公开(公告)号：US20180084341A1

公开(公告)日：2018-03-22

申请号：US15273449

申请日：2016-09-22

Applicant: Intel Corporation

Inventor： Hector Alfonso Cordourier Maruri ,  Jesus Adan Cruz Vargas ,  Paulo Lopez Meyer ,  Jose Rodrigo Camacho Perez ,  Julio Cesar Zamora Esquivel ,  Alejandro Ibarra Von Borstel

IPC: H04R3/00 ,  H04R17/02 ,  G10L25/90 ,  G10L19/06 ,  G10L15/02

CPC classification number: H04R3/00 ,  G10L13/00 ,  G10L15/00 ,  G10L25/12 ,  G10L25/90 ,  H04R1/04 ,  H04R17/02 ,  H04R2201/003 ,  H04R2201/023 ,  H04R2201/107 ,  H04R2460/13

Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for audio signal emulation, based on a vibration signal generated in response to a user's voice. In some embodiments, the apparatus may include at least one sensor disposed on the apparatus to generate a sensor signal indicative of vibration induced by a user's voice in a portion of a user's head. The apparatus may further include a controller coupled with the sensor, to transform the sensor signal into an emulated audio signal, with distortions associated with the vibration in the user's head portion that are manifested in the generated sensor signal, to improve speech recognition based on the generated sensor signal at least partially mitigated. Other embodiments may be described and/or claimed.

公开(公告)号：US20180077489A1

公开(公告)日：2018-03-15

申请号：US15587528

申请日：2017-05-05

Applicant: Fortemedia, Inc.

Inventor： Tsung Lung YANG

IPC: H04R3/00 ,  H04R1/04 ,  H04R1/40 ,  H04R1/28 ,  H04R19/04

CPC classification number: H04R3/005 ,  H04R1/04 ,  H04R1/2853 ,  H04R1/406 ,  H04R19/04 ,  H04R2201/003

Abstract: A microphone device is provided, including first and second chambers, first and second acoustic sensors, and a sound transmission device. The first and second chambers include the first and second acoustic ports, respectively. The first and second acoustic sensors are arranged in the first chamber and the second chamber, respectively. The sound transmission device coupled to the first and second chambers includes third and fourth acoustic ports, a first acoustic tube, and a second acoustic tube. The first acoustic tube communicates with the first acoustic port and the third acoustic port. The second acoustic tube communicates with the second acoustic port and the fourth acoustic port. The sensitivity difference between the first acoustic sensor and the second acoustic sensor is determined based on the length difference or the cross-sectional area difference between the first acoustic tube and the second acoustic tube.

公开(公告)号：US20180072560A1

公开(公告)日：2018-03-15

申请号：US15702034

申请日：2017-09-12

Applicant: Robert Bosch GmbH

Inventor： Helmut Grutzeck ,  Jochen Reinmuth

IPC: B81B3/00 ,  H04R19/00 ,  H04R19/04 ,  H02N1/00 ,  G01L9/00

CPC classification number: B81B3/0037 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/033 ,  B81B2203/0127 ,  B81B2203/0172 ,  B81B2203/04 ,  G01L9/0072 ,  H02N1/008 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A micromechanical component having a substrate, a membrane that covers an opening structured into the substrate from a first side of the substrate and that can be warped by a pressure difference between the first side of the substrate and a second side, oriented away from the first side, of the substrate, and having at least one actuator electrode that is connected at least to the membrane in such a way that the at least one actuator electrode can be displaced relative to the substrate by a warping of the membrane, the at least one actuator electrode being capable of being displaced relative to the substrate by the warping of the membrane, in each case along a displacement axis oriented parallel to the second side of the substrate. A production method for a micromechanical component is also described.

公开(公告)号：US09914636B2

公开(公告)日：2018-03-13

申请号：US15212334

申请日：2016-07-18

Applicant: Robert Bosch GmbH

Inventor： Thomas Buck ,  Fabian Purkl ,  Michael Stumber ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: B81B3/00 ,  H04R17/02

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/015 ,  B81B2207/07 ,  H04R17/02 ,  H04R2201/003

Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

公开(公告)号：US20180070181A1

公开(公告)日：2018-03-08

申请号：US15385193

申请日：2016-12-20

Applicant: HYUNDAI MOTOR COMPANY

Inventor： Hyunsoo KIM ,  Ilseon YOO

IPC: H04R7/26 ,  H04R19/00 ,  H04R31/00 ,  H04R19/04

CPC classification number: H04R7/26 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003 ,  H04R2410/03

Abstract: A microphone includes a substrate including an acoustic hole; a supporting layer disposed along a circumference of the substrate; and a vibrating film disposed on the supporting layer and spaced apart from the substrate, wherein the vibrating film includes a first vibrating region positioned at a portion corresponding to the acoustic hole; a second vibrating region connected to the first vibrating region, and including an air inlet; and a third vibrating region connected to the second vibrating region through a plurality of connection parts.

公开(公告)号：US20180063616A1

公开(公告)日：2018-03-01

申请号：US15335697

申请日：2016-10-27

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Hsien-Ken LIAO ,  Ming-Te TU ,  Jyong-Yue TIAN ,  Yao-Ting YEH

IPC: H04R1/04 ,  H04R19/04 ,  B81B7/00

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  H04R19/04 ,  H04R2201/003

Abstract: A microelectromechanical microphone package structure includes a substrate, sidewall, lid, sound wave transducer and processing module. The substrate has a plate, sound aperture penetrating the plate, and conduction portion disposed on the plate. The sidewall has one end disposed on the plate and has a conduction circuit electrically connected to the conduction portion. A chamber is defined between the lid, sidewall and plate. The lid has at least one solder pad and a third contact in electrical conduction with each other. The third contact is electrically connected to the conduction circuit. The sound wave transducer is disposed on the plate and in the chamber and aligned with the sound aperture. The processing module, which is disposed on the plate and in the chamber and electrically connected to the sound wave transducer and conduction portion, includes a processing chip and electronic component which are stacked and disposed on the plate.

公开(公告)号：US20180061192A1

公开(公告)日：2018-03-01

申请号：US15477219

申请日：2017-04-03

Applicant: Apple Inc.

Inventor： Denis G. CHEN ,  Shingo YONEOKA ,  Riccardo TARELLI ,  Hari VASUDEVAN ,  Domenico GERIA ,  Mi Hye SHIN

IPC: G08B6/00 ,  G06F3/01 ,  H04R19/04 ,  G10K11/178

CPC classification number: G08B6/00 ,  G06F1/1626 ,  G06F1/1684 ,  G06F1/1694 ,  G06F3/016 ,  G10K11/178 ,  G10K11/17881 ,  G10K2210/3028 ,  G10K2210/3044 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: An electronic device may include a device housing and a haptic actuator carried by the device housing and that includes a haptic actuator housing and a field member movable within the haptic actuator housing. The electronic device may also include a motion sensor carried by the device housing to sense motion of the field member, an audio sensor carried by the device housing to sense audio noise from the haptic actuator, and a controller coupled to the haptic actuator, the motion sensor, and the audio sensor. The controller may be configured to drive the haptic actuator based upon sensed motion of the field member and audio noise from the haptic actuator.

公开(公告)号：US20180050900A1

公开(公告)日：2018-02-22

申请号：US15676430

申请日：2017-08-14

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Stephen DUFFY ,  Colin Robert JENKINS ,  Tsjerk Hans HOEKSTRA

IPC: B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R19/04 ,  H04R7/06

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/03 ,  B81C1/00666 ,  H04R7/06 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: The application describes a MEMS transducer comprising a layer of conductive material provided on a surface of a layer of membrane material. The layer of conductive material comprises first and second regions, wherein the thickness and/or the conductivity of the/each first and second regions is different.

公开(公告)号：US09888325B2

公开(公告)日：2018-02-06

申请号：US15129572

申请日：2015-03-31

Applicant: Robert Bosch GmbH

Inventor： Brett Mathew Diamond ,  John M. Muza ,  John W. Zinn

IPC: H04R25/00 ,  H04R19/00 ,  H04R19/04 ,  H04R1/04 ,  H04R31/00

CPC classification number: H04R19/005 ,  H04R1/04 ,  H04R19/04 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003

Abstract: Systems and methods for preventing electrical leakage in a MEMS microphone. In one embodiment, the MEMS microphone includes a semiconductor substrate, an electrode, a first insulation layer, and a doped region. The first insulation layer is formed between the electrode and the semiconductor substrate. The doped region is implanted in at least a portion of the semiconductor substrate where the semiconductor substrate is in contact with the first insulation layer. The doped region is also electrically coupled to the electrode.

公开(公告)号：US20180035228A1

公开(公告)日：2018-02-01

申请号：US15660431

申请日：2017-07-26

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Euan James BOYD

IPC: H04R31/00 ,  H04R19/04 ,  H04R19/02 ,  B81B3/00

CPC classification number: H04R31/006 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R7/18 ,  H04R19/005 ,  H04R19/02 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: The application describes MEMS transducers comprising a flexible membrane layer supported in a fixed relation relative to a substrate along at least one supporting edge, wherein a plurality of slits are provided through the membrane layer. The slits define a plurality of beams. Each beam defines a path between first and second endpoints of the beam, the path comprising at least one change in direction. Also described are transducers wherein the membrane layer is supported in a fixed relation relative to the substrate along a plurality of supporting edges which define a membrane region that is substantially bounded by the supporting edges.