公开(公告)号：US20130250532A1

公开(公告)日：2013-09-26

申请号：US13821609

申请日：2011-09-16

Applicant: Janusz Bryzek ,  John Gardner Bloomsburgh ,  Cenk Acar

Inventor： Janusz Bryzek ,  John Gardner Bloomsburgh ,  Cenk Acar

IPC: H05K1/18

CPC classification number: B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/07 ,  B81C1/0023 ,  H01L23/481 ,  H01L2224/131 ,  H01L2924/1461 ,  H05K1/18 ,  H01L2924/014 ,  H01L2924/00

Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.

公开(公告)号：US08505190B2

公开(公告)日：2013-08-13

申请号：US13180289

申请日：2011-07-11

Applicant: Hyun Kee Lee ,  Tae Joon Park ,  Sang Kee Yoon ,  Hyung Jae Park ,  Yeong Gyu Lee ,  Heung Woo Park

Inventor： Hyun Kee Lee ,  Tae Joon Park ,  Sang Kee Yoon ,  Hyung Jae Park ,  Yeong Gyu Lee ,  Heung Woo Park

IPC: G01R3/00

CPC classification number: G01P15/08 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C2203/032 ,  G01C19/5663 ,  G01P15/0802 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49124

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract translation: 本文公开了一种制造惯性传感器的方法。 制造惯性传感器100的方法包括（A）将聚合物120施加到基底基材110上，（B）图案化聚合物120以在聚合物120中形成开口部分125，（C）通过 通过在厚度方向上的蚀刻工艺在开口部分125上暴露的基底基板110上形成空腔115，以及（D）通过使用聚合物120将盖130连接到器件基板140，由此将聚合物120施加到 基底基板110处于恒定厚度D3，使得帽130可以通过使用聚合物120而容易地结合到装置基板140。

公开(公告)号：US20130139591A1

公开(公告)日：2013-06-06

申请号：US13755841

申请日：2013-01-31

Applicant: Cenk Acar

Inventor： Cenk Acar

IPC: G01C19/5712

CPC classification number: B81B3/0018 ,  B81B3/0059 ,  B81B2201/0242 ,  B81B2203/0154 ,  B81C1/00134 ,  G01C19/56 ,  G01C19/5712

Abstract: Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis.

Abstract translation: 各种示例包括用于感测运动的微机电模具，其包括与不对称定子电极相互指向的对称的证明质量电极。 这些示例中的一些包括围绕垂直于其中布置电极的平面的轴线弯曲的电极。 一个例子提供垂直弯曲，其以允许围绕水平轴线弯曲的方式将内万向架耦合到校验块。

公开(公告)号：US08438718B2

公开(公告)日：2013-05-14

申请号：US13028592

申请日：2011-02-16

Applicant: Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

Inventor： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

IPC: G01R3/00

CPC classification number: G01C19/56 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/096 ,  B81C1/00285 ,  B81C2203/0118 ,  B81C2203/035 ,  G01C19/5769 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/0882 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49826 ,  H01L2924/00012

Abstract: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.

Abstract translation: 加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。 为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片，并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。 在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起，吸附剂分段依次被激活以吸附活性气体，以便调节 陀螺仪内部的压力，从而制造组合的传感器晶片。

公开(公告)号：US20130043548A1

公开(公告)日：2013-02-21

申请号：US13586576

申请日：2012-08-15

Applicant: Jochen Reinmuth ,  Heribert Weber

Inventor： Jochen Reinmuth ,  Heribert Weber

IPC: H01L29/84 ,  H01L21/02

CPC classification number: G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00626 ,  B81C2201/0132 ,  B81C2203/0136 ,  G01C19/5783

Abstract: A method for manufacturing a micromechanical structure includes: forming a first insulation layer above a substrate; forming a first micromechanical functional layer on the first insulation layer; forming multiple first trenches in the first micromechanical functional layer, which trenches extend as far as the first insulation layer; forming a second insulation layer on the first micromechanical functional layer, which second insulation layer fills up the first trenches; forming etch accesses in the second insulation layer, which etch accesses locally expose the first micromechanical functional layer; and etching the first micromechanical functional layer through the etch accesses, the filled first trenches and the first insulation layer acting as an etch stop.

Abstract translation: 一种制造微机械结构的方法包括：在基板上形成第一绝缘层; 在所述第一绝缘层上形成第一微机械功能层; 在所述第一微机械功能层中形成多个第一沟槽，所述沟槽延伸到所述第一绝缘层; 在所述第一微机械功能层上形成第二绝缘层，所述第二绝缘层填充所述第一沟槽; 在所述第二绝缘层中形成蚀刻访问，所述蚀刻访问局部暴露所述第一微机械功能层; 并且通过蚀刻访问蚀刻第一微机械功能层，填充的第一沟槽和用作蚀刻停止层的第一绝缘层。

公开(公告)号：US08354900B2

公开(公告)日：2013-01-15

申请号：US12571080

申请日：2009-09-30

Applicant: Gabriele Cazzaniga ,  Luca Coronato

Inventor： Gabriele Cazzaniga ,  Luca Coronato

IPC: H01H51/22

CPC classification number: B81B3/0018 ,  B81B3/0013 ,  B81B2201/0235 ,  B81B2201/0242

Abstract: An embodiment of a microelectromechanical device having a first structural element, a second structural element, which is mobile with respect to the first structural element, and an elastic supporting structure, which extends between the first and second structural elements to enable a relative movement between the first and second structural elements. The microelectromechanical device moreover possesses an anti-stiction structure, which includes at least one flexible element, which is fixed only with respect to the first structural element and, in a condition of rest, is set at a first distance from the second structural element. The anti-stiction structure is designed to generate a repulsive force between the first and second structural elements in the case of relative movement by an amount greater than the first distance.

Abstract translation: 具有第一结构元件，相对于第一结构元件可移动的第二结构元件的微机电装置的实施例和在第一和第二结构元件之间延伸的弹性支撑结构，以使得能够在 第一和第二结构元件。 此外，微电子机械装置具有抗静电结构，其包括至少一个柔性元件，其仅相对于第一结构元件固定，并且在休止状态下被设置在离第二结构元件第一距离处。 抗静力结构被设计成在相对运动大于第一距离的量的情况下在第一和第二结构元件之间产生排斥力。

公开(公告)号：US08339014B2

公开(公告)日：2012-12-25

申请号：US12599688

申请日：2008-06-30

Applicant: Atsushi Kandori ,  Chienliu Chang ,  Makoto Takagi

Inventor： Atsushi Kandori ,  Chienliu Chang ,  Makoto Takagi

IPC: G02B26/08

CPC classification number: B81B3/0086 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2203/058 ,  G01C19/5719

Abstract: An oscillator device that includes a movable body oscillatably supported about a rotation axis, wherein the movable body is separated into plural electrically separated conductive regions in the thickness direction, and at least one of the plural electrically separated conductive regions in the thickness direction further has plural electrically separated conductive regions.

Abstract translation: 一种振荡器装置，包括围绕旋转轴可摆动地支撑的可移动体，其中所述可移动体在所述厚度方向上被分离为多个分离的导电区域，并且所述多个电分离的导电区域中的至少一个在所述厚度方向上还具有多个 电分离的导电区域。

公开(公告)号：US20120142136A1

公开(公告)日：2012-06-07

申请号：US12957928

申请日：2010-12-01

Applicant: Robert D. Horning ,  Jeff A. Ridley

Inventor： Robert D. Horning ,  Jeff A. Ridley

IPC: H01L31/18

CPC classification number: B81C1/00301 ,  B81B2201/0242 ,  B81B2207/095 ,  B81C2203/0118 ,  B81C2203/031

Abstract: A process for packaging micro-electro-mechanical systems (MEMS) devices comprises providing a lower cover wafer and an upper cover wafer, providing a semiconductor wafer including a plurality of MEMS devices on a substrate layer, bonding the semiconductor wafer to a first surface of the lower cover wafer, and bonding a second surface of the upper cover wafer to the semiconductor wafer. The first surface of the lower cover wafer and the second surface of the upper cover wafer define a plurality of hermetically sealed cavity sections when bonded to the semiconductor wafer such that each of the MEMS devices is located inside one of the sealed cavity sections. A plurality of holes are formed that extend from the first surface of the upper cover wafer to the second surface of the upper cover wafer after the upper cover wafer is bonded to the semiconductor wafer. A metal lead layer is then deposited in each of the holes to provide an electrical connection with the MEMS devices.

Abstract translation: 一种用于封装微机电系统（MEMS）器件的方法包括提供下盖晶片和上盖晶片，在衬底层上提供包括多个MEMS器件的半导体晶片，将半导体晶片接合到第一表面 下盖晶片，并将上盖晶片的第二表面接合到半导体晶片。 当与半导体晶片接合时，下盖晶片的第一表面和上盖晶片的第二表面限定多个密封的空腔部分，使得每个MEMS器件位于一个密封空腔部分内。 在上盖晶片接合到半导体晶片之后，形成从上盖晶片的第一表面延伸到上盖晶片的第二表面的多个孔。 然后在每个孔中沉积金属引线层以提供与MEMS器件的电连接。

公开(公告)号：US20120139064A1

公开(公告)日：2012-06-07

申请号：US13274292

申请日：2011-10-14

Applicant: Goro Nakatani ,  Toma Fujita

Inventor： Goro Nakatani ,  Toma Fujita

IPC: H01L27/20 ,  H01L21/00 ,  H01L29/84

CPC classification number: B81C1/00801 ,  B81B7/02 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2203/04 ,  B81C1/00182 ,  B81C2201/053 ,  G01C19/5733 ,  G01C19/5769 ,  G01P15/125 ,  H01L2224/48137

Abstract: A capacitance type gyro sensor includes a semiconductor substrate, a first electrode integrally including a first base portion and first comb tooth portions and a second electrode integrally including a second base portion and second comb tooth portions, formed by processing the surface portion of the semiconductor substrate. The first electrode has first drive portions that extend from opposed portions opposed to the respective second comb tooth portions on the first base portion toward the respective second comb tooth portions. The second electrode has second drive portions formed on the tip end portions of the respective second comb tooth portions opposed to the respective first drive portions. The first drive portions and the second drive portions engage with each other at an interval like comb teeth.

Abstract translation: 电容式陀螺传感器包括半导体基板，一体地包括第一基座部分和第一梳齿部分的第一电极和通过处理半导体基板的表面部分而形成的包括第二基底部分和第二梳齿部分的第二电极 。 第一电极具有第一驱动部分，其从在第一基部上的相应的第二梳齿部分相对的部分朝向相应的第二梳齿部分延伸。 第二电极具有形成在与第一驱动部分相对的各个第二梳齿部分的末端部分上的第二驱动部分。 第一驱动部分和第二驱动部分以梳齿的间隔彼此接合。

公开(公告)号：US20120070931A1

公开(公告)日：2012-03-22

申请号：US13237838

申请日：2011-09-20

Applicant: Michael Foster ,  Mark Williams ,  Mark Eskridge

Inventor： Michael Foster ,  Mark Williams ,  Mark Eskridge

IPC: H01L21/02

CPC classification number: H01L29/84 ,  B81B1/00 ,  B81B2201/0242 ,  B81B2203/0307 ,  B81B2207/07 ,  B81C1/00039 ,  G01C19/5719

Abstract: Methods of anchoring components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the substrate, and an anchor flexure configured to flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.

Abstract translation: 将微机电系统（MEMS）装置的部件锚固到基板上的方法。 示例性实施例具有结合到基底的迹线锚固件，结合到基底的装置锚固件和锚构件挠曲件，其构造成柔性地联接轨迹锚和装置锚固件，以基本上防止在轨迹锚中感应的应力的传递不被传递 到设备锚点。