公开(公告)号：US4559264A

公开(公告)日：1985-12-17

申请号：US461566

申请日：1983-01-27

Applicant: Syed N. Hoda ,  Anthony R. Olszewski

Inventor： Syed N. Hoda ,  Anthony R. Olszewski

IPC: C04B35/16 ,  C01B33/26 ,  C01B33/40 ,  C01B33/42 ,  C01B33/44 ,  D21H13/36 ,  D21H13/44 ,  D21H17/67 ,  D21H19/24 ,  H01B3/04 ,  H01B3/52 ,  H05K1/03 ,  B32B19/00 ,  B32B27/38

CPC classification number: H05K1/0366 ,  D21H13/44 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/251 ,  Y10T428/2911 ,  Y10T428/31518

Abstract: There are disclosed synthetic mica papers, substrates produced by laminating such papers, and use of the substrates in printed circuit assemblies. The mica paper is composed primarily of overlapping, ion-exchanged platelets of a synthetic, lithium and/or sodium, water-swelling mica, and is impregnated with an organic resin.

Abstract translation: 公开了合成云母纸，通过层压这样的纸制造的基板以及印刷电路组件中的基板的使用。 云母纸主要由合成，锂和/或钠水溶胀云母的重叠离子交换的血小板组成，并用有机树脂浸渍。

公开(公告)号：US4477512A

公开(公告)日：1984-10-16

申请号：US490061

申请日：1983-04-29

Applicant: Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

Inventor： Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

IPC: C08L61/00 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04 ,  C08G59/00 ,  C08G59/30 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08G59/62 ,  C08J5/10 ,  C08J5/24 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01B3/40 ,  H05K1/03 ,  B32B5/06

CPC classification number: C08G59/30 ,  B32B27/04 ,  C08G59/32 ,  C08G59/38 ,  C08G59/621 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31989 ,  Y10T442/2992 ,  Y10T442/3439 ,  Y10T442/3813

Abstract: A prepreg useful as the core in flame resistant cooper clad, composite, printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a brominated epoxy or epoxy resin and reactive flame retarding additive containing bromine and phenolic hydroxyl groups (e.g., tetrabromobisphenol A), phenolic novolac oligomer as curing agent, unsaturated epoxidized oil, and optionally, a suitable catalyst; and then heating the impregnated substrate to the "B"-stage.

Abstract translation: 通过用含有溴化环氧树脂或环氧树脂的浸渍剂和含溴和酚羟基的反应性阻燃添加剂浸渍多孔基材来制备用作阻燃铜包层复合印刷电路板中的核心的预浸料坯（例如， 四溴双酚A），酚醛清漆低聚物作为固化剂，不饱和环氧化油和任选的合适的催化剂; 然后将浸渍的基材加热到“B”级。

公开(公告)号：US4456657A

公开(公告)日：1984-06-26

申请号：US314014

申请日：1981-10-22

Applicant: Robert Cassat ,  Bruno Vignando

Inventor： Robert Cassat ,  Bruno Vignando

IPC: H05K3/46 ,  B32B15/14 ,  H05K1/03 ,  B32B15/06 ,  B32B17/10 ,  B32B19/04

CPC classification number: H05K1/036 ,  B32B15/14 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31623 ,  Y10T428/31634 ,  Y10T428/31656 ,  Y10T428/31659 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/3188 ,  Y10T428/31949 ,  Y10T428/31975

Abstract: A metallized, laminated substrate well adapted for the production of printed circuits is comprised of:(A) an electrically insulating support element which comprises (a) a central core member comprising a major proportion by weight of a cellulosic or mica filler and a minor proportion by weight of a thermosetting resin, and (b) and (b') a pair of skin laminae coextensively secured to each face surface, respectively, of said central core (a) each of said skin laminae comprising a fibrous glass, asbestos or heat-stable synthetic polymer reinforcing filler, and a thermosetting resin impregnant, which thermosetting resin may either be the same as or different from the thermosetting resin comprising said central core member (a); and(B) an electrically conducting metal foil (c) coextensively adhered to the exposed face surface of one or the other of said skin laminae (b) or (b').

Abstract translation: 适用于生产印刷电路的金属化层压基板包括：（A）电绝缘支撑元件，其包括（a）包含主要重量比的纤维素或云母填料和较小比例的中心芯构件 （b）和（b'）分别固定到所述中心芯（a）的每个面表面的一对皮肤层，每个所述皮肤层包括纤维状玻璃，石棉或热 稳定的合成聚合物增强填料和热固性树脂浸渍剂，该热固性树脂可以与包含所述中心芯构件（a）的热固性树脂相同或不同; 和（B）与所述皮肤层（b）或（b'）中的一个或另一个的暴露的表面共同粘合的导电金属箔（c）。

公开(公告)号：US4327143A

公开(公告)日：1982-04-27

申请号：US228016

申请日：1981-01-23

Applicant: William M. Alvino ,  Janet L. Hammill ,  Martin P. Seidel

Inventor： William M. Alvino ,  Janet L. Hammill ,  Martin P. Seidel

IPC: B32B27/04 ,  C08G59/40 ,  C08J5/24 ,  H05K1/03 ,  B32B7/00 ,  B05D3/02 ,  C09J5/02 ,  H05K1/00

CPC classification number: C08J5/24 ,  B32B27/04 ,  C08G59/4021 ,  H05K1/0326 ,  H05K1/036 ,  C08J2363/00 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/3431

Abstract: A resin impregnated, B-staged sheet material free of crystal formations, useful for metal clad and unclad laminate production, is made by impregnating a sheet containing a resin comprising epoxy resin and an amount of curing agent effective to cure the epoxy resin to the C-stage, where the curing agent consists essentially of the reaction product of dicyandiamide and an aminophylic reagent selected from the group consisting of aldehydes, alkyl monoglycidyl ethers having the formula: ##STR1## where R=an alkyl group having from 1 to 4 carbon atoms, styrene oxide, ethylene oxide, propylene oxide, acetic anhydride, benzoyl chloride, acetyl chloride, and mixtures thereof, and then heating the impregnated sheet until the resin is in the B-stage.

Abstract translation: 通过将含有环氧树脂的树脂和一定量的有效固化环氧树脂的固化剂的片浸渍到C中来制备可用于金属包覆和未包覆层压板生产的不含结晶形成的树脂浸渍的B阶片材 阶段，其中固化剂基本上由双氰胺和选自以下的氨基酚试剂的反应产物组成：醛，具有下式的烷基单缩水甘油醚：其中R =具有1至4个碳原子的烷基 ，氧化苯乙烯，环氧乙烷，环氧丙烷，乙酸酐，苯甲酰氯，乙酰氯及其混合物，然后加热浸渍的片材直到树脂处于B阶段。

公开(公告)号：US3972765A

公开(公告)日：1976-08-03

申请号：US448236

申请日：1974-03-05

Applicant: Terutake Kondo ,  Syunya Yokozawa

Inventor： Terutake Kondo ,  Syunya Yokozawa

IPC: B32B15/04 ,  B32B17/04 ,  C03C25/36 ,  C08J5/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/38 ,  C09J5/04

CPC classification number: C03C25/36 ,  H05K1/0366 ,  H05K2201/0166 ,  H05K2201/0239 ,  H05K2201/0293 ,  H05K3/389 ,  Y10S428/901 ,  Y10T428/2962 ,  Y10T428/2971 ,  Y10T428/31612 ,  Y10T428/31627 ,  Y10T428/31663 ,  Y10T442/67

Abstract: In preparing an epoxy resin laminate sheet by impregnating a nonwoven fabric of glass fiber with an epoxy resin to form a prepreg, laminating a predetermined number of so formed prepregs and pressing, while heating, the laminate, when the nonwoven fabric of glass fiber to be used as a substrate is treated with a liquid mixture containing a water-soluble phenol resin and a silane coupler prior to the impregnation step, a laminate sheet suitable for formation of a printed circuit board can be obtained at a low manufacturing cost. The so formed laminate sheet not only has excellent heat resistance, drilling workability and punching workability at room temperature but also is characterized by such an excellent property that when it is subjected to the boiling water treatment, the degree of reduction of electric properties such as the insulation resistance is very small and whitening of the substrate is not caused to occur.

Abstract translation: 在通过用环氧树脂浸渍玻璃纤维无纺布以形成预浸料坯来制备环氧树脂层压片材时，在加热时层叠预定数量的这样形成的预浸料坯并加压层压体，当玻璃纤维的无纺布为 在浸渍步骤之前用作含有水溶性酚醛树脂和硅烷偶联剂的液体混合物作为基材的处理可以以低的制造成本获得适于形成印刷电路板的层压片。 如此形成的层合板不仅在室温下具有优异的耐热性，钻孔加工性和冲压加工性，而且还具有如下优异的特性：当进行沸水处理时，电性能的降低程度 绝缘电阻非常小，不会发生基板的白化。

公开(公告)号：US3934067A

公开(公告)日：1976-01-20

申请号：US489282

申请日：1974-07-17

Applicant: Ira Bernard Goldman ,  John Francis Henrickson

Inventor： Ira Bernard Goldman ,  John Francis Henrickson

IPC: C08L63/00 ,  D06M15/507 ,  D06M15/55 ,  H04R25/00 ,  H05K1/03 ,  B32B27/38 ,  B32B15/08

CPC classification number: H05K1/0366 ,  C08L63/00 ,  D06M15/507 ,  D06M15/55 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S273/03 ,  Y10S428/901 ,  Y10T428/31522 ,  Y10T428/31786 ,  Y10T442/2861

Abstract: A method of improving the dimensional and thermal stability of a fibrous web containing substrate is disclosed. A uniformly or randomly spun or bonded fabric or textile support is impregnated with a curable polymer resin, e.g., an epoxy-polyester resin. The impregnated resin is then fully cured whereupon a polymer resin coat is applied thereto. The coat is maintained in a partial cure state whereby a laminate comprising an internal woven or bonded fabric skeleton impregnated with a fully cured polymer resin and coated with a layer of a partially cured polymer resin is obtained.

Abstract translation: 公开了一种改善含纤维网的基材的尺寸和热稳定性的方法。 用可固化聚合物树脂例如环氧 - 聚酯树脂浸渍均匀或随机纺丝或粘合的织物或织物载体。 然后将浸渍的树脂完全固化，由此施加聚合物树脂涂层。 将该涂层保持在部分固化状态，由此获得包含浸渍有完全固化的聚合物树脂并涂覆有部分固化的聚合物树脂层的内部织造或粘合织物骨架的层压体。

公开(公告)号：US3617613A

公开(公告)日：1971-11-02

申请号：US3617613D

申请日：1968-10-17

Applicant: SPAULDING FIBRE CO

Inventor： BENZINGER JAMES R ,  KROTH CANISIUS E

IPC: B29C70/00 ,  H05K1/03 ,  H05K1/00 ,  B32B3/10

CPC classification number: B32B5/26 ,  B29C70/00 ,  B29K2309/08 ,  B32B5/022 ,  B32B5/024 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2309/10 ,  B32B2457/08 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T156/1092 ,  Y10T428/23979 ,  Y10T428/24967 ,  Y10T428/31518 ,  Y10T442/3065

Abstract: A punchable printed circuit board base laminate formed by laminating thermosetting resin impregnated woven glass fiber sheets in which the glass yarn filament diameters are between about 3 and 14 microns to the surfaces of a thermosetting resin impregnated nonwoven fiber glass core, the fibers of which have diameters in the range of 0.2 to 14 microns and lengths of between 1/32 and 1/4 inch, the laminate thickness being from 1/32 to about 3/32 of which the core thickness is about from 50 to 90 percent.

公开(公告)号：US3558423A

公开(公告)日：1971-01-26

申请号：US3558423D

申请日：1967-10-16

Applicant: ELECTRONIZED CHEM CORP

Inventor： ROSSETTI LOUIS F JR

IPC: H01B3/08 ,  H05K1/02 ,  H05K1/03 ,  B32B15/08 ,  B32B17/10 ,  C09J5/00

CPC classification number: H05K1/0366 ,  H01B3/084 ,  H05K1/024 ,  H05K1/032 ,  H05K2201/0158 ,  H05K2201/0293 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T428/31645 ,  Y10T428/31692 ,  Y10T442/3423 ,  Y10T442/656

Abstract: THIS DISCLOSURE DESCRIBES AN INEXPENSIVE, LOW LOSS, HIGH TEMPERATURE RESISTANT, EASILY FABRICATED, POLYETHYLENEFIBERGLASS, DIELECTRIC MATERIAL SUITABLE FOR USE IN MICROWAVE FREQUENCY COMMUNICATION DEVICES AND THE PROCESS FOR MAKING THE SAME. THIS MATERIAL MAY BE FABRICATED SO AS TO BE USEFUL AS PRINTED CIRCUIT BOARDS, STRIP TRANSMISION LINES, INSULATING COMPONENTS AND THE LIKE.

D R A W I N G

公开(公告)号：US3433888A

公开(公告)日：1969-03-18

申请号：US3433888D

申请日：1967-01-24

Applicant: ELECTRO MECHANISMS INC

Inventor： TALLY SIDNEY K ,  DAHLGREN VICTOR F ,  STEARNS THOMAS H

IPC: B29C70/00 ,  B32B15/08 ,  H01R12/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/32 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/036 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/08 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/381 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/063 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31692 ,  Y10T442/3447

公开(公告)号：US3388036A

公开(公告)日：1968-06-11

申请号：US47141165

申请日：1965-07-12

Applicant: GEN ELECTRIC

Inventor： ALAMPI DANIEL A

IPC: B32B15/08 ,  B32B27/00 ,  H01B3/00 ,  H05K1/03

CPC classification number: B32B27/00 ,  B32B15/08 ,  H01B3/004 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/31529