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公开(公告)号：US4402450A
公开(公告)日：1983-09-06
申请号：US295043
申请日：1981-08-21
Applicant: Bruce C. Abraham , Charles R. Fegley
Inventor： Bruce C. Abraham , Charles R. Fegley
CPC classification number: B23K3/06 , H05K3/3436 , H05K3/3478 , H05K2201/0305 , H05K2201/1025 , H05K2201/1028 , H05K2201/10424 , H05K2201/10727 , H05K2203/033 , H05K2203/0405 , H05K2203/041 , H05K2203/0415 , H05K3/3442 , Y02P70/613
Abstract: Contact pads (18) of a device (12) are adapted for bonding components such as contacts of a circuit assembly thereto. At least two of the pads (18) are interconnected with a member (34) containing bonding material. Portions of the member (34) lying adjacent the pads (18) are then removed to form isolated bodies (42) containing bonding material on the pads (18). The member (37) may be of a composite structure containing bonding material associated with a hard element (61). The bodies (42) formed therefrom contain a hard element portion (62) having dimensions which remain substantially unchanged to define a desired minimum distance between respective pads (18) and contacts when they are bonded together.
Abstract translation: 设备（12）的接触焊盘（18）适于将诸如电路组件的触点的组件粘合到其上。 至少两个焊盘（18）与包含接合材料的构件（34）互连。 然后移除位于焊盘（18）附近的部件（34）的部分，以形成在焊盘（18）上包含结合材料的隔离体（42）。 构件（37）可以是包含与硬质元件（61）相关联的接合材料的复合结构。 由此形成的主体（42）包含具有保持基本上不变的尺寸的硬元件部分（62），以便当它们结合在一起时在相应的焊盘（18）和触点之间限定期望的最小距离。
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公开(公告)号：US4392181A
公开(公告)日：1983-07-05
申请号：US259748
申请日：1981-05-01
Applicant: Gary D. Jabben
Inventor： Gary D. Jabben
CPC classification number: H05K1/144 , H01R12/52 , H05K2201/1028 , H05K2201/10946
Abstract: A row of connectors 14 is assembled on a printed circuit board 11 by inserting a leg section 41 of each terminal 14 into a mounting aperture 32 and bending a flat contact portion 42 of each terminal 14 to fit into a pocket 47 formed in the surface of the board. Printed circuit conductors 13 are next screened onto the board 11 with a portion of the conductors positioned over some of the contact portions 42 of terminals 14 to provide edge connections for the printed circuits 12. Metal strips conductors 13 are then fastened to the board 11 and end portions thereof are welded to the contact portions 42 of other terminals 14 to provide edge connections for the metal strips conductors 13.
Abstract translation: 一排连接器14通过将每个端子14的腿部41插入到安装孔32中并弯曲每个端子14的平坦接触部分42而装配在印刷电路板11上，以装配到形成在 董事会。 印刷电路导体13接下来被屏蔽到板11上，其中一部分导体位于端子14的一些接触部分42上，以提供印刷电路12的边缘连接。金属带导体13然后被固定到板11上， 其端部焊接到其他端子14的接触部分42，以提供用于金属带导体13的边缘连接。
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公开(公告)号：US3964666A
公开(公告)日：1976-06-22
申请号：US564007
申请日：1975-03-31
Applicant: Donald Dinella , Richard M. Kovaric
Inventor： Donald Dinella , Richard M. Kovaric
IPC: B23K35/00 , H01H1/02 , H01R12/50 , H05K1/11 , H05K3/12 , H05K3/34 , H05K3/40 , H05K3/24 , H05K1/06
CPC classification number: H05K3/4015 , B23K35/007 , H01R23/70 , H05K3/341 , H05K1/117 , H05K2201/0338 , H05K2201/1028 , H05K2203/0195 , Y02P70/613 , Y10T29/49155
Abstract: In a thermocompressive soldering process, a conductive overlay of a material such as gold is applied to a contact finger of a circuit board.In carrying out this process, the overlay is initially carried on an adhesively coated strip such as a polyimide tape. To transfer the overlay to the contact finger, it is aligned with the contact finger and temporarily attached to the circuit board. A heat conductive resilient sheet is then interposed between the circuit board and a thermode. The thermode is adjusted to engage the contact finger with a predetermined force. The force is resiliently distributed by the interposed sheet. Heat is then applied from the thermode through the resilient sheet to liquefy a solder coating on the overlay and to bond the overlay to the contact finger upon resolidification of the solder. The applied force is sustained during the application of head and during a subsequent cooling period during which the solder resolidifies. The resilient sheet minimizes seepage of solder to the top surface of the overlay and thereby prevents contamination of such surface by the solder.
Abstract translation: 在热压焊工艺中，将诸如金的材料的导电覆盖层施加到电路板的接触指。
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公开(公告)号：US3729816A
公开(公告)日：1973-05-01
申请号：US3729816D
申请日：1971-12-02
Applicant: WESTERN ELECTRIC CO
Inventor： BURNS J
CPC classification number: H05K3/222 , H05K13/003 , H05K2201/1028 , H05K2201/10363 , H05K2203/173 , Y10T29/49004
Abstract: An electrical circuit is formed by a process which permits the electrical testing of portions of the circuit during the circuit forming process. One or more temporary crossover members are formed, which may interconnect certain circuit paths, while spanning and not contacting other paths eventually to be interconnected into the circuit. The temporary crossover members are preferably formed, along with any other crossover members and/or electrical components desired, on a carrier member and then transferred onto a dielectric substrate carrying the circuit paths. Electrical testing of the incomplete circuit follows. The circuit is thereafter completed with deformation of the temporary crossover members into electrical contact with the spanned circuit paths and bonding the deformed crossover portions to the spanned paths.
Abstract translation: 通过在电路形成过程中允许对电路的部分进行电测试的过程形成电路。 形成一个或多个临时交叉构件，其可以互连某些电路路径，同时跨越并且不接触最终互连到电路中的其他路径。 临时交叉构件优选与载体构件上所需的任何其它交叉构件和/或电组件一起形成，然后转移到承载电路路径的电介质衬底上。 不完全电路的电气测试如下。 然后，电路随着临时交叉构件的变形与跨接的电路路径电接触并将变形的交叉部分结合到跨越路径而完成。
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公开(公告)号：US2929964A
公开(公告)日：1960-03-22
申请号：US57412256
申请日：1956-03-27
Applicant: PLESSEY CO LTD
Inventor： EMYR RHYS-JONES JOHN
IPC: H05K13/00
CPC classification number: H05K3/103 , H05K3/202 , H05K2201/1028 , H05K2203/1469
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Patent Agency Ranking
公开(公告)号：US20190186726A1
公开(公告)日：2019-06-20
申请号：US15849402
申请日：2017-12-20
Applicant: Valeo North America, Inc.
Inventor： Gavin Warner , Julien Hemon , Jonathan Blandin
CPC classification number: F21V25/02 , F21S41/192 , F21V23/002 , F21V23/005 , F21V29/508 , F21V29/70 , F21W2103/20 , F21W2103/35 , F21Y2115/10 , H05K1/0203 , H05K1/0268 , H05K2201/066 , H05K2201/10106 , H05K2201/1028
Abstract: A circuitry assembly including an electrical component, a peripheral circuitry that supports the electrical component, a support assembly affixed to the peripheral circuitry to evacuate heat excess generated by the electrical component and the peripheral circuitry, a main circuitry separated from the support assembly by a spacing, the main circuitry having a plurality of detection bands, and a plurality of ribbons electrically connecting the peripheral circuitry with the main circuitry and deformable between an undamaged state and a damaged state, wherein in the undamaged state the plurality of ribbons steps over the spacing and the plurality of detection bands and in the damaged state at least one ribbon of the plurality of ribbons contacts at least one detection band of the plurality of detection bands and generate a short circuit.
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公开(公告)号：US10309635B1
公开(公告)日：2019-06-04
申请号：US15849402
申请日：2017-12-20
Applicant: Valeo North America, Inc.
Inventor： Gavin Warner , Julien Hemon , Jonathan Blandin
IPC: F21V25/02 , H05K1/02 , F21S41/19 , F21V23/00 , F21V29/508 , F21V29/70 , F21W103/35 , F21W103/20 , F21Y115/10
CPC classification number: F21V25/02 , F21S41/192 , F21V23/002 , F21V23/005 , F21V29/508 , F21V29/70 , F21W2103/20 , F21W2103/35 , F21Y2115/10 , H05K1/0203 , H05K1/0268 , H05K2201/066 , H05K2201/10106 , H05K2201/1028
Abstract: A circuitry assembly including an electrical component, a peripheral circuitry that supports the electrical component, a support assembly affixed to the peripheral circuitry to evacuate heat excess generated by the electrical component and the peripheral circuitry, a main circuitry separated from the support assembly by a spacing, the main circuitry having a plurality of detection bands, and a plurality of ribbons electrically connecting the peripheral circuitry with the main circuitry and deformable between an undamaged state and a damaged state, wherein in the undamaged state the plurality of ribbons steps over the spacing and the plurality of detection bands and in the damaged state at least one ribbon of the plurality of ribbons contacts at least one detection band of the plurality of detection bands and generate a short circuit.
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公开(公告)号：US20190148090A1
公开(公告)日：2019-05-16
申请号：US16244781
申请日：2019-01-10
Applicant: SNAPRAYS, LLC DBA SNAPPOWER
Inventor： Jeremy C. Smith , R. Camden Robinson
CPC classification number: H01H9/182 , H01H9/0066 , H01H9/0271 , H01R9/16 , H01R12/7076 , H01R12/7088 , H01R43/00 , H05K1/119 , H05K2201/09027 , H05K2201/10106 , H05K2201/1028
Abstract: A variety of active cover plate configurations with prongs configured to contact side screw terminals of electrical receptacles or switches are described.
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公开(公告)号：US20190014662A1
公开(公告)日：2019-01-10
申请号：US16130819
申请日：2018-09-13
Applicant: International Business Machines Corporation
Inventor： Michael A. Christo , Julio A. Maldonado , Roger D. Weekly , Tingdong Zhou
CPC classification number: H05K1/112 , H05K1/0263 , H05K1/0296 , H05K1/115 , H05K3/3436 , H05K2201/0355 , H05K2201/1028 , Y10T29/49128 , Y10T29/49155
Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.
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公开(公告)号：US20180054906A1
公开(公告)日：2018-02-22
申请号：US15802241
申请日：2017-11-02
Applicant: Ultravision Technologies, LLC
Inventor： William Y. Hall
IPC: H05K5/02 , G09F9/302 , G09G3/00 , G09G3/32 , H05K3/32 , H05K1/18 , G06F3/14 , H05K7/20 , H05K7/14
CPC classification number: G09F13/22 , F21K9/20 , F21K9/90 , F21V23/023 , F21V31/005 , F21Y2101/00 , F21Y2115/10 , G06F1/1601 , G06F1/182 , G06F1/183 , G06F1/188 , G06F1/189 , G06F1/20 , G06F1/26 , G06F3/1423 , G06F3/1446 , G06F3/147 , G06T1/60 , G09F9/3023 , G09F2013/222 , G09G3/006 , G09G3/32 , G09G5/003 , G09G5/14 , G09G2300/026 , G09G2300/04 , G09G2320/029 , G09G2330/02 , G09G2330/045 , G09G2330/10 , G09G2360/04 , H01B7/2825 , H01B9/003 , H01B11/02 , H04N7/00 , H05K1/181 , H05K3/32 , H05K5/0017 , H05K5/0247 , H05K5/0256 , H05K5/03 , H05K5/06 , H05K7/1422 , H05K7/1427 , H05K7/20 , H05K7/20127 , H05K7/20136 , H05K7/2039 , H05K7/20954 , H05K7/20963 , H05K999/99 , H05K2201/066 , H05K2201/10106 , H05K2201/10128 , H05K2201/1028 , Y02P70/611
Abstract: A LED display panel includes a casing having a recess. The casing has a first side and an opposite second side, where the first side of the casing includes a first surface that is part of a first outer surface of the modular LED display panel, and the second side of the casing includes a second surface that is part of a second outer surface of the modular LED display panel. The casing has attachment points at the second outer surface. A printed circuit board is disposed in the recess. A plurality of LEDs is attached to a first side of the printed circuit board. A processor is coupled to the plurality of LEDs, where the processor is configured to process received media and control operation of the plurality of LEDs. The modular LED display panel is sealed to be waterproof and is configured to be cooled passively.
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