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    Surface mount connector for electrically isolating two insulated conductors
    111.
    发明授权
    Surface mount connector for electrically isolating two insulated conductors 有权
    用于电绝缘两个绝缘导体的表面贴装连接器

    公开(公告)号：US09270039B2

    公开(公告)日：2016-02-23

    申请号：US14012510

    申请日：2013-08-28

    Applicant: Zierick Manufacturing Corporation

    Inventor： Daniel Rice

    IPC: H01R4/20 ,  H01R11/16 ,  H01R12/71 ,  H05K3/30 ,  H01R4/24 ,  H01R12/57 ,  H05K3/32

    CPC classification number: H01R11/16 ,  H01R4/242 ,  H01R12/57 ,  H01R12/712 ,  H05K3/30 ,  H05K3/32 ,  H05K2201/1031 ,  H05K2201/10356 ,  H05K2201/10962 ,  Y02P70/611 ,  Y10T29/5327

    Abstract: A surface mount connector includes a pair of electrical contacts spaced from each other a predetermined distance. Each contact includes a substantially flat base portion having upper and lower surfaces, the lower surface being suitable for soldering to a pad or land on a printed circuit board (PCB). Each contact is provided with an integrally-formed conductor-engaging portion extending from a base portion in a direction substantially normal to the base portion. Electrically non-conductive tape is secured to the upper surfaces of the spaced base portions for maintaining the contacts spaced at a set or predetermined distance from each other. The contacts each including member for physically and electrically engaging another insulated conductor so that the connector can physically and electrically engage and secure two separate insulated or clad conductors while maintaining them electrically isolated.

    Abstract translation: 表面安装连接器包括彼此隔开预定距离的一对电触头。 每个触点包括具有上表面和下表面的基本平坦的基部，下表面适于焊接到印刷电路板（PCB）上的焊盘或焊盘。 每个接触件设置有一个整体形成的导体接合部分，其基本上垂直于基部的方向从基部延伸。 电绝缘带被固定到间隔开的基部的上表面，用于保持触点间隔彼此设定或预定的距​​离。 每个接触件包括用于物理和电接合另一绝缘导体的构件，使得连接器可以物理地和电接合并固定两个单独的绝缘或包层导体，同时保持它们电隔离。

    Surface mount zipcord connector and method of making electrical contact with zipcord conductors
    112.
    发明授权
    Surface mount zipcord connector and method of making electrical contact with zipcord conductors 有权
    表面安装拉链连接器和与拉链导体电接触的方法

    公开(公告)号：US09246247B2

    公开(公告)日：2016-01-26

    申请号：US14012562

    申请日：2013-08-28

    Applicant: Zierick Manufacturing Corporation

    Inventor： Daniel Rice

    IPC: H01R12/00 ,  H01R11/16 ,  H01R12/71 ,  H05K3/30 ,  H01R4/24 ,  H01R12/57 ,  H05K3/32

    CPC classification number: H01R11/16 ,  H01R4/242 ,  H01R12/57 ,  H01R12/712 ,  H05K3/30 ,  H05K3/32 ,  H05K2201/1031 ,  H05K2201/10356 ,  H05K2201/10962 ,  Y02P70/611 ,  Y10T29/5327

    Abstract: A surface mount connector includes one or two spaced conductive contacts. Each conductive contact(s) include a substantially flat base portion suitable for soldering to a pad or land on a printed circuit board (PCB), At least one vertical finger extends substantially normally from each flat base portion and each terminates in a point or hook formed with a piercing tip at the free end thereof remote from the that base portion. The vertical finger(s) and flat base portion(s) define a space for receiving an insulated conductor arranged in a plane substantially parallel to the plane of the flat base portion(s). The finger(s) are directed inwardly at their free end(s) proximate to the piercing tip(s) and configured to deflect inwardly in a curling action when forced downwardly and crimped to pierce an associated insulated conductor positioned on the flat base portion(s).

    Abstract translation: 表面安装连接器包括一个或两个间隔开的导电触点。 每个导电接触件包括适于焊接到印刷电路板（PCB）上的焊盘或焊盘的基本上平坦的基部部分。至少一个垂直指状物从每个平坦的基部基本上大致正常地延伸，并且每个终止于点或钩 在其远离该基部的自由端处形成有穿刺尖端。 垂直指状物和平坦的基底部分限定了用于接收布置在基本上平行于平坦的基底部分的平面的平面中的绝缘导体的空间。 手指向内指向其靠近穿刺尖端的自由端，并且被配置为当被向下并卷曲以卷曲位于平坦基部上的相关联的绝缘导体时在卷曲动作中向内偏转（ s）。

    Connecting contact
    116.
    发明授权
    Connecting contact 有权
    连接联系人

    公开(公告)号：US09065234B2

    公开(公告)日：2015-06-23

    申请号：US13808429

    申请日：2011-06-29

    Applicant: Dieter Holste ,  Ulrich Rosemeyer

    Inventor： Dieter Holste ,  Ulrich Rosemeyer

    IPC: H01L23/495 ,  H01R43/16 ,  H05K3/34 ,  H01B1/02

    CPC classification number: H01R43/16 ,  H01B1/02 ,  H01L23/49555 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49204 ,  H01L2924/00

    Abstract: A connecting contact for SM D-components includes a metal material and the metal material at least partially comprises a coating with a different metal material. The connecting contact has a substantially laminar contact area for solderable contact to a board and comprises edge regions. At least one segment of the edge region is at a distance from the laminar contact area, so that a soldered fillet is formed for a soldered contact to a board. Also, a method for producing connecting contacts for SM D-components for solderably contacting a board includes the steps of punching metal strips, bending the metal strips so that a conducting region and a laminar contact area are produced, and forming the edge areas at the laminar contact area. At least one segment of the edge area is at a distance from the laminar contact area.

    Abstract translation: 用于SM D组件的连接接头包括金属材料，金属材料至少部分地包括具有不同金属材料的涂层。 连接接触件具有大体上的层状接触区域，用于与板的可焊接触，并且包括边缘区域。 边缘区域的至少一个区段距离层状接触区域一定距离，从而形成焊接的焊脚，以将焊接的触点形成到板上。 另外，用于制造用于可焊接板的SMD部件的连接接点的方法包括以下步骤：冲压金属条，弯曲金属条，使得产生导电区域和层状接触区域，并且形成边缘区域 层状接触面积。 边缘区域的至少一个区段距离层状接触区域一定距离。

    MULTILAYER CERAMIC CAPACITOR AND MOUNTING CIRCUIT BOARD THEREFOR
    117.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND MOUNTING CIRCUIT BOARD THEREFOR 有权
    多层陶瓷电容器及其安装电路板

    公开(公告)号：US20150014038A1

    公开(公告)日：2015-01-15

    申请号：US14067904

    申请日：2013-10-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Soo PARK ,  Heung Kil PARK

    IPC: H01G2/06 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G2/065 ,  H01G4/005 ,  H01G4/248 ,  H01G4/252 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1031 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes disposed to face each other within a ceramic body, and having respective lead portions exposed to an upper surface of the ceramic body; first and second external electrodes formed on the upper surface of the ceramic body and connected to the lead portions, respectively; and first and second terminal frames each including a vertical portion facing end surfaces of the ceramic body and upper and lower horizontal portions facing upper and lower surfaces of the ceramic body, respectively, wherein the upper horizontal portions are connected to the first and second external electrodes, respectively, and adhesive layers are provided between the upper horizontal portions and the first and second external electrodes, respectively.

    Abstract translation: 提供了一种多层陶瓷电容器，包括：陶瓷体; 第一和第二内部电极，其设置成在陶瓷体内彼此面对，并且具有暴露于陶瓷体的上表面的各自的引线部分; 第一外部电极和第二外部电极分别形成在陶瓷体的上表面上，并分别连接到引线部分; 以及分别包括面对陶瓷体的端面的垂直部分和面向陶瓷体的上表面和下表面的上下水平部分的第一和第二端子框架，其中上部水平部分连接到第一和第二外部电极 并且分别在上部水平部分和第一和第二外部电极之间设置粘合剂层。

    Electrical connector
    119.
    发明授权
    Electrical connector 有权
    电连接器

    公开(公告)号：US08794981B1

    公开(公告)日：2014-08-05

    申请号：US14104294

    申请日：2013-12-12

    Applicant: Google Inc.

    Inventor： Adam Rodriguez ,  Aaron Leiba ,  Jeffrey Hayashida

    IPC: H01R12/00

    CPC classification number: H01R43/24 ,  H01R9/032 ,  H01R13/405 ,  H01R13/6658 ,  H01R24/60 ,  H01R2107/00 ,  H05K1/117 ,  H05K2201/1031 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y02P70/611

    Abstract: An electrical connector may include a printed circuit board (PCB), the PCB including a plurality of contacts, a plurality of wires coupled to the plurality of contacts on the PCB, a non-conductive pad extending across the PCB, a plurality of pins extending across the non-conductive pad, and an overmold. The plurality of pins may be coupled to the plurality of contacts. The overmold may cover at least a portion of the PCB and at least a first portion of each of the plurality of pins. The overmold may include a first aperture exposing at least a second portion of each of the plurality of pins.

    Abstract translation: 电连接器可以包括印刷电路板（PCB），PCB包括多个触点，耦合到PCB上的多个触点的多个导线，跨越PCB延伸的非导电焊盘，多个引脚延伸 穿过非导电垫，以及包覆模制。 多个销可以联接到多个触点。 包覆模制可以覆盖PCB的至少一部分和多个销中的每一个的至少第一部分。 包覆模制可以包括暴露多个销中的每一个的至少第二部分的第一孔。

    Method for Producing a Semiconductor Module Arrangement
    120.
    发明申请
    Method for Producing a Semiconductor Module Arrangement 有权
    生产半导体模块布置的方法

    公开(公告)号：US20140206151A1

    公开(公告)日：2014-07-24

    申请号：US14161022

    申请日：2014-01-22

    Applicant: Infineon Technologies AG

    Inventor： Patrick Jones

    IPC: H01L23/00

    CPC classification number: H01L24/83 ,  H01L23/3735 ,  H01L25/165 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/10424 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.

    Abstract translation: 一种制造半导体模块装置的方法包括提供半导体模块和印刷电路板。 半导体模块具有安装有半导体芯片的电路座，相对于电路座的第一相对位置的调节装置，以及各自具有自由端的多个电连接。 每个连接通过调节装置中的不同通道开口。 印刷电路板通过插入到印刷电路板中的不同接触开口中的每个自由端被推到电连接上。 调节装置相对于电路支架移动到与第一相对位置不同的第二相对位置。

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