公开(公告)号：US20130178078A1

公开(公告)日：2013-07-11

申请号：US13823555

申请日：2012-01-17

Applicant: Makoto Hattori ,  Masahiko Asai ,  Kazuki Niwa ,  Hiroyuki Kamitani ,  Takashi Hattori

Inventor： Makoto Hattori ,  Masahiko Asai ,  Kazuki Niwa ,  Hiroyuki Kamitani ,  Takashi Hattori

IPC: H01R13/11 ,  H02K5/22

CPC classification number: H01R13/11 ,  F04B35/04 ,  H01R12/52 ,  H01R12/58 ,  H01R12/7052 ,  H01R13/405 ,  H02K5/22 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10424

Abstract: Provided are an inter-board connection terminal with which electrical connection between two boards can be simplified, the operability and productivity thereof can be enhanced, and reliability of electrical connection can also be ensured, as well as an inverter and an electric compressor employing the same. An inter-board connection terminal includes a group of numerous metal terminals which is inserted, individually at both tips thereof, into through-holes in boards to electrically connect two boards, wherein paired resin linking members are provided, which have a predetermined space therebetween with respect to the group of metal terminals and which join the group of metal terminals into a single unit by linking the terminals in the form of a row at both tips thereof near the bases of portions to be inserted into the through-holes in the boards.

Abstract translation: 提供了一种能够简化两个电路板之间的电连接的板间连接端子，可以提高其可操作性和生产率，并且还可以确保电连接的可靠性，以及逆变器和采用该连接端子的电动压缩机 。 板间连接端子包括一组多个金属端子，它们在其两个端部分别插入到板中的通孔中以电连接两个板，其中设置成对的树脂连接构件，其间具有预定的间隔， 相对于金属端子组，并且通过将插入到板中的通孔的部分的基部附近的两个端部的排列形式的端子连接在一起而将金属端子组连接成单个单元。

公开(公告)号：US20130149897A1

公开(公告)日：2013-06-13

申请号：US13614634

申请日：2012-09-13

Applicant: Tomohito TAKANO ,  Akio FUNAHASHI

Inventor： Tomohito TAKANO ,  Akio FUNAHASHI

IPC: H01R9/05

CPC classification number: H01R12/718 ,  H01R12/585 ,  H01R13/052 ,  H01R24/50 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1031 ,  H05K2201/10356 ,  H05K2201/1059 ,  Y02P70/611

Abstract: An electrical coaxial connector comprising a signal contact member having a connecting terminal portion and a resilient engaging portion, a grounding contact member having an annular engaging portion for engaging with a mating connector fixed on a circuit board and a shell portion extending from the annular engaging portion, and a housing for supporting the signal contact member and the grounding contact member, wherein the resilient engaging portion is positioned at the inside of the annular engaging portion, the connecting terminal portion is put in electrical connection with a core conductor of a coaxial cable at the outside of the annular engaging portion, and the resilient engaging portion extends from the connecting terminal portion through the mating connector to engage with a signal terminal provided on the circuit board to which the mating connector is fixed.

Abstract translation: 一种电气同轴连接器，包括具有连接端子部分和弹性接合部分的信号接触部件，接地触头部件具有用于与固定在电路板上的匹配连接器接合的环形接合部分和从环形接合部分延伸的壳体部分 以及用于支撑信号接触构件和接地接触构件的壳体，其中弹性接合部分位于环形接合部分的内侧，连接端子部分与同轴电缆的芯导体电连接 环形接合部分的外部，弹性接合部分通过配合连接器从连接端子部分延伸，以与配置连接器固定在电路板上的信号端接合。

公开(公告)号：US08403684B2

公开(公告)日：2013-03-26

申请号：US13131047

申请日：2009-12-17

Applicant: Norikazu Tateishi ,  Masaru Kibi

Inventor： Norikazu Tateishi ,  Masaru Kibi

IPC: H01R12/00

CPC classification number: H01R13/03 ,  H01R12/58 ,  H01R13/2421 ,  H05K3/247 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10856 ,  H05K2203/044

Abstract: A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.

Abstract translation: 通过在连接器端子1接触的基板4的电极6上以含铅无铅锡为主要成分的焊料进行热浸镀，形成镀锡表面7。

公开(公告)号：US08363420B2

公开(公告)日：2013-01-29

申请号：US11755074

申请日：2007-05-30

Applicant: Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

Inventor： Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

IPC: H01R9/00

CPC classification number: H05K7/20509 ,  H05K3/308 ,  H05K3/32 ,  H05K3/328 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.

Abstract translation: 该装置包括壳体，布置在壳体中的散热器，安装在散热器上并具有端子的半导体开关元件，布置成与散热器相对的电路板，并且具有形成在其上的电子电路，包括控制电路， 半导体开关元件和将电路板和半导体开关元件彼此电连接的多个导电板。 各个导电板沿着半导体开关元件的各个端子引出的引出方向布置，从而它们被结合到各个端子。

公开(公告)号：US20130006340A1

公开(公告)日：2013-01-03

申请号：US13610653

申请日：2012-09-11

Applicant: Robert J. Greenberg ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Jerry Ok

IPC: A61N1/375

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到 某些非目标人士。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20120145436A1

公开(公告)日：2012-06-14

申请号：US13209062

申请日：2011-08-12

Applicant: Yukinori KITA

Inventor： Yukinori KITA

IPC: H05K1/00

CPC classification number: H05K3/306 ,  H01R43/0256 ,  H05K3/02 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10757 ,  H05K2201/10818

Abstract: A packaging board of the type having board terminals soldered on a printed board and including an insulation support member made of a resin disposed on a printed board having tubular support portions configured to receive board terminals, visual recognition windows configured for visually recognizing soldering portions of the board terminals inserted into the printed board through the windows, and engaging portions that engage the board terminals and define insertion amounts of the board terminals.

Abstract translation: 一种具有板端子的封装板，其焊接在印刷电路板上，并且包括由设置在印刷电路板上的树脂构成的绝缘支撑部件，所述绝缘支撑部件设置在具有用于容纳电路板端子的管状支撑部分的印刷电路板上， 板端子通过窗口插入印刷电路板，以及接合部分，其接合电路板端子并限定电路板端子的插入量。

公开(公告)号：US20120131794A1

公开(公告)日：2012-05-31

申请号：US13351899

申请日：2012-01-17

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: H05K3/10

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20120003847A1

公开(公告)日：2012-01-05

申请号：US12888594

申请日：2010-09-23

Applicant: Lee A. Johnson ,  Michael J. Zurn ,  Jon T. Jacobson ,  Dale A. Janssen

Inventor： Lee A. Johnson ,  Michael J. Zurn ,  Jon T. Jacobson ,  Dale A. Janssen

IPC: H01R12/70 ,  H01R9/22

CPC classification number: H05K3/368 ,  H01R12/523 ,  H01R12/585 ,  H01R12/73 ,  H01R13/41 ,  H01R24/50 ,  H01R24/86 ,  H01R31/06 ,  H01R2107/00 ,  H05K1/0271 ,  H05K3/308 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10409

Abstract: A connector comprises a generally cylindrical dielectric body with a central bore in the dielectric body. The dielectric body has a first end and second end opposite the first end. Conductors extend axially through the cylindrical dielectric body and are spaced apart from each other in a generally circular or elliptical arrangement. Each conductor comprises an embedded portion in the dielectric body and mating portions extending from the first end and the second end.

Abstract translation: 连接器包括具有介电体中的中心孔的大致圆柱形的电介质体。 介电体具有与第一端相对的第一端和第二端。 导体轴向延伸穿过圆柱形电介质体并以大致圆形或椭圆形排列彼此间隔开。 每个导体包括介电体中的嵌入部分和从第一端和第二端延伸的配合部分。

公开(公告)号：US08064191B2

公开(公告)日：2011-11-22

申请号：US12280692

申请日：2007-03-13

Applicant: Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

Inventor： Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

IPC: H01G2/20 ,  H01G5/38 ,  H05K7/18

CPC classification number: H01G2/06 ,  H01G2/106 ,  H01G2/12 ,  H01G9/008 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10962 ,  H05K2203/1361

Abstract: According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.

Abstract translation: 根据在电容器连接引脚沿垂直方向焊接到电路基板之后，在电路基板的两面上形成防潮剂的结构和制造方法，并且将电容器电连接到与 在电路基板的上部空间处的电容器连接针的长度方向，与电容器连接的防潮剂的可能性被消除，由于可以容易地在电路基板的两个表面上形成防潮剂，因此提高了生产率 并且由于电容器相对于电路基板在上部空间中沿水平方向安装，所以实现了小型化和低高度配置的电容器单元。

公开(公告)号：US20110235348A1

公开(公告)日：2011-09-29

申请号：US13131047

申请日：2009-12-17

Applicant: Norikazu Tateishi ,  Masaru Kibi

Inventor： Norikazu Tateishi ,  Masaru Kibi

IPC: B60Q1/00 ,  H05K1/02

CPC classification number: H01R13/03 ,  H01R12/58 ,  H01R13/2421 ,  H05K3/247 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10856 ,  H05K2203/044

Abstract: A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.

Abstract translation: 通过在连接器端子1接触的基板4的电极6上以含铅无铅锡为主要成分的焊料进行热浸镀，形成镀锡表面7。