公开(公告)号：US5591037A

公开(公告)日：1997-01-07

申请号：US251547

申请日：1994-05-31

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L24/81 ,  H05K3/3484 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10424 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/0769 ,  H05K2203/104

Abstract: In accordance with the invention, an electronic device having one or more contact pads is adhered to an array of transferable solder particles on a removable carrier sheet. The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 根据本发明，具有一个或多个接触垫的电子器件被粘附到可移动的载体片上的可转移焊料颗粒的阵列上。 通过溶解除去载体，留下焊料选择性地粘附到接触垫上。 在优选的实施方案中，焊料载体介质是水溶性的，焊料颗粒包括焊料涂覆的磁性颗粒。 在介质干燥或固化时应用磁性材料，产生规则的焊料涂覆颗粒阵列。 使用这种方法，具有小于常规接触结构的装置可以容易地相互连接。

公开(公告)号：US5326636A

公开(公告)日：1994-07-05

申请号：US953609

申请日：1992-09-29

Applicant: David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Wei

Inventor： David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Wei

IPC: C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  B32B9/00

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shringage of the polymeric carrier upon curing.

Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积性破裂的结果，当建立粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

公开(公告)号：US09833836B2

公开(公告)日：2017-12-05

申请号：US13000415

申请日：2009-06-23

Applicant: Shlomo Magdassi ,  Michael Grouchko ,  Alexander Kamyshny

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Alexander Kamyshny

IPC: C09D11/30 ,  B82Y30/00 ,  B22F1/02 ,  B22F9/18 ,  B22F1/00 ,  B01J13/02 ,  B22F9/24 ,  C09D11/322 ,  C09D11/52 ,  H05K1/09

CPC classification number: B22F1/0022 ,  B01J13/02 ,  B22F1/0018 ,  B22F1/02 ,  B22F1/025 ,  B22F9/18 ,  B22F9/24 ,  B22F2001/0092 ,  B22F2301/10 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/322 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0218 ,  Y10T428/24901

Abstract: Provided is a composition including a plurality of multi-metallic nanoparticles each consisting essentially of a core including at least one first metal (Me1) and a continuous shell including atoms of at least one second metal (Me2). Optionally, the continuous shell of Me2 atoms protects the Me1 atoms from oxidation at all temperatures less than 150° C.

公开(公告)号：US20160358688A1

公开(公告)日：2016-12-08

申请号：US15117744

申请日：2015-02-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Miharu Tanabe

IPC: H01B1/22 ,  H05K3/02 ,  G06F3/041 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H05K1/09 ,  C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  G03F7/0047 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2024 ,  G03F7/32 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/092 ,  H05K3/027 ,  H05K2201/0218 ,  H05K2203/0514 ,  H05K2203/0783

Abstract: There is a need to address the problem of providing a conductive paste which is low cost in addition to being capable of forming a conductive pattern which dramatically suppresses the occurrence of ion migration. The conductive paste is one containing a photosensitive organic compound and silver-coated particles obtained by coating a conductive core with silver, wherein the proportion which silver constitutes in the silver-coated particles is 10-45 mass %.

Abstract translation: 需要解决提供导电浆料的问题，该导电浆料除了能够形成显着抑制离子迁移的发生的导电图案之外，还具有低成本。 导电性糊剂是含有感光性有机化合物和通过用银涂布导电性芯材而得到的银包覆颗粒的导电性糊料，其中银涂覆颗粒中的银的比例为10-45质量％。

公开(公告)号：US09478326B2

公开(公告)日：2016-10-25

申请号：US14768837

申请日：2014-02-28

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Hiroya Ishida ,  Kiyoto Matsushita

IPC: H01B1/22 ,  B23K35/26 ,  B23K35/02 ,  C22C13/00 ,  H05K3/32 ,  B22F1/02 ,  C23C18/16 ,  C25D5/12 ,  H01B1/02 ,  H01L23/00

CPC classification number: H01B1/22 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/00 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/12 ,  H01B1/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29469 ,  H01L2224/29481 ,  H01L2224/29487 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/834 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2924/3512 ,  H01L2924/3651 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2203/0425 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/05342 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01032 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01029

Abstract: The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer.

Abstract translation: 本发明的目的在于提供一种导电性微粒，即使在通过滴下等施加冲击时，由于电极和导电性微粒之间的连接界面的断裂，也不太可能导致断线，并且即使在重复加热之后也不易疲劳， 冷却，各向异性导电材料和导电连接结构，均使用导电性微粒制造。 本发明涉及在由树脂或金属制成的核心颗粒的表面上至少包含导电金属层，阻挡层，铜层和含有锡的焊料层的导电性微粒， 铜层和焊料层直接相互接触，铜层与含有铜的焊料层直接相对于焊料层中所含的锡的重量比为0.5〜5％。

公开(公告)号：US09402313B2

公开(公告)日：2016-07-26

申请号：US14163031

申请日：2014-01-24

Applicant: FUJITSU LIMITED

Inventor： Seiki Sakuyama ,  Taiji Sakai

IPC: H05K7/10 ,  H05K1/11 ,  H01B1/02 ,  H01B1/22 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01B1/026 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/462 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2224/0401

Abstract: A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.

Abstract translation: 导电材料包括主要成分是第一金属的第一金属部分; 第二金属部分形成在第一金属部分上，其主要成分是第二金属，第二金属的熔点低于第一金属的熔点，第二金属可以与第一金属形成金属化合物; 和主要成分为第三金属的第三金属部分，该第三金属可以与第二金属发生共晶反应。

公开(公告)号：US20150235122A1

公开(公告)日：2015-08-20

申请号：US14564111

申请日：2014-12-09

Applicant: David Finn ,  Klaus Ummenhofer

Inventor： David Finn ,  Klaus Ummenhofer

IPC: G06K19/077 ,  G06K7/10

CPC classification number: G06K19/07794 ,  G06K7/10009 ,  G06K19/07754 ,  G06K19/07769 ,  H01F27/365 ,  H01F38/14 ,  H01F41/16 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H05K1/0225 ,  H05K1/0233 ,  H05K1/167 ,  H05K1/183 ,  H05K3/1275 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0266 ,  H05K2201/0317 ,  H05K2201/0323 ,  H05K2201/0723 ,  H05K2201/086 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10098

Abstract: Card body (CB) for a dual interface smart card (SC) comprising a metal foil (MF) or metallized layer (ML). An opening in the metal layer may be sized so that a coupler coil (CC) of a booster antenna (BA) is exposed. Improving coupling between a contactless reader and a transponder comprising providing a patch booster antenna (PBA) on a substrate disposed on the reader. Various booster antenna designs are disclosed.

Abstract translation: 包括金属箔（MF）或金属化层（ML）的双接口智能卡（SC）的卡体（CB）。 金属层中的开口的尺寸可以使得增强天线（BA）的耦合线圈（CC）暴露。 改善非接触读取器和应答器之间的耦合，包括在布置在读取器上的衬底上提供贴片增强天线（PBA）。 公开了各种增强天线设计。

公开(公告)号：US20150209912A1

公开(公告)日：2015-07-30

申请号：US14606948

申请日：2015-01-27

Applicant: Senju Metal lndustry Co., Ltd.

Inventor： Hiroyoshi KAWASAKI ,  Takahiro ROPPONGI ,  Daisuke SOMA ,  Isamu SATO

IPC: B23K35/02 ,  B23K35/26 ,  H01B1/02 ,  C22C9/00 ,  C22C13/00 ,  H01L23/00 ,  B23K35/30

CPC classification number: C25D3/60 ,  B22F1/025 ,  B22F9/08 ,  B22F2301/10 ,  B22F2301/30 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K2101/40 ,  C22C9/00 ,  C22C13/00 ,  C25D3/30 ,  C25D5/12 ,  C25D5/20 ,  F16B5/08 ,  H01B1/02 ,  H01L24/13 ,  H01L2224/13014 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0109 ,  H01L2924/01092 ,  H01L2924/12042 ,  H01L2924/15321 ,  H05K3/3436 ,  H05K2201/0218 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A Cu core ball suppresses a soft error and its alpha dose is low. Its surface roughness does not affect a mounting process. A pure degree of the Cu ball as an internal ball is equal to or larger than 99.9% and equal to or less than 95%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is equal to or higher than 0.95. A solder plating film coated on the Cu ball is a Sn solder plating film or a solder plating film comprising a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is equal to or less than 5 ppb and that of Th is equal to or less than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is equal to or less than 0.0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.

Abstract translation: 铜芯球抑制软错误，其α剂量低。 其表面粗糙度不影响安装过程。 作为内部球的Cu球的纯度等于或大于99.9％且等于或小于95％。 包含在Cu球中的杂质中Pb和/或Bi的总含量等于或大于1ppm。 其球形度等于或高于0.95。 涂覆在Cu球上的焊料镀膜是Sn焊料镀覆膜或包含无铅焊料合金的焊锡镀膜，其主要成分为Sn。 在焊料镀膜中，U的含量等于或小于5ppb，Th的含量等于或小于5ppb。 Cu球和焊料镀覆膜的总α剂量等于或小于0.0200cph / cm 2。 Cu芯球的算术平均粗糙度等于或小于0.3μm。

公开(公告)号：US20150208509A1

公开(公告)日：2015-07-23

申请号：US14423417

申请日：2013-05-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Koji Motomura

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/14

CPC classification number: H05K1/18 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/0465 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Abstract translation: 公开了一种部件安装结构，包括具有多个第一电极的第一物体，具有第二电极的电子部件的第二物体，将多个第一电极和对应的第二电极彼此接合的接合部，以及树脂 - 加强部分。 接头部分具有包括第一金属和树脂颗粒中的至少一个的芯，以及具有低熔点的第一金属和第二金属的金属间化合物层。 在第一和第二电极之间的部分中，树脂增强部分包括包括芯和金属间化合物的颗粒物质。 包含在该部分中的颗粒物质的量为0.1〜10体积％。

公开(公告)号：US20150077215A1

公开(公告)日：2015-03-19

申请号：US14396170

申请日：2013-04-26

Applicant: Northeastern University

Inventor： Richard Ranky ,  Alexandra Carver ,  Constantinos Mavroidis ,  Daniel Landers ,  Mark L. Sivak

IPC: B29C67/00 ,  H01C10/10

CPC classification number: B33Y10/00 ,  B29C64/118 ,  B29C70/88 ,  B29K2083/00 ,  B29K2505/08 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/34 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01C10/10 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/0091 ,  H05K3/1258 ,  H05K2201/0218 ,  H05K2201/0314 ,  H05K2201/0323 ,  H05K2201/0376 ,  H05K2201/10151 ,  H05K2203/0759

Abstract: A method of constructing an object includes depositing a first material in a predetermined arrangement to form a structure. The method further includes depositing a second material within the structure. The second material may have electrical properties and the method also includes providing electrical access to the second material to enable observation of the one or more electrical properties.

Abstract translation: 构造物体的方法包括以预定布置沉积第一材料以形成结构。 该方法还包括在该结构内沉积第二材料。 第二材料可以具有电性能，并且该方法还包括提供对第二材料的电接触以能够观察一个或多个电性质。