Abstract:
A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.
Abstract:
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
Abstract:
A rigid bar of material is fastened to a circuit board to increase its stiffness. The bar is preferably a high modulus plastic such as liquid crystal polymer. Flexible fingers which surround a central opening are formed integrally with the bar and pop into throughbores in the circuit board. Each finger has at least one arcuate protrusion and, preferably several, which can engage the bottom of the circuit board. A rigid pin which may be made of steel is slid into the central opening and has an interference fit therewith to hold it in place to prevent flexible fingers from moving inwardly so the stiffener is held fast to the circuit board.
Abstract:
A thermally and electrically conductive (TEC) pad is disposed between a PCB and a heat sink in a cellular telephone base station. The TEC pad includes at least one aperture that overlies one or more signal vias on a ground plane of the PCB. The TEC pad apertures are larger than any underlying signal vias in order to electrically isolate the signal vias from the conductive material of the pad and the heat sink. The TEC pad allows ground vias on a PCB ground plane to ground to the heat sink.
Abstract:
An apparatus is provided for securing electronic devices in a vehicle. A ventilation duct is provided beneath the instrument panel for conveying air in the vehicle. The ventilation duct includes an outer surface. An overlay substrate is laid upon and secured against the outer surface or acts as the wall of the duct, and is adapted for carrying electronic devices thereon. This design improves packaging efficiency within the vehicle. This invention can also be applied to other automotive applications such as on door panels, instrument panels and package trays.
Abstract:
An anchor pin, for anchoring one component upon another, such as an electrical connector upon a printed circuit board, by way of a passage defined by a mounting hole in one of the components that is substantially aligned with an opening in the other component. The anchor pin having a first form with a volume larger than the volume defined by the passage while being receivable within the passage and a second form in response to an external energy input, whereby the anchor pin within the passage becomes fluid deforming to substantially fill the passage, automatically accommodating any misalignment, and overflowing therefrom to form opposing heads. The mounting pin hardens in this form to anchor the components together.
Abstract:
An article such, as an electrical connector, for mounting upon a substrate, such as a printed circuit board. The article includes a mounting plane having locating and centering means thereon. The locating and centering means comprises first and second spaced apart, depending lugs, each of which tapers from a first diameter proximal the mounting plane to a second diameter, narrower than the first diameter, distal said mounting plane. The first lug has a longitudinal slot extending its length in a given direction and the second lug has a longitudinal slot extending its length in a direction orthogonal to the given direction. The slots extending in different directions provide a centering and holding response which fixes the connector in position so that subsequent operations may be performed.
Abstract:
A process for connecting a switch to a printed circuit board comprising the steps of, providing a printed circuit board having at least one aperture formed therein, providing a switch including a housing having at least one electrical terminal extending therefrom, providing a fastener made of a molded plastic material capable of withstanding a soldering environment, mounting the switch on the board such that the at least one terminal thereof extends through the at least one board aperture, connecting the switch to the board by means of a fastener and wave-soldering the at least one terminal to the printed circuit board after the connecting step.
Abstract:
A stepped multilayer Printed Wiring Board (PWB) (10), having an increased number of wiring paths in selected regions, is comprised of a main multilayer PWB (12) having a sufficient number of layers (12.sub.1,12.sub.2,12.sub.3 . . . 12.sub.n) to provide the lowest number of wiring paths required anywhere on the board. In regions where a larger number of wiring paths are required, a secondary, multilayer PWB section (22), having a sufficient number of layers (22.sub.1,22.sub.2,22.sub.3) to provide the required additional number of wiring paths, is connected to the main PWB by a layer of anisotropically conductive material (30) sandwiched therebetween. A plurality of mechanical fasteners (33,33'), typically bifurcated or heat-staked plastic pins, extends through the secondary PWB section and the main PWB to hold one to the other.
Abstract:
The thermal mounting plate has a pocket therein which contains dielectric elastomer. The pins on the pin side of the circuit card assembly engage in the elastomer to conduct heat from the components through the pins and elastomer into the thermal mounting plate. The thermal mounting plate mounts into a cooled card box for heat removal.