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111.发明申请Electronic board assembly including two elementary boards each carrying connectors on an edge thereof 失效电子板组件包括两个基本板，每个基板在其边缘上承载连接器公开(公告)号：US20020071260A1
公开(公告)日：2002-06-13
申请号：US10016445
申请日：2001-12-10
Applicant: International Business Machines Corporation
Inventor： Bruno Centola , Claude Gomez , Christian Ouazana
IPC: H01R012/16 , H05K001/11
CPC classification number: H05K3/366 , H01R12/7005 , H01R12/727 , H05K1/144 , H05K3/305 , H05K3/4611 , H05K2201/10189 , H05K2201/10386 , H05K2201/10598
Abstract: An electronic board assembly carrying connectors on each side of its lower edge which is adapted to withstand the relatively strong forces required to insert or remove the assembly, e.g., from a backplane board, and yet provide many electrical contacts along the interconnection sites. The electronic board assembly comprises two symmetrical elementary PCBs electrically coupled together, each carrying a connector on its external lower edge. In one embodiment, these two PCBs are coupled together by a flexible adhesive insulative layer and maintained by mechanical devices such that the distance between these two connectors is set to a predetermined distance (to align precisely with the backplane board). The mechanical device used to maintain a predetermined distance between the two connectors of the assembly may comprise a U-shaped member, the upper part of this member being strategically inserted between these connectors. Electrical communication between these PCBs is accomplished using conductive vias or parts, within the adhesive insulative layer.
Abstract translation: 电子板组件，其承载在其下边缘的每一侧的连接器，其适于承受例如从底板插入或移除组件所需的相对较强的力，并且还沿着互连位置提供许多电触点。 电子板组件包括电耦合在一起的两个对称的基本PCB，每个在其外部下边缘上承载连接器。 在一个实施例中，这两个PCB通过柔性粘合绝缘层耦合在一起并由机械装置维持，使得这两个连接器之间的距离被设定为预定距离（与底板对准）。 用于在组件的两个连接器之间保持预定距离的机械装置可以包括U形构件，该构件的上部被战略性地插入在这些连接器之间。 这些PCB之间的电气通信使用导电通孔或部件在粘合绝缘层内完成。
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公开(公告)号：US06295726B1
公开(公告)日：2001-10-02
申请号：US09485338
申请日：2000-02-08
Applicant: Hannu M{umlaut over (aa)}ttä
Inventor： Hannu M{umlaut over (aa)}ttä
IPC: H01R4300
CPC classification number: H01L23/49811 , H01L2924/0002 , H01R12/57 , H05K3/3421 , H05K3/366 , H05K2201/10386 , Y10T29/49121 , Y10T29/49204 , H01L2924/00
Abstract: A method for manufacturing a SIL hybrid circuit is presented. A lead frame is provided which includes side bands and clip members between the side bands configured to connectively receive a hybrid circuit. The lead frame further includes foot members between the side bands configured to be surface-mounted to a base substrate. Each foot member has tabs at the ends thereof and support members extending straight from the tabs to connect the tabs to the side bands. Corresponding contact areas of the hybrid circuit are attached to the clip members. At least one foot member and associated support members are selected to remain in the lead frame to support the SIL hybrid circuit during positioning on the base substrate and surface mounting thereto. Excess parts are removed from the lead frame based on the selecting. As such, SIL hybrid circuits may be efficiently used to achieve high packaging densities.
Abstract translation: 提出了一种制造SIL混合电路的方法。 提供了一种引线框架，其包括侧带和夹子构件，所述边带和夹子构件配置成连接地接收混合电路。 引线框架还包括构造成表面安装到基底基板的侧带之间的脚构件。 每个脚构件在其端部具有突片，并且支撑构件从突片直接延伸以将突片连接到侧带。 混合电路的相应的接触区域连接到夹子构件。 选择至少一个脚构件和相关联的支撑构件以保持在引线框架中以在定位在基底基板上和在其上安装表面时支撑SIL混合电路。 基于选择，从引线框架移除多余部件。 因此，SIL混合电路可以有效地用于实现高封装密度。
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公开(公告)号：US6038132A
公开(公告)日：2000-03-14
申请号：US852294
申请日：1997-05-07
Applicant: Muneharu Tokunaga , Takakazu Fukumoto
Inventor： Muneharu Tokunaga , Takakazu Fukumoto
IPC: H01L25/00 , G11C5/00 , H01L23/52 , H01L25/10 , H01L27/10 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K7/02
CPC classification number: H05K1/141 , H01L25/105 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/0295 , H05K1/182 , H05K2201/09954 , H05K2201/10386 , H05K2201/10689 , H05K3/3421 , H05K3/3436 , H05K3/368
Abstract: A memory module capable of changing the generation of semiconductor memory devices by changing the design of a unit board without changing the design of a mother board.The mother board has connection terminals having an ability of connecting with first and second generation type unit boards, so that even when a connection terminal location is changed as a result of the generation change of the semiconductor memory devices, the next unit board can be connected to the mother board by selecting an appropriate terminal from connection terminals on the mother board.
Abstract translation: 一种存储模块，其能够通过改变单元板的设计而不改变母板的设计来改变半导体存储器件的产生。 母板具有连接端子，其具有与第一和第二代单元板连接的能力，使得即使连接端子位置由于半导体存储器件的产生变化而改变，也可以连接下一个单元板 通过从主板上的连接端子选择一个适当的终端到主板。
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公开(公告)号：US5910885A
公开(公告)日：1999-06-08
申请号：US984001
申请日：1997-12-03
Applicant: Alan M. Gulachenski , Joseph Praino , Jack Seidler
Inventor： Alan M. Gulachenski , Joseph Praino , Jack Seidler
CPC classification number: H01R12/57 , H01L25/105 , H05K3/368 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/144 , H05K2201/10386 , H05K3/325 , H05K3/3426
Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.
Abstract translation: 公开了一种电子堆叠模块，其包括具有上表面和下表面的两个或更多个基板，其中一个或多个电子部件设置在表面上并电连接到在基板边缘处以预定图案设置的连接器焊盘。 多个夹子引线电连接到连接器焊盘，其中每个夹子引线包括夹子部分，具有特定长度的支座部分和安装部分，该夹持部分构造成摩擦地接合上部和下部基板表面。 通过将一个基板的夹持部分对准和粘合到相邻基底的相应配合部分来实现基底的堆叠。
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公开(公告)号：US5601459A
公开(公告)日：1997-02-11
申请号：US315204
申请日：1994-09-29
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H01R43/0256 , H05K3/3405 , H05K3/3426 , H01R4/02 , H05K2201/10386 , H05K2201/10772 , H05K2201/10984 , H05K3/3478 , Y02P70/613
Abstract: A solder-bearing lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts and a tip, preferably in a V-shape, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly substantially no farther than said tip.
Abstract translation: 焊料引线及其制造和使用方法，其中引线形成有具有截面轮廓的焊料保持部分，该焊接保持部分具有底切和尖端，优选地为V形，其中焊料围绕所述焊料 - 保持部分和底切部分，并且基本上不比所述尖端更远地向外延伸。
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Patent Agency Ranking
公开(公告)号：US5441430A
公开(公告)日：1995-08-15
申请号：US223716
申请日：1994-04-06
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/52 , H01R12/728 , H05K3/366 , H01R4/02 , H05K2201/10386 , H05K2201/10757 , H05K2201/10984 , H05K3/3421
Abstract: A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.
Abstract translation: 提供了一种夹子引线，用于在可以是水平的第二基底上垂直焊接并支撑第一衬底。 夹子的末端被构造成通过在与第一基底成直角并且在第一基底下方弯曲而在与第二基底垂直的位置进行焊接期间为基底形成稳定的支撑。
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公开(公告)号：US5344343A
公开(公告)日：1994-09-06
申请号：US927415
申请日：1992-09-21
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H05K3/3405 , H01R4/02 , H05K2201/10386 , H05K2201/10984 , H05K3/341 , H05K3/3457 , H05K3/403 , Y10T29/49155 , Y10T29/49204
Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder- bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on the opposed faces of said solderbearing portion. A region of the middle portion is twisted so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surfacemounted lead for a substrate.
Abstract translation: PCT No.PCT / US91 / 02489第 371日期：1992年9月21日 102（e）1992年9月21日PCT PCT 1991年4月11日提交PCT公布。 出版物WO91 / 16736 日期：1991年10月31日。一种适于焊接到导电表面的焊料引线，包括具有焊料支承部分，端子部分和设置在所述焊料支承部分和所述端子之间的中间部分的细长主体部分 一部分。 焊料支承部分在从所述本体部分的一个边缘延伸的一对突起上承载焊料块，并在其间形成尺寸以容纳焊料块的间隙，或者在所述焊接部分的相对面上。 中间部分的区域被扭曲，使得焊料支承部分位于基本上垂直于端子部分的平面的平面中。 焊接轴承引线可以用作用于安装诸如印刷电路板的基板的边缘夹，或者用作用于基板的表面安装的引线。
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公开(公告)号：US5334059A
公开(公告)日：1994-08-02
申请号：US931064
申请日：1992-08-17
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H01L23/49811 , H01R4/02 , H01R43/0256 , H01R43/16 , H05K3/3405 , H05K3/366 , H01L2924/0002 , H05K2201/10295 , H05K2201/1034 , H05K2201/10386 , H05K2201/10984 , H05K2203/041 , H05K3/3421 , H05K3/3447 , Y10T29/49179 , Y10T29/49204
Abstract: A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.
Abstract translation: 一种用于连接到衬底表面的焊接轴，其中离散质量的焊料被引线牢固地机械地保持在允许靠近衬底表面的位置，以将引线与电气和机械接合 在焊料熔化时，引线体具有部分地环绕焊料块的一对指状物，其中指状物之间的间隙提供用于熔化的焊料到衬底的畅通无阻的流动。 引线还可以用于将第一衬底互连到第二衬底，在两个衬底上的导电区域之间形成结合。
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公开(公告)号：US5032006A
公开(公告)日：1991-07-16
申请号：US404547
申请日：1989-09-08
Applicant: Joachim Grupp , Yves Ruedin
Inventor： Joachim Grupp , Yves Ruedin
CPC classification number: G02F1/13452 , G02F1/1345 , H05K3/321 , H05K2201/0919 , H05K2201/10287 , H05K2201/1034 , H05K2201/10386 , H05K2201/10962 , H05K3/3405
Abstract: An electrooptical cell has electrical connection means between electrodes and a control unit which comprise a contact block of a synthetic adhesive material having conducting particles applied on the edge of each plate in contact zones which are provided flush with said edge, the contact block constituting both the electrical connection and the mechanical bond with at least one other element of said connection.
Abstract translation: 电光电池在电极和控制单元之间具有电连接装置，该控制单元包括具有施加在与所述边缘齐平的接触区中每个板的边缘上的导电颗粒的合成粘合材料的接触块，所述接触块构成 电连接和与所述连接的至少一个其它元件的机械结合。
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公开(公告)号：US5030144A
公开(公告)日：1991-07-09
申请号：US510004
申请日：1990-04-13
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H05K3/3405 , H01R4/02 , H05K2201/10386 , H05K2201/10984 , H05K3/341 , H05K3/3457 , H05K3/403 , Y10T29/49155 , Y10T29/49204
Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion includes a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass. A region of the middle portion is twisted so that the projections lie in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board/or as a surface-mounted lead for a substrate.
Abstract translation: 一种适于焊接到导电表面的焊料引线，包括具有焊料支承部分，端子部分和设置在所述焊料支承部分和所述端子部分之间的中间部分的细长主体部分。 焊料支承部分包括从所述主体部分的一个边缘延伸的一对突出部分，并在其间形成尺寸以容纳焊料块的间隙。 中间部分的区域被扭曲，使得突起位于基本上垂直于端子部分的平面的平面中。 焊接轴承引线可以用作用于安装诸如印刷电路板的基板或用作基板的表面安装引线的边缘夹。
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