公开(公告)号：US20020110697A1

公开(公告)日：2002-08-15

申请号：US10068957

申请日：2002-02-11

Applicant: Minebea Co., Ltd.

Inventor： Takaaki Ono ,  Sadayuki Toda

IPC: B32B015/08

CPC classification number: B32B15/12 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/28 ,  H05K2201/0284 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31522 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/31982 ,  Y10T428/31993

Abstract: In a single-sided paper phenolic resin copper-clad laminate composed of a phenolic resin impregnated paper base having copper foils laminated on and resists applied on the face side thereof, resists formed of the same material as the resists on the face side are applied also on the reverse side of the phenolic resin impregnated paper base, so that the face side and the reverse side match approximately with each other in thermal expansibility. The single-sided paper phenolic resin copper-clad laminate warps only slightly even when the peak temperature is raised to a degree suitable for lead-free solder in the reflow process for mounting electronic components.

Abstract translation: 在由具有层压在其上并且在其表面上施加的抗蚀剂的具有铜箔的酚醛树脂浸渍纸基底组成的单面纸酚醛树脂覆铜层压体中，由与正面上的抗蚀剂相同的材料形成的抗蚀剂也被施加 在酚醛树脂浸渍纸基材的相反侧，使得面侧和反面在热膨胀性中彼此大致相配。 单面纸酚醛树脂覆铜层压板在仅用于安装电子部件的回流工艺中将峰值温度升高至适合于无铅焊料的程度时，仅略微翘曲。

公开(公告)号：US06420017B1

公开(公告)日：2002-07-16

申请号：US09599303

申请日：2000-06-22

Applicant: Yoshinari Matsuda ,  Tomohide Koguchi

Inventor： Yoshinari Matsuda ,  Tomohide Koguchi

IPC: B32B1500

CPC classification number: H05K3/4069 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K1/116 ,  H05K2201/0284 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2203/1178 ,  H05K2203/1453 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249953 ,  H01L2924/00

Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for finning the copper paste, is provided.

Abstract translation: 本发明提供一种能够防止铜膏的爆裂或空隙现象​​的刚性印刷线路板以及刚性印刷线路板的制造方法。 一种刚性印刷布线板，其特征在于，包括具有纸苯酚或纸环氧树脂作为基底的覆铜层压板，其中在通孔附近设置有用于使铜膏熔化的通孔。

公开(公告)号：US06339116B1

公开(公告)日：2002-01-15

申请号：US08770212

申请日：1996-12-19

Applicant: Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

Inventor： Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

IPC: C08G5900

CPC classification number: C08H6/00 ,  H05K1/0313 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

Abstract translation: 描述了生物基交联组合物，制造方法和结构，特别是使用组合物的生物基印刷线路板和制造结构的方法。 生物基材料如木质素，作物油，木材树脂，单宁和多糖及其组合是优选使用热交联剂和引发剂交联的。 制造的材料具有适用于印刷线路板的性能，其通过用生物基材料，交联剂和引发剂的混合物浸渍玻璃纤维或生物基布而制成，其通过常规方法加工以生产印刷线路板。

公开(公告)号：US20010032698A1

公开(公告)日：2001-10-25

申请号：US09886452

申请日：2001-06-21

Applicant: MicroTouch Systems, Inc.

Inventor： Frank J. Bottari

IPC: B44C001/00

CPC classification number: G06F3/045 ,  H05K3/207 ,  H05K3/28 ,  H05K2201/0284 ,  H05K2201/09436 ,  H05K2203/0531 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

Abstract translation: 一种将边缘电极图案应用于触摸屏面板的方法，包括在贴纸上印刷边缘电极图案; 在电极图案上涂覆覆盖层; 去除贴纸; 并将边缘电极图案转移到触摸屏面板。 按照这种方法使用的贴花。

公开(公告)号：US06200074B1

公开(公告)日：2001-03-13

申请号：US09287811

申请日：1999-04-07

Applicant: James J. Miller ,  Paul E. Dinneweth ,  Hans Vandervelde ,  James T. Hegeduis

Inventor： James J. Miller ,  Paul E. Dinneweth ,  Hans Vandervelde ,  James T. Hegeduis

IPC: B23B3500

CPC classification number: H05K3/0047 ,  B23B35/005 ,  B23B2250/12 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/561 ,  Y10T408/5623

Abstract: A method and materials for drilling through-holes in printed circuit boards with a drilling tool is disclosed. The method involves the use of a lubricating entry material placed on the top surface of a stack of printed circuit boards and a lubricating backup board placed beneath the bottom surface of the stack of printed circuit boards. The lubricating entry material has a core with skins attached on both sides by a lubricant/adhesive. Similarly, the backup board has a core with skins attached on both sides by a lubricant/adhesive. The skins are hard enough to support the top and bottom surfaces of the printed circuit boards and thereby reduce burring at the entry point and exit point of the through-hole. The lubricant/adhesive coats the drilling tool during the drilling operation to reduce friction and thereby reduce the temperature of the drilling tool.

Abstract translation: 公开了一种用于在具有钻孔工具的印刷电路板中钻通孔的方法和材料。 该方法包括使用放置在印刷电路板堆叠的顶表面上的润滑入口材料和布置在印刷电路板堆叠的底表面下方的润滑支撑板。 润滑进入材料具有芯，其两侧通过润滑剂/粘合剂附着表皮。 类似地，备用板具有通过润滑剂/粘合剂在两侧附着表皮的芯。 表皮很难承受印刷电路板的顶表面和底表面，从而减少通孔入口点和出口处的毛刺。 润滑剂/粘合剂在钻孔操作期间涂覆钻孔工具以减少摩擦，从而降低钻具的温度。

公开(公告)号：US6136127A

公开(公告)日：2000-10-24

申请号：US166494

申请日：1998-10-05

Applicant: Norman P. De Bastiani

Inventor： Norman P. De Bastiani

IPC: C09J7/02 ,  B41M3/12 ,  B44C1/17 ,  C09D11/00 ,  C09J201/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/20 ,  H05K3/24 ,  H05K3/38 ,  B44C1/165 ,  B32B31/00 ,  C09J31/00

CPC classification number: B41M3/12 ,  B44C1/1737 ,  H05K3/207 ,  H05K1/0269 ,  H05K1/0393 ,  H05K1/162 ,  H05K2201/0108 ,  H05K2201/0284 ,  H05K2203/0156 ,  H05K2203/0278 ,  H05K2203/0531 ,  H05K2203/166 ,  H05K3/386 ,  Y10S428/914

Abstract: An electrically functional adhesive transfer for use in the manufacture and/or the design of flexible membrane circuits. Electrical circuit elements, instead of being printed directly upon polyester film substrates, are printed upon a carrier sheet. A pressure sensitive adhesive is applied over the exposed surfaces of the printed circuit pattern on the carrier sheet and covered by a release paper. The circuit later is applied to any desired substrate by peeling away the release paper and mounting the circuit by means of the pressure sensitive adhesive. The carrier sheet typically is peeled away after the circuit is adhesively bonded to the substrate. The carrier sheet desirably is transparent or translucent in order to facilitate visual alignment of the circuit pattern with the substrate to which it is being bonded.

Abstract translation: 用于制造和/或设计柔性膜电路的电功能粘合剂转移。 电路元件代替直接印在聚酯薄膜基片上，印在载体片上。 将压敏粘合剂施加在载体片上的印刷电路图案的暴露表面上并被隔离纸覆盖。 该电路稍后通过剥离剥离纸并通过压敏粘合剂安装电路而应用于任何所需的基板。 在电路粘合到基板上之后，载体片通常被剥离。 载体片材期望地是透明或半透明的，以便于电路图案与其所粘合的基底的视觉对准。

公开(公告)号：US6042936A

公开(公告)日：2000-03-28

申请号：US936045

申请日：1997-09-23

Applicant: Ulrich W. Kempf

Inventor： Ulrich W. Kempf

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/16 ,  B32B9/00

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进用于制造表面贴装集成电路的高性能电路板。

公开(公告)号：US5986613A

公开(公告)日：1999-11-16

申请号：US807990

申请日：1997-03-03

Applicant: Klaus Weber

Inventor： Klaus Weber

IPC: B60S1/02 ,  H05B3/84 ,  H05K1/03 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H01Q1/32

CPC classification number: H05B3/84 ,  B60S1/026 ,  H05K3/207 ,  H05B2203/016 ,  H05K1/0306 ,  H05K2201/0284 ,  H05K2203/0531 ,  H05K3/28 ,  H05K3/403

Abstract: An electric contact for connecting a conductive system present on an insulating substrate, in particular for automobile windshields, in which the conductive system is connected via a conductive path with an electric mating contact. A moisture-resistant electric contact which is easy to manufacture and can be universally used consists of a conductive path which is disposed directly on a support substrate as a path-shaped conductive layer on which an electric connecting line of the conductive system is located.

Abstract translation: 一种用于连接存在于绝缘基板上，特别是汽车挡风玻璃上的导电系统的电触头，其中导电系统通过导电路径与电配合触点连接。 易于制造和可广泛使用的防湿电触点由直接设置在支撑基板上作为导电系统的电连接线所在的路径状导电层的导电路径组成。

公开(公告)号：US4578308A

公开(公告)日：1986-03-25

申请号：US647638

申请日：1984-09-06

Applicant: Kiyoshi Hani ,  Takako Takei ,  Minekazu Kodama ,  Toshiyuki Sugano

Inventor： Kiyoshi Hani ,  Takako Takei ,  Minekazu Kodama ,  Toshiyuki Sugano

IPC: B32B15/092 ,  B32B5/28 ,  B32B15/08 ,  D21H13/02 ,  D21H13/10 ,  D21H13/46 ,  D21H17/38 ,  D21H17/46 ,  D21H17/67 ,  H05K1/03 ,  B32B5/22 ,  B32B15/12

CPC classification number: H05K1/0366 ,  B32B15/08 ,  D21H13/46 ,  D21H13/02 ,  D21H13/10 ,  D21H17/38 ,  D21H17/46 ,  D21H17/67 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/903 ,  Y10S428/904 ,  Y10T428/31703 ,  Y10T442/616 ,  Y10T442/693

Abstract: A laminated board lined with thermally and electrically conductive material, which comprises:(a) a prepreg sheet formed of an alumina paper made from a mixture of alumina fibril, as the principal component, having a fiber diameter of 100 microns or smaller and a fiber length which is ten times or more as long as the fiber diameter, and microfibrillar organic fiber as a binding agent, and a thermosetting resin; and(b) an electrically conductive material in foil such as copper or aluminum bonded to said prepreg sheet.

Abstract translation: 一种衬有导热材料的层压板，包括：（a）由氧化铝纸制成的预浸薄板，该氧化铝纸由氧化铝原纤维作为主要成分的混合物制成，纤维直径为100微米或更小，纤维 长度为纤维直径的十倍以上的长度，作为粘合剂的微原纤维有机纤维，以及热固性树脂; 和（b）结合到所述预浸料片上的诸如铜或铝的箔中的导电材料。

公开(公告)号：US4477512A

公开(公告)日：1984-10-16

申请号：US490061

申请日：1983-04-29

Applicant: Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

Inventor： Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

IPC: C08L61/00 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04 ,  C08G59/00 ,  C08G59/30 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08G59/62 ,  C08J5/10 ,  C08J5/24 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01B3/40 ,  H05K1/03 ,  B32B5/06

CPC classification number: C08G59/30 ,  B32B27/04 ,  C08G59/32 ,  C08G59/38 ,  C08G59/621 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31989 ,  Y10T442/2992 ,  Y10T442/3439 ,  Y10T442/3813

Abstract: A prepreg useful as the core in flame resistant cooper clad, composite, printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a brominated epoxy or epoxy resin and reactive flame retarding additive containing bromine and phenolic hydroxyl groups (e.g., tetrabromobisphenol A), phenolic novolac oligomer as curing agent, unsaturated epoxidized oil, and optionally, a suitable catalyst; and then heating the impregnated substrate to the "B"-stage.

Abstract translation: 通过用含有溴化环氧树脂或环氧树脂的浸渍剂和含溴和酚羟基的反应性阻燃添加剂浸渍多孔基材来制备用作阻燃铜包层复合印刷电路板中的核心的预浸料坯（例如， 四溴双酚A），酚醛清漆低聚物作为固化剂，不饱和环氧化油和任选的合适的催化剂; 然后将浸渍的基材加热到“B”级。