号：US4941067A

公开(公告)日：1990-07-10

申请号：US334409

申请日：1989-04-07

Applicant: Scott Craft

Inventor： Scott Craft

IPC: H01L23/36 ,  H01L23/373 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3731 ,  H05K7/20 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611

Abstract: Electrically insulating but thermally conductive "heat shunt" components are attached to PC boards along with regular electronic components to improve heat dissipation. The heat shunts are typically a small bar of thermally conductive ceramic with spaced-apart metal mounting pads on the ends for soldering to the PC board. Their shape is similar to standard electronic components for placement by automatic machinery and they extend, for example, from a transistor collector contact pad on the PC board to an adjacent ground lead having holes plated through to the metal back plane of the PC board in contact with the heat sink.