公开(公告)号：US20060001138A1

公开(公告)日：2006-01-05

申请号：US11061149

申请日：2005-02-18

Applicant: Isao Sakama ,  Minoru Ashizawa

Inventor： Isao Sakama ,  Minoru Ashizawa

IPC: H01L23/02 ,  H01L21/44

CPC classification number: H05K1/16 ,  H01Q1/2225 ,  H01Q9/285 ,  H01Q19/24 ,  H05K1/0266 ,  H05K1/184 ,  H05K3/403 ,  H05K2201/10098 ,  H05K2201/10446 ,  H05K2201/10651

Abstract: To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surface 1a and a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.

Abstract translation: 为了在不牺牲无线IC标签的传输距离的情况下提高电子部件封装效率，在印刷电路板的正面侧形成有凹部。 将IC芯片放置在凹部中，使得IC芯片不从印刷电路板的前侧表面，第一主表面1a和第二主表面突出。 天线的天线元件分别形成在IC芯片的相对侧的前侧表面上，并且天线连接到IC芯片。 天线是长度等于由天线辐射的无线电波的波长的一半的偶极子天线。

公开(公告)号：US20050270621A1

公开(公告)日：2005-12-08

申请号：US10985857

申请日：2004-11-10

Applicant: Frederick Bauer ,  Daniel Bostwick ,  Wayne Rumsey ,  Robert Turnbull ,  Alan Watson

Inventor： Frederick Bauer ,  Daniel Bostwick ,  Wayne Rumsey ,  Robert Turnbull ,  Alan Watson

IPC: B60R1/08 ,  B60R1/12 ,  G02B27/00 ,  G02F1/15 ,  H05K1/02 ,  H05K1/03 ,  H05K3/32

CPC classification number: B60R1/12 ,  B60R1/088 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2054

Abstract: A rearview assembly comprising a rearview element, a rearview element support assembly supporting the rearview element and a mount adjacent the housing. The mount is configured to connect the rearview assembly to a windshield. At least one of the rearview element support assembly and the mount comprises a crush bracket having at least two legs adapted to be compressed as a force strikes a front of the rearview element. The crush bracket can include at least one tab contacting a heat emitting component and/or an electrically conductive component of a circuit to provide a heat sink for the heat emitting component or a ground for the electrically conductive component, respectively.

Abstract translation: 一种后视组件，包括后视元件，支撑后视元件的后视元件支撑组件和邻近壳体的安装座。 安装座被配置为将后视组件连接到挡风玻璃。 后视元件支撑组件和安装座中的至少一个包括具有至少两个腿部的挤压支架，所述至少两个支腿适于随着力撞击后视元件的前部而被压缩。 粉碎支架可以包括至少一个接触热发射部件和/或电路的导电部件的接片，以分别为发热部件提供散热器或用于导电部件的接地。

公开(公告)号：US20040047118A1

公开(公告)日：2004-03-11

申请号：US10415267

申请日：2003-04-28

Inventor： Eduard Bergmann ,  Herwie Rilling ,  Peter Westermayr ,  Clemens Hofbauer ,  Boris Klebensberger ,  Karsten Wambach

IPC: H05K005/00

CPC classification number: H05K3/202 ,  H01L31/02013 ,  H01R13/24 ,  H01R13/665 ,  H01R43/24 ,  H02S40/34 ,  H02S40/345 ,  H05K1/187 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10651 ,  Y02E10/50 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53265

Abstract: An arrangement comprising a panel-like electrical/electronic module 7 having a flat surface with openly contactable connecting sections AS as part of an essentially flat printed conductor structure for the electrical connection of the module 7, and comprising a connection unit 1 having electrical/electronic elements D located on a printed conductor structure 2 situated in a plane parallel to the printed conductor structure of the module 7 and provided with means for contacting connecting sections of the module, so that the module is electrically connectable via the connection unit, characterized in that the means for contacting the connecting sections AS of the module 7 are bent out from the plane of the printed conductor structure 2, and a portion of the connecting sections AA representing the printed conductor structure and the connecting sections AS of the module 7 are rigid electrical conductor sections AS which can be bent out of the plane of the printed conductor structure of the module 7, the connecting sections AA of the connection unit 1 being situated corresponding to the arrangement of the connecting sections AS of the module 7, so that for the connection unit 1 connected to the module 7, each connecting section AS of the module 7 is electrically connected to a connecting section of the connection unit 1 and these adjoin one another in one section, and in this adjoining region are situated in a different spatial position than that of the planes of the printed conductor structures 2. The invention further relates to a connection unit for such an arrangement, and to a method of producing such an arrangement. The invention further relates to a method of joining a connection unit to a panel-like module for producing such an arrangement, and to a device for joining a connection unit to a panel-like module for manufacturing such an arrangement.

Abstract translation: 一种包括具有平坦表面的面板式电气/电子模块7的装置，其具有可开放接触的连接部分AS，作为用于模块7的电连接的基本平坦的印刷导体结构的一部分，并且包括具有电气/电子的连接单元1 元件D位于印刷导体结构2上，位于与模块7的印刷导体结构平行的平面中，并且设置有用于接触模块的连接部分的装置，使得模块经由连接单元可电连接，其特征在于： 用于接触模块7的连接部分AS的装置从印刷导体结构2的平面弯曲出来，代表印刷导体结构的连接部分AA的一部分和模块7的连接部分AS是刚性电气 导体部分AS可以弯曲出印刷导体结构的平面 模块7，连接单元1的连接部分AA对应于模块7的连接部分AS的布置，使得对于连接到模块7的连接单元1，模块7的每个连接部分AS是 电连接到连接单元1的连接部分，并且它们在一个部分中彼此相邻，并且在该邻接区域处于与印刷的导体结构2的平面的空间位置不同的空间位置。本发明还涉及 用于这种布置的连接单元，以及制造这种布置的方法。 本发明还涉及将连接单元连接到用于制造这种布置的面板状模块的方法，以及用于将连接单元连接到用于制造这种布置的面板状模块的装置。

公开(公告)号：US06540963B2

公开(公告)日：2003-04-01

申请号：US09881228

申请日：2001-06-11

Applicant: Masahiro Sugiyama

Inventor： Masahiro Sugiyama

IPC: G01N2700

CPC classification number: H01R13/03 ,  G01N27/225 ,  H01R4/04 ,  H05K3/306 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/2036

Abstract: A humidity sensor 10 with high assembling properties and environmental resistance comprises a detecting element 14 having electrodes 14a and 14b formed on a base, conducting wires 12 and 13 connected individually to the electrodes by means of resin conductors formed of an organic high-molecular resin having an electrically conductive material dispersed therein, and a holding member 11 of an organic high-molecular resin for holding the detecting element and the conducting wires. The holding member has a connecting aperture 11c through which junctions between the electrodes and the conducting wires are exposed.

公开(公告)号：US06409522B1

公开(公告)日：2002-06-25

申请号：US09717064

申请日：2000-11-22

Applicant: Takahiro Onizuka

Inventor： Takahiro Onizuka

IPC: H01R1200

CPC classification number: H05K1/144 ,  H01R4/021 ,  H01R4/242 ,  H01R13/504 ,  H05K1/0263 ,  H05K3/202 ,  H05K2201/09063 ,  H05K2201/10272 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10S439/949

Abstract: A circuit connection structure comprises an electronic circuit board 10 having a through-hole 15, the electronic circuit board 10 being provided with lead wires 12 or electric wires of electronic parts 14 in a manner straddling the through-hole 15, and an insulating board 1 provided with bus-bars 2 having upright pressure-contact knife-edges 3 electrically connected to the lead wires 12 or electric wires. The electronic circuit board 10 and the insulating board 1 are stacked up by relatively moving both the boards close to each other in such a condition that the pressure-contact knife-edges are passing through the through-hole, whereby the lead wires 12 or electric wires are pressure-welded to the respective pressure-contact knife-edges 3.

Abstract translation: 电路连接结构包括具有通孔15的电子电路板10，电子电路板10以跨过通孔15的方式设置有引线12或电子部件14的电线，绝缘板1 设置有母线2，母线2具有电连接到引线12或电线的直立的压力接触刀刃3。 电子电路板10和绝缘板1通过使压接触刀刃通过通孔的状态相对移动而彼此相对移动而堆叠起来，由此引线12或电 电线被压接在相应的压接刀刃3上。

公开(公告)号：US06392778B1

公开(公告)日：2002-05-21

申请号：US09514171

申请日：1998-11-13

Applicant: Armand B. Perduijn ,  Gibbo J. Abrahamse ,  Edwin M. Wolterink

Inventor： Armand B. Perduijn ,  Gibbo J. Abrahamse ,  Edwin M. Wolterink

IPC: G02F103

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3426 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10757 ,  Y02P70/613 ,  H01L2924/00

Abstract: An opto-electronic element (1) is mounted on a substrate (2) comprising an electric circuit (3, 3′) with an electrically conducting layer (4, 4′). The opto-electronic element (1) has a body (5) for emitting light in a pre-selected wavelength range and is provided with current conductors (7, 7′) which contact the conducting layer (4, 4′). According to the invention, an adhesive material (8) is used to mount the opto-electronic element (1) on the substrate (2) with clearance with respect to the substrate (2), the body (5) contacting the substrate (2) via the adhesive material (8). Preferably, the adhesive material (8) is a heat-conducting material which serves to cool the body (5) during operation. In order to make a reliable interconnection, the geometry of the current conductors (7, 7′) is optimized in such a way that a small tensile force (order of magnitude 1 N) is present in a weld between the current conductors (7, 7′) and the conducting layer (4, 4′). The tensile force ensures that the opto-electronic element (1) is pressed into the adhesive material (8). The small tensile force is obtained by calibrating the current conductor (7, 7′) during a “press” step in the laser-welding process.

Abstract translation: 光电元件（1）安装在具有导电层（4,4'）的包括电路（3,3'）的基片（2）上。 光电元件（1）具有用于以预选波长范围发光的本体（5），并且设有与导电层（4,4'）接触的电流导体（7,7'）。 根据本发明，使用粘合剂材料（8）将光电元件（1）相对于基板（2）的间隙安装在基板（2）上，主体（5）与基板（2）接触 ）通过粘合剂材料（8）。 优选地，粘合剂材料（8）是用于在操作期间冷却主体（5）的导热材料。 为了实现可靠的互连，电流导体（7,7'）的几何形状被优化，使得电流导体（7,7'）之间的焊缝中存在小的拉伸力（数量级为1N） 7'）和导电层（4,4'）。 张力确保光电元件（1）被压入粘合剂材料（8）中。 通过在激光焊接过程中的“压制”步骤期间校准电流导体（7,7'）可以获得小的拉伸力。

公开(公告)号：US6042683A

公开(公告)日：2000-03-28

申请号：US948423

申请日：1997-10-10

Applicant: Erwin Hagn

Inventor： Erwin Hagn

IPC: H01G2/06 ,  H05K13/04 ,  B32B31/28

CPC classification number: H01G2/065 ,  H05K13/0417 ,  H05K13/046 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613

Abstract: A method and a device for producing an aspiration surface on an object, preferably an electrical component intended for the SMD mounting technique. The planar aspiration surface is formed on the surface located opposite the mounting side of the component by applying an adhesive mass onto the component and molding the mass through cover band arranged above the component with a die to shape the adhesive mass into a planar surface. Following curing of the adhesive mass, the cover band is separated from the mass, resulting in a component with a planar aspiration surface for reliable and unproblematic aspiration, pick-up and transport. The adhesive mass may consist of a liquefiable or volatilizable material such as wax, colophonium or plastic.

Abstract translation: 一种用于在物体上产生抽吸表面的方法和装置，优选地用于SMD安装技术的电气部件。 平面抽吸表面通过将粘合剂块施加到部件上而形成在与部件的安装侧相对的表面上，并通过用模具将组件上方的覆盖带模制成块，以将粘合剂成形为平坦表面。 在粘合剂固化之后，覆盖带与物料分离，导致具有平面抽吸表面的部件，用于可靠和无问题的抽吸，拾取和运输。 粘合剂块可以由可液化或可挥发的材料组成，例如蜡，松香或塑料。

公开(公告)号：US5877033A

公开(公告)日：1999-03-02

申请号：US812903

申请日：1997-03-10

Applicant: Michael L. Matern

Inventor： Michael L. Matern

IPC: H05K1/02 ,  H05K1/11 ,  H01L21/00

CPC classification number: H05K1/111 ,  H05K1/0268 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A system for detecting certain improperly soldered electrical component connections to a printed circuit board includes methods and apparatus providing an automated means for detecting unsoldered component leads is disclosed. A connection pad divided into two portions, or land areas is bridged by the component lead when soldered. A test pad connected to one of the land areas provides a test point for detecting the presence or absence of an open circuit condition through the lead of an electrical component to a point in the circuit to which it is to be electrically connected.

Abstract translation: 一种用于检测与印刷电路板的某些不正确焊接的电气部件连接的系统包括提供用于检测未焊接部件引线的自动化装置的方法和装置。 连接焊盘分为两部分，或焊接区域由部件引线桥接。 连接到其中一个陆地区域的测试焊盘提供了一个测试点，用于通过电气部件的引线到电气连接的电路中的一个点检测是否存在开路状态。

公开(公告)号：US5777850A

公开(公告)日：1998-07-07

申请号：US553680

申请日：1995-11-30

Applicant: Gert Jakob ,  Ralph Schimitzek

Inventor： Gert Jakob ,  Ralph Schimitzek

IPC: B60R16/02 ,  B60R16/023 ,  B60T8/00 ,  B60T8/36 ,  F02M51/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K5/00 ,  H05K7/14 ,  H05K1/14 ,  H05K5/02 ,  H01R9/09

CPC classification number: B60R16/0239 ,  B60T8/3675 ,  F02M51/005 ,  H05K1/189 ,  H05K5/0065 ,  H05K7/14 ,  H01R12/724 ,  H05K1/05 ,  H05K2201/042 ,  H05K2201/0999 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10651 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/3447

Abstract: A built-on control device has a multicomponent housing (15) which is open on one side and is fitted onto the housing block (10) of a hydraulic unit. Arranged in the housing (16) of the built-on control device (15) is a printed circuit board (29) for an electronic circuit with a plurality of electronic components (33). The printed circuit board (29) comprises a plurality of rigid regions (30, 25), one rigid region being formed by the lid (25) of the housing (16). A looplike flexible region (36), which comprises only the conductor foil (31), is located between the two rigid regions (25, 30). In addition, the conductor foil (31) projects beyond the rigid region (30) of the printed circuit board (29) and in this region (28) it is placed in contact with the connection pins (27) of the loads (12) of the hydraulic unit. Since the contact is made directly with the conductor foil (31) in the flexible region of the printed circuit board (29), tolerances can be easily compensated so that contact can be made easily and thus the built-on control device on the housing block (10) can be manufactured easily.

Abstract translation: PCT No.PCT / DE94 / 00648 Sec。 371日期：1995年11月30日 102（e）1995年11月30日日期PCT 1994年6月10日PCT公布。 公开号WO95 / 00363 日期1995年1月5日一个内置的控制装置具有一个多部件壳体（15），其在一侧是敞开的并且被安装在液压单元的壳体块（10）上。 布置在内置控制装置（15）的壳体（16）中的是具有多个电子部件（33）的电子电路用印刷电路板（29）。 印刷电路板（29）包括多个刚性区域（30,25），一个刚性区域由壳体（16）的盖子（25）形成。 仅包含导体箔（31）的凸起柔性区域（36）位于两个刚性区域（25,30）之间。 此外，导体箔31突出超过印刷电路板29的刚性区域30，并且在该区域28中，它被放置成与负载（12）的连接销（27）接触， 的液压单元。 由于与印刷电路板（29）的柔性区域中的导体箔（31）直接接触，所以可以容易地补偿公差，使得可以容易地进行接触，并且因此在壳体块上的内置控制装置 （10）可以容易地制造。

公开(公告)号：US5718593A

公开(公告)日：1998-02-17

申请号：US497969

申请日：1995-07-03

Applicant: Antonio Albino Figueiredo ,  Adam Stuart Kane

Inventor： Antonio Albino Figueiredo ,  Adam Stuart Kane

IPC: H01H85/00 ,  H01H85/02 ,  H01H85/24 ,  H01R13/66 ,  H02H9/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H02H1/04

CPC classification number: H01R13/6666 ,  H05K1/18 ,  H05K1/0254 ,  H05K1/117 ,  H05K2201/09954 ,  H05K2201/10651

Abstract: Disclosed is a voltage and current protector device designed for insertion in connecting blocks. The current and voltage protection elements of the protector are mounted on a printed circuit board which has a conductive pattern on both major surfaces such that the elements can be mounted on either surface and the lead portion of the circuit board of the protector device can be inserted into the top or bottom surface slot of a connecting block depending upon which surface the elements are mounted.

Abstract translation: 公开了一种设计用于插入连接块中的电压和电流保护器件。 保护器的电流和电压保护元件安装在印刷电路板上，印刷电路板在两个主表面上具有导电图案，使得元件可以安装在任一表面上，并且可以插入保护器装置的电路板的引线部分 根据安装元件的哪个表面，进入连接块的顶部或底部表面槽。