公开(公告)号：US20050162840A1

公开(公告)日：2005-07-28

申请号：US11041869

申请日：2005-01-25

Applicant: Yoshihiro Morita

Inventor： Yoshihiro Morita

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K1/14

CPC classification number: H05K1/028 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01R12/714 ,  H05K1/147 ,  H05K3/103 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10287 ,  Y10T29/49169 ,  Y10T29/49194 ,  H01L2224/0401

Abstract: A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.

Abstract translation: 多线基板包括第一和第二基板以及将第一和第二基板彼此连接并且暴露于外部的多根电线，其中电线在第一基板中形成预定图案。

公开(公告)号：US20040150494A1

公开(公告)日：2004-08-05

申请号：US10476843

申请日：2003-11-06

Inventor： Shiro Yoshida ,  Hirokazu Tohya ,  Masayuki Shimizu

IPC: H01P003/06

CPC classification number: H01P1/202 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01P3/06 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K2201/09809 ,  H05K2201/10287 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Transmission line type components (1, 1null), which form coaxial lines having a very low characteristic impedance by coaxially installing a cylindrical outer conductor made of a conducive material being larger in diameter than an inner conductor so as to cover via a high dielectric insulating material the surface of an inner conductor made of a conductive material, are inserted in series between a power supply line (8) and a ground line (9) connected with a dc source on a printed circuit board and an I.SI (6) power supply port, whereby almost the entire high-frequency power supply current generated from the I.SI (6) is reflected off the I.SI (6) power supply port, and part of the high-frequency power supply current intruding into the components (1, 1null) is consumed and does not reach the external power supply line (8).

Abstract translation: 传输线类型部件（1,1'）通过同轴地安装由导体材料制成的圆柱形外部导体形成具有非常低的特性阻抗的同轴线，其直径大于内部导体，以便经由高介电绝缘体 将由导电材料制成的内部导体的表面材料串联插入到与印刷电路板上的直流源连接的电源线（8）和接地线（9）之间.ISI（6） 电源端口，几乎从ISI（6）产生的整个高频电源电流都从ISI（6）电源端口反射出来，部分高频电源电流侵入 组件（1,1'）被消耗并且不到达外部电源线（8）。

公开(公告)号：US06711031B1

公开(公告)日：2004-03-23

申请号：US10356942

申请日：2003-02-03

Applicant: Conrad A. H. Jelinger

Inventor： Conrad A. H. Jelinger

IPC: H05K702

CPC classification number: H02G3/32 ,  H05K3/222 ,  H05K3/301 ,  H05K7/12 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10606

Abstract: A management system for wiring and/or cabling is disclosed. The wire management system comprises a base socket, a cable guide assembly, and a base pivot. The cable guide assembly may include a base member and at least two guide members that may be removably mounted to the base socket. The base pivot may be received within the base member for removably mounting the cable guide assembly to the base socket. The at least two guide members of the cable guide assembly orientates the wiring and/or cabling in a generally vertical direction with respect to a heat emitting device so as to minimize the surface area of the wiring and/or cabling that is exposed to a heat emitting device, thereby minimizing heat buildup within an enclosure.

Abstract translation: 公开了用于布线和/或布线的管理系统。 电线管理系统包括基座，电缆引导组件和基座枢轴。 电缆引导组件可以包括基部构件和至少两个可拆卸地安装到基座的引导构件。 基部枢轴可以被容纳在基座构件内，用于可拆卸地将电缆引导组件安装到基座。 电缆引导组件的至少两个引导构件相对于发热装置在大致垂直的方向上使布线和/或布线方向取向，以便最小化暴露于热的布线和/或布线的表面积 从而最小化外壳内的热积聚。

公开(公告)号：US20030233134A1

公开(公告)日：2003-12-18

申请号：US10236396

申请日：2002-09-06

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N001/375

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US06599561B2

公开(公告)日：2003-07-29

申请号：US10010675

申请日：2001-11-30

Applicant: Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

Inventor： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

IPC: B05D512

CPC classification number: D03D15/0011 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2321/042 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/16 ,  H05K1/0366 ,  H05K3/045 ,  H05K3/4038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49162 ,  Y10T29/49215 ,  Y10T428/24917

Abstract: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface. Since each of the electrically conductive strand segments extends from the upper planed surface to the lower planed surface, the segments function as electrically conductive vias of the PCB substrate. Also, a PCB substrate that includes a planarized woven fabric with a cured resin material impregnated therein. The planarized woven fabric includes planed upper and lower surfaces and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) extending from the upper planed surface to the lower planed surface. Since the electrically conductive strand segments were formed integrally with the remainder of the planarized woven fabric, PCB substrates are of high mechanical stability.

Abstract translation: 用于制造印刷电路板（PCB）基板的廉价且高通量的方法包括首先编织多根非导电线（例如，玻璃纤维纱线）和至少一根导电线（例如铜线），以形成 具有上表面和下表面的无纺织物。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 固化织物的上表面和下表面随后被平面化。 所述刨削步骤分段所述导电线并形成PCB衬底，所述PCB衬底包括具有上和下平面表面的平坦化固化织物以及从所述上平面表面延伸到所述下平面表面的多个导电线段。 由于每个导电线段从上平面表面延伸到下平面表面，所以这些段用作PCB基板的导电通孔。 此外，PCB基板包括其中浸渍有固化的树脂材料的平面化织物。 平面织造织物包括平面的上表面和下表面以及从上平面表面延伸到下平面表面的多个整体形成的导电线段（例如，铜线段）。 由于导电线段与平面化织物的其余部分一体形成，所以PCB基板具有高机械稳定性。

公开(公告)号：US20030139032A1

公开(公告)日：2003-07-24

申请号：US10124068

申请日：2002-04-15

Inventor： Moriss Kung ,  Kwun-Yao Ho

IPC: H01L021/4763

CPC classification number: H01L21/486 ,  H01L21/76898 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/1189

Abstract: A method of forming metal posts. A fixture having an array of wire guide heads is provided. A conductive wire is threaded through a hole in each wire guide heads. The wire guide heads have a transient electric arcing mechanism for heating the conductive wire so that a teardrop shaped blob of material is formed at the tip of the conductive wire. The wire guide heads on the fixture are pulled towards a substrate, thereby forming a plurality of metal posts over the substrate. The technique of forming metal posts finds applications in the manufacturing of printed circuit board, package substrate (carrier) and silicon wafer.

Abstract translation: 一种形成金属柱的方法。 提供具有导线头阵列的固定装置。 导线穿过每个线导向头中的孔。 导线头具有用于加热导线的瞬时电弧机构，使得在导线的尖端处形成泪滴形状的材料块。 夹具上的导丝头被拉向衬底，从而在衬底上形成多个金属柱。 形成金属柱的技术可用于制造印刷电路板，封装衬底（载体）和硅晶片。

公开(公告)号：US20030104182A1

公开(公告)日：2003-06-05

申请号：US10010675

申请日：2001-11-30

Inventor： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

IPC: B32B003/00

CPC classification number: D03D15/0011 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2321/042 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/16 ,  H05K1/0366 ,  H05K3/045 ,  H05K3/4038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49162 ,  Y10T29/49215 ,  Y10T428/24917

Abstract: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface. Since each of the electrically conductive strand segments extends from the upper planed surface to the lower planed surface, the segments function as electrically conductive vias of the PCB substrate. Also, a PCB substrate that includes a planarized woven fabric with a cured resin material impregnated therein. The planarized woven fabric includes planed upper and lower surfaces and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) extending from the upper planed surface to the lower planed surface. Since the electrically conductive strand segments were formed integrally with the remainder of the planarized woven fabric, PCB substrates are of high mechanical stability.

Abstract translation: 用于制造印刷电路板（PCB）基板的廉价且高通量的方法包括首先编织多根非导电线（例如，玻璃纤维纱线）和至少一根导电线（例如铜线），以形成 具有上表面和下表面的无纺织物。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 固化织物的上表面和下表面随后被平面化。 所述刨削步骤分段所述导电线并形成PCB衬底，所述PCB衬底包括具有上和下平面表面的平坦化固化织物以及从所述上平面表面延伸到所述下平面表面的多个导电线段。 由于每个导电线段从上平面表面延伸到下平面表面，所以这些段用作PCB基板的导电通孔。 此外，PCB基板包括其中浸渍有固化的树脂材料的平面化织物。 平面织造织物包括平面的上表面和下表面以及从上平面表面延伸到下平面表面的多个整体形成的导电线段（例如，铜线段）。 由于导电线段与平面化织物的其余部分一体形成，所以PCB基板具有高机械稳定性。

公开(公告)号：US20030020155A1

公开(公告)日：2003-01-30

申请号：US10252378

申请日：2002-09-24

Applicant: Mitsubishi Denki Kabushiki Kaisha

Inventor： Naoyuki Shinonaga ,  Hideyuki Akagi ,  Syuuichi Osaka

IPC: H01L029/40 ,  H01L021/311 ,  H01L023/48 ,  H01L023/52

CPC classification number: H01L25/50 ,  H01L22/20 ,  H01L23/5382 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K3/222 ,  H05K2201/10287 ,  H05K2203/162 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip-on-board module has a multilayer interconnection board having die mount sections; dies mounted on respective die mount sections such that a single die is mounted on each die mount section or two or more dies are being stacked and mounted there; bonding pads provided on the multilayer and connected to single dies or uppermost dies; contact pads provided on the multilayer board and connected to corresponding bonding pads; jumper pads provided in proximity to the contact pads and connected to edge terminals of the multilayer board, circuit elements mounted on the multilayer interconnection board, or through holes formed so as to extend across layers of the multilayer board; and molding resin for molding the dies and the pads. The uppermost dies of the respective die mount sections where dies are stacked in two or more layers have passed an electric property test.

Abstract translation: 板上芯片模块具有具有管芯安装部分的多层互连板; 模具安装在相应的模具安装部分上，使得单个模具安装在每个模具安装部分上，或者两个或更多个模具被堆叠并安装在那里; 连接在多层并连接到单个模具或最上面的模具上的焊盘; 接触焊盘，设置在多层板上并连接到相应的焊盘; 跨接垫设置在接触垫附近并连接到多层板的边缘端子，安装在多层互连板上的电路元件或形成为跨越多层板的层的通孔; 以及用于模制模具和垫的模制树脂。 将模具堆叠成两层以上的各模具安装部的最上侧的模具通过电性试验。

公开(公告)号：US20020190244A1

公开(公告)日：2002-12-19

申请号：US10167510

申请日：2002-06-13

Applicant: NEC CORPORATION

Inventor： Etsuro Iki

IPC: H01B001/00

CPC classification number: C09J9/02 ,  H01B1/20 ,  H05K3/321 ,  H05K2201/0329 ,  H05K2201/10287 ,  H05K2201/10689

Abstract: An electrically conductive adhesive agent includes at least an electrically insulative adhesive base material providing an adhesion; and at least an electrically conductive filler material mixed in the electrically insulative adhesive base material.

Abstract translation: 导电粘合剂至少包括提供粘合的电绝缘粘合剂基材; 以及混合在电绝缘性粘合剂基材中的至少导电性填充材料。

公开(公告)号：US06492598B1

公开(公告)日：2002-12-10

申请号：US08565090

申请日：1995-11-30

Applicant: Dean A. Klein

Inventor： Dean A. Klein

IPC: H05K706

CPC classification number: H05K3/225 ,  H05K3/222 ,  H05K3/321 ,  H05K3/341 ,  H05K3/3452 ,  H05K13/06 ,  H05K2201/0989 ,  H05K2201/10287 ,  H05K2203/175 ,  Y10T29/49144 ,  Y10T29/49728 ,  Y10T29/4981

Abstract: A PCB assembly which allows economical and reliable rework. The PCB assembly contains a soldermask and a trace with a portion of the trace exposed by a soldermask relief. When one needs to rework the PCB assembly, one bonds a rework wire, using conventional intermetalic bonding materials, to the portion of the trace exposed by the soldermask relief. There is no need to bond a rework wire to a component. Further, there is no need to scrape off the soldermask and possibly damage the traces and/or vias. The bonds are high reliability bonds, and the labor required to perform such bonds are minimal.

Abstract translation: PCB组件，允许经济可靠的返工。 PCB组件包含焊接掩模和痕迹，其中痕迹的一部分由焊接掩模释放。 当需要重新组装PCB组件时，使用常规的金属间粘合材料将返修线与焊接掩模露出的部分迹线相连。 没有必要将返工线连接到组件。 此外，不需要刮掉焊接掩模并且可能损坏迹线和/或通孔。 这些债券是高可靠性债券，执行这种债券所需的劳动力是最小的。