公开(公告)号：US20080115968A1

公开(公告)日：2008-05-22

申请号：US11602914

申请日：2006-11-20

Applicant: Daewoong Suh ,  Stephen E. Lehman ,  Mukul Renavikar

Inventor： Daewoong Suh ,  Stephen E. Lehman ,  Mukul Renavikar

IPC: H01L23/49

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/11 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/81011 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/0341 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract translation: 描述了一种微电子组件及其制造方法。 在一个示例中，微电子组件包括具有一个或多个区域以接收一个或多个焊球的表面的微电子器件，所述一个或多个区域具有包括Ni的表面光洁度。 将包含Cu的焊料材料（例如焊剂或糊料）施加到Ni表面光洁度上，并且一个或多个焊球通过在一个或多个焊球之间形成焊料接头的回流工艺耦合到微电子器件，焊料 包含Cu的材料，并且所述一个或多个区域具有包括Ni的表面光洁度。

公开(公告)号：US20060065438A1

公开(公告)日：2006-03-30

申请号：US11231746

申请日：2005-09-22

Applicant: Kouki Yamamoto

Inventor： Kouki Yamamoto

IPC: H05K1/18

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K3/243 ,  H05K3/244 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/0209 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/09481 ,  H05K2201/0959 ,  H05K2201/09736 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the circuit component and the solder. The device further includes a base metal pattern which covers parts of the principal face of the resin substrate where the vias are exposed and is composed of a Cu layer and a Ni layer and a copper plated pattern which is provided on the base metal pattern and is composed of a Cu layer, a Ni layer, and an Au layer. The circuit component is provided on the copper plated pattern. The solder allows the copper plated pattern and the circuit component to adhere to each other.

Abstract translation: 电路部件安装装置包括树脂基板，通孔，由主体和电极部分组成的电路部件，焊料和覆盖电路部件和焊料的绝缘密封树脂。 该装置还包括基体金属图案，其覆盖树脂基板的主要面的部分，其中通孔露出，并且由Cu层和Ni层构成，并且镀铜图案设置在基底金属图案上，并且是 由Cu层，Ni层和Au层构成。 电路元件设置在镀铜图案上。 焊料允许镀铜图案和电路部件彼此粘附。

公开(公告)号：US5638598A

公开(公告)日：1997-06-17

申请号：US462853

申请日：1995-06-05

Applicant: Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

Inventor： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC classification number: H05K3/4069 ,  H05K3/0055 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.

Abstract translation: 制造布线板的方法包括在未完全固化的绝缘基板的两侧层压金属箔，然后加热压制; 在所得的层压板中钻孔以在其中连接电路; 在孔周围的狭窄区域中去除金属箔的部分，以在金属箔中形成中空部分; 并在孔和中空部分填充可流动的导电物质。

公开(公告)号：US5444189A

公开(公告)日：1995-08-22

申请号：US77722

申请日：1993-06-17

Applicant: Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

Inventor： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K1/00

CPC classification number: H05K1/116 ,  H05K3/0055 ,  H05K3/062 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652

Abstract: A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

Abstract translation: 一种布线板，包括一个或多个内层电路基板和由所述晚餐层电路基板两侧的金属箔层经由预浸料形成的外部电路层，所述内层电路基板包括绝缘层和金属箔层， 所述绝缘层，至少一个内层电路基板或所述外电路层或两者在金属箔层中具有填充有导电物质的中空部分，所述布线板至少在中空部分中具有一个或多个通孔，并填充 与导电物质具有高可靠性和高布线密度。

公开(公告)号：US4285991A

公开(公告)日：1981-08-25

申请号：US150174

申请日：1980-05-15

Applicant: Klaus Gedrat ,  Hans-Jurgen Ehrich ,  Hartmut Mahlkow ,  Joachim Wolff

Inventor： Klaus Gedrat ,  Hans-Jurgen Ehrich ,  Hartmut Mahlkow ,  Joachim Wolff

IPC: H05K3/46 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  B05D5/12 ,  C23F1/02

CPC classification number: H05K3/244 ,  H05K3/062 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/0341 ,  H05K2201/0344 ,  H05K2201/09736 ,  H05K2203/0571 ,  H05K2203/1407 ,  H05K3/243 ,  H05K3/28 ,  Y10T29/49165

Abstract: A method for producing printed circuits. An epoxy resin reinforced with glass fiber is used as basis material, coated with copper, drilled and activated. In one embodiment, the circuit diagram is applied after covering the non-desired regions with a resistance, by screen or photo printing. A nickel, cobalt, or nickel-cobalt layer is deposited onto the circuit, the circuit is covered with a solder prevention lacquer, then the eyes and bore holes are covered with copper. Alternatively, after pre-treatment and activation, all areas except the soldering eyes and bore holes are covered with resist, a nickel, cobalt or nickel-cobalt layer is applied, the circuit diagram is printed using a resist, and the eyes and bore hole are treated as above.

Abstract translation: 一种印刷电路的制造方法。 用玻璃纤维增​​强的环氧树脂用作基材，涂铜，钻孔和活化。 在一个实施例中，电路图在通过屏幕或照片打印覆盖不需要的区域之后被施加。 镍，钴或镍钴层沉积在电路上，电路用防焊漆覆盖，眼睛和钻孔被铜覆盖。 或者，在预处理和激活之后，除了焊接眼和钻孔之外的所有区域都被抗蚀剂覆盖，施加镍，钴或镍钴层，电路图使用抗蚀剂印刷，眼睛和钻孔 被视为如上。