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公开(公告)号：US08115228B2
公开(公告)日：2012-02-14
申请号：US12518644
申请日：2007-12-11
Applicant: Martinus Petrus Joseph Peeters , Virginie Mercier
Inventor： Martinus Petrus Joseph Peeters , Virginie Mercier
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L33/58 , H01L33/64 , H01L2224/16 , H01L2924/00014 , H05K1/0274 , H05K1/0306 , H05K1/111 , H05K3/243 , H05K2201/0108 , H05K2201/0326 , H05K2201/0347 , H05K2201/09381 , H05K2201/10106 , H05K2201/10636 , Y02P70/611 , H01L2224/05599
Abstract: Proposed is a lighting device (100), comprising LEDs (130) mounted on a transparent substrate (110), provided with a transparent electrically conductive layer (120) and a contact pad (140). The contact pad has a second part (142), extending away from a first part (141), for further reducing the current density in the conductive layer (120). This is advantageous for making the lighting device robust to large power dissipation, especially under high current testing conditions. Moreover, as the voltage drop over transparent conductive layer is reduced, the efficiency of the lighting device is increased.
Abstract translation: 提出了一种照明装置（100），其包括安装在透明基板（110）上的LED（130），设置有透明导电层（120）和接触垫（140）。 接触垫具有远离第一部分（141）延伸的第二部分（142），用于进一步降低导电层（120）中的电流密度。 这对于使得照明装置对于大的功率耗散是稳定的，特别是在高电流测试条件下是有利的。 此外，随着透明导电层上的电压降降低，照明装置的效率提高。
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公开(公告)号：US08111367B2
公开(公告)日：2012-02-07
申请号：US12250725
申请日：2008-10-14
Applicant: Hiroshi Ueda , Shigeaki Noumi
Inventor： Hiroshi Ueda , Shigeaki Noumi
IPC: G02F1/1345
CPC classification number: H05K3/323 , G02F1/13452 , H05K3/244 , H05K3/28 , H05K2201/0175 , H05K2201/0326 , H05K2201/10674
Abstract: A display device comprises a metallic wiring formed on an insulating substrate, an inorganic insulating film formed on the metallic wiring, an organic resin film formed on the inorganic insulating film, a transparent conductive film formed in a portion on the metallic wiring where the inorganic insulating film and the organic resin film are removed, a connection terminal formed in a region for mounting a driving IC external to the display region on the insulating substrate, and a bump of the driving IC connected to the connection terminal by an anisotropic conductive film in order to supply a signal to the display region. The region for mounting a driving IC includes a region where the inorganic insulating film and the organic resin film are formed on the metallic wiring and a region where the inorganic insulating film and the organic resin film are removed from the metallic wiring.
Abstract translation: 显示装置包括形成在绝缘基板上的金属布线，形成在金属布线上的无机绝缘膜，形成在无机绝缘膜上的有机树脂膜，形成在金属布线上的部分上的无机绝缘层的透明导电膜 膜和有机树脂膜被除去，形成在用于将绝缘基板上的显示区域外部的驱动IC安装的区域中的连接端子和通过各向异性导电膜连接到连接端子的驱动IC的凸起顺序 以向显示区域提供信号。 用于安装驱动IC的区域包括在金属布线上形成无机绝缘膜和有机树脂膜的区域以及从金属布线去除无机绝缘膜和有机树脂膜的区域。
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公开(公告)号：US20110298739A1
公开(公告)日：2011-12-08
申请号：US13152805
申请日：2011-06-03
Applicant: Ming-Kung WU , Kuo-Chang SU , Chia-Chi CHEN , Yu-Ting LIN
Inventor： Ming-Kung WU , Kuo-Chang SU , Chia-Chi CHEN , Yu-Ting LIN
IPC: G06F3/041
CPC classification number: H03K17/9618 , G02B1/11 , G06F1/1643 , G06F1/1692 , G06F3/041 , G06F3/0412 , G06F3/044 , G06F3/047 , H01H11/00 , H03K2017/9602 , H05K1/0296 , H05K1/0306 , H05K2201/0326 , H05K2201/09245 , H05K2201/10128 , H05K2201/10151 , Y10T29/49105
Abstract: A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a trace layer, a passivation layer and a sheltering layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region. The decorative layer is disposed on the transparent substrate and located in a non-touch-sensitive region, and the trace layer is disposed on the decorative layer. The passivation layer is disposed on the transparent substrate and at least covers the touch-sensing structure and the trace layer. The sheltering layer is disposed at least on the passivation layer and located in the non-touch-sensitive region.
Abstract translation: 触敏装置包括透明基板，触摸感测结构，装饰层，迹线层，钝化层和遮蔽层。 触摸感测结构设置在透明基板上并且位于触敏区域中。 装饰层设置在透明基板上并且位于非触敏区域中，并且迹线层设置在装饰层上。 钝化层设置在透明基板上，并且至少覆盖触摸感测结构和迹线层。 防护层至少设置在钝化层上并且位于非接触敏感区域中。
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公开(公告)号：US08066840B2
公开(公告)日：2011-11-29
申请号：US12018114
申请日：2008-01-22
Applicant: Mukundan Narasimhan , Todd Johnson , Bulent M. Basol
Inventor： Mukundan Narasimhan , Todd Johnson , Bulent M. Basol
CPC classification number: B32B38/10 , B32B38/06 , B32B2457/12 , H01L31/18 , H05K3/041 , H05K3/244 , H05K2201/0326 , H05K2203/0108 , H05K2203/0143 , Y10T156/1041 , Y10T156/1054 , Y10T156/107
Abstract: A method of forming metallic connector patterns for solar cells, whereby an embosser having raised features shaped in the form of a metallic connector pattern is used to attach a portion of a metallic foil to a transparent conductive layer formed on a top transparent surface of a solar cell structure. The raised surfaces of the embosser press the metallic foil portion against the transparent conductive layer. Heat and pressure directed to the metallic foil portion attach the metallic foil portion to the underlying transparent conductive layer, and then the rest of the metallic foil, which is not attached to the transparent conductive layer, is removed.
Abstract translation: 一种用于形成用于太阳能电池的金属连接器图案的方法，由此使用具有以金属连接器图案形式形成的凸起特征的压花器将金属箔的一部分附接到形成在太阳能的顶部透明表面上的透明导电层 细胞结构。 压花机的凸起表面将金属箔部分压靠在透明导电层上。 引导到金属箔部分的热和压力将金属箔部分附着到下面的透明导电层上，然后除去未附着到透明导电层的金属箔的其余部分。
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公开(公告)号：US07948477B2
公开(公告)日：2011-05-24
申请号：US11818394
申请日：2007-06-13
Applicant: Steve Porter Hotelling
Inventor： Steve Porter Hotelling
IPC: G06F3/041
CPC classification number: G06F3/044 , G06F3/0416 , G06F3/047 , G06F2203/04103 , G06F2203/04104 , G06F2203/04107 , H05K1/0353 , H05K1/11 , H05K3/10 , H05K2201/0108 , H05K2201/0326 , Y10T29/49165
Abstract: A space-efficient substantially transparent mutual capacitance touch sensor panel can be created by forming columns made of a substantially transparent conductive material on one side of a first substantially transparent substrate, forming rows made of the substantially transparent conductive material on one side of a second substantially transparent substrate, adhering the two substrates together with a substantially transparent adhesive, bringing column connections down to the second substrate using vias, and routing both the column and row connections to a single connection area on the second substrate. In addition, in some embodiments some of the row connections can be routed to a second connection area on the second substrate to minimize the size of the sensor panel.
Abstract translation: 可以通过在第一基本上透明的基板的一侧上形成由基本上透明的导电材料制成的列来形成空间有效的基本上透明的互电容式触摸传感器面板，在大体上透明的第二基板上的一侧形成由基本上透明的导电材料制成的行 透明基板，将两个基板与基本上透明的粘合剂粘合在一起，使用通孔将塔连接下降到第二基板，并将列和行连接路由到第二基板上的单个连接区域。 此外，在一些实施例中，一些行连接可以被路由到第二基板上的第二连接区域，以最小化传感器面板的尺寸。
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Patent Agency Ranking
公开(公告)号：US07943291B2
公开(公告)日：2011-05-17
申请号：US12490815
申请日：2009-06-24
Applicant: Tsukasa Tokunaga , Akira Ichiki , Yuichi Shirasaki
Inventor： Tsukasa Tokunaga , Akira Ichiki , Yuichi Shirasaki
CPC classification number: H05K3/106 , G03C1/853 , H05K2201/0209 , H05K2201/0326 , Y10T428/24802
Abstract: A photosensitive material for forming a conductive film having a support, a silver salt-containing emulsion layer over the support, and one or more optional layers formed over the support or the silver salt-containing emulsion layer side of the support, wherein any one of the silver salt-containing emulsion layer or the optional layer(s) contains conductive fine particles and a binder, and the ratio by mass of the conductive fine particles to the binder (the conductive fine particles/the binder) is from 1/33 to 1.5/1.
Abstract translation: 一种用于形成具有载体的导电膜的感光材料，在载体上的含银盐的乳液层，以及形成在载体上的一个或多个任选的层或载体的含银盐乳剂层侧，其中任何一个 含银盐乳剂层或任选的层含有导电性微粒和粘合剂，导电性微粒与粘合剂的比例（导电性微粒/粘合剂）的比例为1/33〜 1.5 / 1。
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公开(公告)号：US07918019B2
公开(公告)日：2011-04-05
申请号：US12351767
申请日：2009-01-09
Applicant: Shih Chang Chang , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
Inventor： Shih Chang Chang , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
IPC: H05K3/10
CPC classification number: G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
Abstract: A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
Abstract translation: 用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。 在一个实施例中，形成两个薄玻璃板的夹层，使得当在制造期间在夹层的表面上执行薄膜处理时，玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。 三明治可能最终分开形成两个薄的SITO / DITO面板。 在另一个实施例中，制造工艺包括层压两个图案化的厚基板，每个基板至少具有现有制造设备的最小厚度公差。 然后层压基板的一个或两个侧面变薄，使得当基板分离时，每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。
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公开(公告)号：US20100218978A1
公开(公告)日：2010-09-02
申请号：US12766002
申请日：2010-04-23
Applicant: David W. Caldwell , Michael Jon Taylor , Michael L. Marshall
Inventor： David W. Caldwell , Michael Jon Taylor , Michael L. Marshall
CPC classification number: C23C14/562 , G06F2203/04113 , H01L31/0232 , H05K1/02 , H05K1/0393 , H05K3/06 , H05K3/24 , H05K2201/0108 , H05K2201/0326 , H05K2203/0361 , H05K2203/1545 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical components and conductive traces forming an electrical circuit.
Abstract translation: 透明导电材料层设置在基板的表面上。 另外的导电材料层沉积在透明导电材料层上或衬底的相对表面上。 选择性地蚀刻这些层以产生用于安装电气部件和形成电路的导电迹线的焊盘的布局。
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公开(公告)号：US20100175249A1
公开(公告)日：2010-07-15
申请号：US12351767
申请日：2009-01-09
Applicant: Shih Chang CHANG , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
Inventor： Shih Chang CHANG , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
IPC: H05K3/10
CPC classification number: G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
Abstract: A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
Abstract translation: 用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。 在一个实施例中，形成两个薄玻璃板的夹层，使得当在制造期间在夹层的表面上执行薄膜处理时，玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。 三明治可能最终分开形成两个薄的SITO / DITO面板。 在另一个实施例中，制造工艺包括层压两个图案化的厚基板，每个基板至少具有现有制造设备的最小厚度公差。 然后层压基板的一个或两个侧面变薄，使得当基板分离时，每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。
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公开(公告)号：US20100059784A1
公开(公告)日：2010-03-11
申请号：US12518644
申请日：2007-12-11
Applicant: Martinus Petrus Joseph Peeters , Virginie Mercier
Inventor： Martinus Petrus Joseph Peeters , Virginie Mercier
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L33/58 , H01L33/64 , H01L2224/16 , H01L2924/00014 , H05K1/0274 , H05K1/0306 , H05K1/111 , H05K3/243 , H05K2201/0108 , H05K2201/0326 , H05K2201/0347 , H05K2201/09381 , H05K2201/10106 , H05K2201/10636 , Y02P70/611 , H01L2224/05599
Abstract: Proposed is a lighting device (100), comprising LEDs (130) mounted on a transparent substrate (110), provided with a transparent electrically conductive layer (120) and a contact pad (140). The contact pad has a second part (142), extending away from a first part (141), for further reducing the current density in the conductive layer (120). This is advantageous for making the lighting device robust to large power dissipation, especially under high current testing conditions. Moreover, as the voltage drop over transparent conductive layer is reduced, the efficiency of the lighting device is increased.
Abstract translation: 提出了一种照明装置（100），其包括安装在透明基板（110）上的LED（130），设置有透明导电层（120）和接触垫（140）。 接触垫具有远离第一部分（141）延伸的第二部分（142），用于进一步降低导电层（120）中的电流密度。 这对于使得照明装置对于大的功率耗散是稳定的，特别是在高电流测试条件下是有利的。 此外，随着透明导电层上的电压降降低，照明装置的效率提高。
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