Abstract:
A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.
Abstract:
A printed circuit board includes a signal layer and a supply voltage plane layer. The signal layer includes traces to communicate signals that are not associated with regulated supply voltages. The supply voltage plane is embedded in the signal layer to supply power to multiple supply voltage pins of a component that is mounted to the printed circuit board. The printed circuit board may also include a supply voltage plane layer to communicate a supply voltage. A ground plane may be embedded in the supply voltage plane layer to provide ground connections to multiple pins of the component.
Abstract:
A flexible conductor foil with an electronic circuit, consisting of at least one layer of a non-conductive material which comprises a conductor pattern on at least one of its surfaces, is characterized in that at least two of the conductor patterns, or parts of at least two of the conductor patterns form a magnetic component.
Abstract:
A composite monolithic electronic component has a laminate including a base layer having a relative dielectric coefficient of about 10 or less and a functional layer which is at least one of a high-dielectric-coefficient layer having a relative dielectric coefficient of about 15 or more and a magnetic layer. The base layer contains a crystallized glass containing SiO2, MgO, Al2O3 and B2O3, and a ceramic oxide having a thermal expansion coefficient of about 6.0 ppm/°C. or more. The functional layer contains an amorphous glass having a softening point of about 800° C. or less.
Abstract translation:复合单片电子部件具有层叠体,其具有相对介电系数为约10以下的基底层和作为相对介电系数为15以上的高介电常数层中的至少一种的功能层,以及 磁性层。 基层含有含有SiO 2,MgO,Al 2 O 3,B 2 O 3的结晶化玻璃,热膨胀系数约为6.0ppm /℃的陶瓷氧化物。 或者更多。 功能层含有软化点为约800℃以下的无定形玻璃。
Abstract:
A casting or embedding compound for shielding electronic components against electromagnetic radiation is formed of a polymer matrix, which includes 5 to 95 wt. % electrically non-conducting magnetic particles having a mean particle size in the range of 1 to 250 nullm.
Abstract:
A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of terminal connection patterns containing power input terminal connection patterns and power output terminal connection patterns are formed on the end portions of each of the circuit boards with the disposition positions substantially matching each other. The terminal connection patterns at the same position of each circuit board are sandwiched by each of clips of a common terminal member, each of the circuit boards is laminated and fixed, and the converter circuits of each of the circuit boards are connected in parallel. The conduction path for electrically connecting the converter circuit of each circuit board becomes short, making it possible to reduce conduction loss. Also, it is possible to mount a plurality of converter circuits without increasing the occupied area of a motherboard to be mated therewith in comparison with a case in which the circuit boards are provided side-by-side.
Abstract:
An isolated converter with a reduced size is disclosed. A small-sized multilayer sheet transformer includes a multilayer circuit board composed of a plurality of sheet substrates, coil patterns of primary and secondary coils disposed coaxially on the sheet substrates, and a core member disposed in a coil pattern unit formed of the coil patterns. In this multilayer sheet transformer, a coil pattern formed on the outer surface of the top layer and a coil pattern formed on the outer surface of the bottom layer are for the same coil on either the primary or secondary side. In the case where the coil patterns formed on the outer surfaces of the top and bottom layers of the multilayer sheet transformer are for the primary coil, an isolation gap is formed between the multilayer sheet transformer and a circuit on the secondary side to prevent an electrical breakdown between the primary and secondary sides. In the case where the coil patterns formed on the outer surfaces of the top and bottom layers of the multilayer sheet transformer are for the secondary coil, an isolation gap is formed between the multilayer sheet transformer and a circuit on the primary side to prevent an electrical breakdown between the primary and secondary sides.
Abstract:
A method for making a planar inductor is disclosed. The inductor is made by using a core with high magnetic flux. Outside the substrate, a layer of insulator and conductive foil is securely mounted. Thereafter, copper traces are formed on the insulator. Before the copper traces are formed, holes are defined and metalized to provide electrical connection between conductive foils on opposite sides of the core, which forms a planar inductance. Furthermore, if the copper traces are breaking up in a predetermined location, the planar inductance becomes a transformer.
Abstract:
The invention relates to an arrangement for implementing a planar magnetic circuit on a circuit board. The arrangement includes (a) printed circuit board (PCB), wherein a conductive wire pattern of an inductive circuit is formed as well as openings through the circuit board close to the conductive pattern, (b) two ferrite pieces, at least one of which can be fitted into the openings so that the pieces may be pressed against one another from opposite sides of the circuit board, and (c) a mechanical clamp which can be fitted around the ferrite pieces to lock them to each other, whereby the clamp extends around the ferrite pieces located on both sides of the circuit board. To eliminate gluing of ferrite pieces and to eliminate any relative movement between the ferrite pieces and the circuit board, the clamp is formed with spring-like protrusions which are fitted in relation to the openings in the circuit board so that they are pressed against the inner edges of the openings when the clamp is in its position around the ferrite pieces.
Abstract:
A secondary adapter for receiving a DC power signal and providing an ouput power signal as an input to an AC power adapter is disclosed. The AC power adapter may then provide a DC power signal to meet the input power requirements of an electronic appliance. While the AC power adapter is adapted to receive power from an AC power source, the secondary adapter converts a DC power source to provide an input power signal which is sufficient to power the AC power adapter. The secondary adapter enables the AC power adapter to provide power to the electronic appliance from either an AC power source or a DC power source.