公开(公告)号：US20090301607A1

公开(公告)日：2009-12-10

申请号：US12084793

申请日：2006-11-10

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

IPC: B23K35/14

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract translation: 本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性， 温度焊接。 焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。

公开(公告)号：US20090274834A1

公开(公告)日：2009-11-05

申请号：US12113628

申请日：2008-05-01

Applicant: Naveen Chopra ,  Yiliang Wu ,  Peter M. Kazmaier

Inventor： Naveen Chopra ,  Yiliang Wu ,  Peter M. Kazmaier

IPC: B05D5/12 ,  H01B1/02

CPC classification number: H05K1/097 ,  C09D11/52 ,  H01L21/4867 ,  H05K3/102 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125

Abstract: A method of forming conductive features on a substrate from a solution of metal nanoparticles by providing a depositing solution and liquid depositing the depositing solution onto a substrate. The depositing solution is then heated to a temperature below about 140° C. to anneal the first and second nanoparticles and remove any reaction by-products. The depositing solution may be comprised of a mixture of first metal nanoparticles and second metal nanoparticles or a combination of first metal nanoparticles and a soluble second metal nanopartical precursor. Furthermore, the average diameter of the first metal nanoparticles is about 50 nm to about 100 μm and the average diameter of the second metal nanoparticles is about 0.5 nm to about 20 nm.

Abstract translation: 一种通过提供沉积溶液和将沉积溶液沉积在基底上的金属纳米颗粒溶液在基底上形成导电特征的方法。 然后将沉积溶液加热到低于约140℃的温度，以退火第一和第二纳米颗粒并除去任何反应副产物。 沉积溶液可以由第一金属纳米颗粒和第二金属纳米颗粒的混合物或第一金属纳米颗粒和可溶性第二金属纳米颗粒前体的组合构成。 此外，第一金属纳米颗粒的平均直径为约50nm至约100μm，第二金属纳米颗粒的平均直径为约0.5nm至约20nm。

公开(公告)号：US20090269598A1

公开(公告)日：2009-10-29

申请号：US12427275

申请日：2009-04-21

Applicant: Naomichi OHASHI ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Arata KISHI ,  Takayuki HIGUCHI

Inventor： Naomichi OHASHI ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Arata KISHI ,  Takayuki HIGUCHI

IPC: H01B1/22 ,  B32B15/08

CPC classification number: H01B1/22 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/0272 ,  Y10T428/31681 ,  H01L2224/05599

Abstract: A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

Abstract translation: 导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点 第二导电填料15℃至45℃。 并且第二通量的熔点等于或小于第二导电填料的熔点。

公开(公告)号：US20090139608A1

公开(公告)日：2009-06-04

申请号：US11887181

申请日：2006-03-29

Applicant: Norihito Tanaka ,  Yasuki Shimamura

Inventor： Norihito Tanaka ,  Yasuki Shimamura

IPC: B23K35/22 ,  H01B1/02

CPC classification number: H05K3/3484 ,  B22F1/0059 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  H05K2201/0272

Abstract: There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.

Abstract translation: 提供了具有高耐热性的导电填料，其可在回流焊热处理条件下熔融粘合无铅焊料，并且在接合之后，在相同的热处理条件下不熔化。 导电填料的特征在于，通过差示扫描量热法测量，其至少观察到一个亚稳金属合金相作为放热峰，并且在210-240℃中具有至少一个作为吸热峰的熔点 范围和300至450℃的范围，并且在246℃下热处理时，填料产生粘合物体，其通过差示扫描量热法测量，没有观察到作为吸热峰的熔点 210-240℃范围内，或者由210-240℃范围内的吸热峰面积计算出的熔融吸热温度，熔融吸热温度为从吸热峰值计算的接合前的填料的熔融吸热温度的90％以下 面积在210〜240摄氏度范围。

公开(公告)号：US20090096100A1

公开(公告)日：2009-04-16

申请号：US12246811

申请日：2008-10-07

Applicant: Ryoichi KAJIWARA ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

Inventor： Ryoichi KAJIWARA ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

IPC: H01L23/488 ,  H01L21/60 ,  H01B1/22

CPC classification number: H01L23/49562 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.

Abstract translation: 芯片接合部分由具有约15μm至200μm的最大粒径和Ag的粘合剂层的良好导电的Cu金属粉末金属地结合，并且微孔均匀地分散在接合层中。 利用这种结构，可以在不使用铅的情况下确保约260℃的回流电阻和热循环试验下的可靠性。

公开(公告)号：US20090029038A1

公开(公告)日：2009-01-29

申请号：US12140744

申请日：2008-06-17

Applicant: Kook Nam Han ,  Nam Soo Kim

Inventor： Kook Nam Han ,  Nam Soo Kim

IPC: B05D5/12

CPC classification number: H05K1/097 ,  H05K3/125 ,  H05K2201/0272 ,  H05K2203/013 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K2203/1157

Abstract: Disclosed is a method of forming a wiring pattern using nano-ink, including providing a mixture solution of at least one first metal selected from the group consisting of gold, silver, and copper and at least one second metal selected from the group consisting of lead, zinc, tin, indium, cadmium, gallium, and alloys thereof, having an average particle size ranging from 5 nm to 1 μm in a reducing atmosphere; forming a wiring pattern on a base layer using the mixture solution; and thermally treating the wiring pattern at 150˜300° C. in a reducing atmosphere. Even when metal having low electrical conductivity is used, a wiring pattern having high electrical conductivity can be formed. The use of the second metal having a low melting point enables thermal treatment at low temperatures, thus preventing damage to a base layer on which a wiring pattern is formed and preventing a reaction between the metal and the base layer.

Abstract translation: 公开了一种使用纳米油墨形成布线图案的方法，包括提供选自金，银和铜的至少一种第一金属和至少一种选自铅的第二金属的混合溶液 ，锌，锡，铟，镉，镓及其合金，在还原气氛中具有5nm至1μm的平均粒度; 使用混合溶液在基层上形成布线图案; 并在还原气氛中在150〜300℃下热处理布线图案。 即使使用具有低导电性的金属，也可以形成具有高导电性的布线图案。 使用具有低熔点的第二金属能够在低温下进行热处理，从而防止对其上形成布线图案的基底层的损坏，并防止金属和基底层之间的反应。

公开(公告)号：US20080260995A1

公开(公告)日：2008-10-23

申请号：US11871446

申请日：2007-10-12

Applicant: Hideyuki HIRAKOSO ,  Keisuke Abe ,  Yasuhiro Sanada

Inventor： Hideyuki HIRAKOSO ,  Keisuke Abe ,  Yasuhiro Sanada

IPC: B32B3/00 ,  C23C18/40 ,  C23C18/44

CPC classification number: H01L23/49883 ,  C09D11/30 ,  C09D11/52 ,  H01B1/22 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0272 ,  Y10T428/24355 ,  H01L2924/00

Abstract: To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration.An ink composition having fine metallic copper particles and/or fine copper hydride particles, and fine silver oxide particles or fine metallic silver particles, dispersed in a water-insoluble organic liquid, which composition has a solid content concentration of from 10 to 80 mass % and contains from 5 to 90 parts by mass of the fine metallic copper particles and/or fine copper hydride particles, and from 10 to 95 parts by mass of the fine silver oxide particles or fine metallic silver particles, per 100 parts by mass of the total solid content in the ink composition.

Abstract translation: 提供一种能够形成金属材料的油墨组合物，该金属材料对基材的粘合性优异且没有离子迁移。 具有分散在水不溶性有机液体中的细金属铜颗粒和/或细铜氢化物颗粒以及细小的氧化银颗粒或细金属银颗粒的油墨组合物，其固含量浓度为10〜80质量％ 并且含有5〜90质量份细金属铜颗粒和/或细铜氢化物颗粒，以及每100质量份的氧化银微粒或细金属银颗粒为10〜95质量份 油墨组合物中的总固体含量。

公开(公告)号：US20080182011A1

公开(公告)日：2008-07-31

申请号：US11627922

申请日：2007-01-26

Applicant: Hou T. Ng ,  Alfred I-Tsung Pan

Inventor： Hou T. Ng ,  Alfred I-Tsung Pan

IPC: H01C17/06 ,  C09D11/00

CPC classification number: H01C17/06506 ,  B82Y10/00 ,  C09D11/30 ,  H01C17/06546 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02601 ,  H01L21/02614 ,  H01L21/02628 ,  H01L27/1292 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/7869 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/0425

Abstract: An ink formulation of a circuit element includes a first powder having a first melting temperature, a second powder having a second melting temperature that is higher than the first melting temperature, and a polymer binder. A method of fabricating a circuit element on a substrate employs the ink formulation and includes depositing the ink formulation on a substrate, curing the polymer binder, and melting the first powder at the first melting temperature to yield a solid solution that forms the circuit element.

Abstract translation: 电路元件的油墨配方包括具有第一熔融温度的第一粉末，具有高于第一熔融温度的第二熔融温度的第二粉末和聚合物粘合剂。 在基板上制造电路元件的方法采用油墨配方，并且包括将油墨配制物沉积在基材上，固化聚合物粘合剂，以及在第一熔融温度下熔化第一粉末以产生形成电路元件的固溶体。

公开(公告)号：US20070176613A1

公开(公告)日：2007-08-02

申请号：US11627844

申请日：2007-01-26

Applicant: Minoru Ogawa ,  Kazuto Nishimoto

Inventor： Minoru Ogawa ,  Kazuto Nishimoto

IPC: G01R31/02

CPC classification number: G02B6/138 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1533 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/186 ,  H05K3/365 ,  H05K3/386 ,  H05K3/4015 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/064 ,  H05K2201/09163 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract translation: 印刷电路板组件具有多个印刷电路板，它们被堆叠而彼此机械地和电连接，并且提供了将相邻的两个印刷电路板彼此连接的连接层。 连接层包括绝缘部分和导电部分。 绝缘部分包含绝缘部件并且粘附到相邻的两个印刷电路板中的每一个。 导电部分穿过绝缘部分并连接相邻的两个印刷电路板的电极端子。

公开(公告)号：US20070131912A1

公开(公告)日：2007-06-14

申请号：US11177901

申请日：2005-07-08

Applicant: Davide Simone ,  Thomas Angeliu ,  Sandeep Tonapi ,  David Gibson ,  Jian Zhang

Inventor： Davide Simone ,  Thomas Angeliu ,  Sandeep Tonapi ,  David Gibson ,  Jian Zhang

IPC: H01B1/12

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C08K3/08 ,  C08K2201/011 ,  C08L83/00 ,  C08L2666/54 ,  C09J9/02 ,  C09J11/04 ,  C09J183/04 ,  C09J2483/00 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

Abstract translation: 本发明提供一种导电粘合剂组合物，其具有固化的低模量弹性体和冶金结合的微米级金属颗粒和纳米尺寸的金属颗粒。 低弹性弹性体通过减轻产生的应力来提供机械坚固性和可靠性; 并且冶金结合的微米级金属颗粒和纳米级金属颗粒提供具有最小界面电阻的连续导电路径。 纳米尺寸金属颗粒的添加降低了熔化温度，并允许在可控温度下进行冶金结合。