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    PCB with improved soldering holes and a battery set with the same
    121.
    发明申请
    PCB with improved soldering holes and a battery set with the same 失效
    PCB具有改进的焊接孔和与之相同的电池组

    公开(公告)号：US20090124099A1

    公开(公告)日：2009-05-14

    申请号：US12007017

    申请日：2008-01-04

    Applicant: Ming-Ta Chen

    Inventor： Ming-Ta Chen

    IPC: H01R12/00

    CPC classification number: H01R43/0256 ,  H01M10/425 ,  H05K1/116 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10818

    Abstract: A printed circuit board (PCB), which can be implemented on a battery set, having a plurality of soldering holes thereon. A soldering portion and a non-soldering portion are separately arranged around each of the soldering holes on both surfaces of the PCB. Each corresponding conductive stick can respectively pierce each soldering hole and be fixed to each soldering portion of the PCB with the fused solder or move from the soldering portion to the non-soldering portion in the soldering hole. Thus, this invention provides a convenient and efficient way for assembling the PCB on the battery set or disassembling the PCB apart from the battery set.

    Abstract translation: 可以在电池组上实施的印刷电路板（PCB），其上具有多个焊接孔。 焊接部分和非焊接部分分别布置在PCB的两个表面上的每个焊接孔周围。 每个相应的导电棒可以分别刺穿每个焊接孔，并用熔融焊料固定到PCB的每个焊接部分，或者从焊接部分移动到焊接孔中的非焊接部分。 因此，本发明提供了一种用于将PCB组装在电池组上或将PCB与电池组拆开的方式和有效的方式。

    SECONDARY BATTERY PROTECTING MODULE AND LEAD MOUNTING METHOD
    122.
    发明申请
    SECONDARY BATTERY PROTECTING MODULE AND LEAD MOUNTING METHOD 失效
    二次电池保护模块和引线安装方法

    公开(公告)号：US20090072008A1

    公开(公告)日：2009-03-19

    申请号：US12252258

    申请日：2008-10-15

    Applicant: Itaru TAKEDA ,  Tomoyuki Kato ,  Yasuo Shoji

    Inventor： Itaru TAKEDA ,  Tomoyuki Kato ,  Yasuo Shoji

    IPC: B23K1/20

    CPC classification number: H05K3/3426 ,  H01M2/1022 ,  H01M10/052 ,  H05K2201/10818 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49149

    Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.

    Abstract translation: 在安装在印刷电路板的主表面上的引线安装方法中，要连接到端子的引线，准备一个引线，该引线具有要布置在印刷电路板的主表面上的安装部分， 连接部分要连接到终端。 扁平导线弯曲成L形，使得安装部分和连接部分彼此垂直以获得L形引线。 L形引线的安装部分通过焊接连接固定在印刷电路板的主表面上。

    Socket with solder pad
    123.
    发明申请
    Socket with solder pad 有权
    带焊盘的插座

    公开(公告)号：US20090047805A1

    公开(公告)日：2009-02-19

    申请号：US12229012

    申请日：2008-08-18

    Applicant: Fang-Chu Liao ,  Chun-Yi Chang

    Inventor： Fang-Chu Liao ,  Chun-Yi Chang

    IPC: H01R12/00

    CPC classification number: H01R12/707 ,  H01R12/716 ,  H05K3/3426 ,  H05K2201/10325 ,  H05K2201/10818 ,  H05K2201/10848 ,  Y02P70/613

    Abstract: A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.

    Abstract translation: 用于电连接IC封装和印刷电路板的插座包括绝缘壳体和容纳在绝缘壳体中的多个触点。 绝缘壳体在其中心具有开口，焊盘被容纳在开口中，并且具有焊接到印刷电路板的焊接板，以增强插座和印刷电路板之间的机械连接。

    Ceramic capacitor mounting structure and ceramic capacitor
    124.
    发明授权
    Ceramic capacitor mounting structure and ceramic capacitor 有权
    陶瓷电容器安装结构和陶瓷电容器

    公开(公告)号：US07365957B2

    公开(公告)日：2008-04-29

    申请号：US11703171

    申请日：2007-02-07

    Applicant: Masaaki Togashi ,  Kentaro Ushioda

    Inventor： Masaaki Togashi ,  Kentaro Ushioda

    IPC: H01G4/228 ,  H01G2/20

    CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

    Abstract: A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.

    Abstract translation: 陶瓷电容器包括陶瓷烧结体和形成在陶瓷烧结体的外表面上的第一和第二端电极。 第一端子电极通过第一金属端子电连接到形成在基板上的焊盘。 第一金属端子具有机械地连接到第一端子电极的第一电容器连接部分，机械地连接到焊盘的第一端子部分和将第一电容器连接部分和第一端子部分彼此电连接的第一中间部分。 第一金属端子的第一电容器连接部分平行于基板。

    Low profile compliant leads
    125.
    发明申请
    Low profile compliant leads 有权
    低调符合标准

    公开(公告)号：US20070190822A1

    公开(公告)日：2007-08-16

    申请号：US11350276

    申请日：2006-02-09

    Applicant: Deepak Pai ,  Melvin Graf

    Inventor： Deepak Pai ,  Melvin Graf

    IPC: H01H13/04

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H05K2201/0373 ,  H05K2201/10727 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

    Abstract: The present invention relates to a connector system for resiliently attaching and electrically connecting an integrated circuit chip to a circuit board using a plurality of leads. Each of the plurality of leads are sized and arranged to form a curved body having a first leg and a second leg with a curved portion between the first leg and the second leg. The curved body of the leads may be C-shaped in accordance with the present invention. The plurality of leads may be formed from strips of copper foil or copper mesh folded to form the curved body. The plurality of leads may also be sized and arranged to support the integrated circuit chip in a generally flat arrangement relative to the circuit board with a maximum separation of about 0.016 inches or less between the integrated circuit chip and the circuit board.

    Abstract translation: 连接器系统技术领域本发明涉及一种使用多根引线将集成电路芯片弹性连接并电连接到电路板的连接器系统。 多个引线中的每一个的尺寸和布置成形成具有第一腿部和第二腿部的弯曲主体，第一腿部和第二腿部之间具有在第一腿部和第二腿部之间的弯曲部分。 根据本发明，引线的弯曲体可以是C形。 多个引线可以由折叠的铜箔或铜网的条形成，以形成弯曲体。 多个引线还可以被设计和布置成将集成电路芯片相对于电路板以大致平坦的布置支撑，在集成电路芯片和电路板之间具有大约0.016英寸或更小的最大间隔。

    Secondary battery protecting module and lead mounting method
    126.
    发明申请
    Secondary battery protecting module and lead mounting method 审中-公开
    二次电池保护模块和引线安装方法

    公开(公告)号：US20060215376A1

    公开(公告)日：2006-09-28

    申请号：US11322192

    申请日：2005-12-29

    Applicant: Itaru Takeda ,  Tomoyuki Kato ,  Yasuo Shoji

    Inventor： Itaru Takeda ,  Tomoyuki Kato ,  Yasuo Shoji

    IPC: H05K7/00 ,  H05K3/00

    CPC classification number: H05K3/3426 ,  H01M2/1022 ,  H01M10/052 ,  H05K2201/10818 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49149

    Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.

    Abstract translation: 在安装在印刷电路板的主表面上的引线安装方法中，要连接到端子的引线，准备一个引线，该引线具有要布置在印刷电路板的主表面上的安装部分， 连接部分要连接到终端。 扁平导线弯曲成L形，使得安装部分和连接部分彼此垂直以获得L形引线。 L形引线的安装部分通过焊接连接固定在印刷电路板的主表面上。

    Micro soldered connection
    128.
    发明授权
    Micro soldered connection 有权
    微焊接

    公开(公告)号：US06800545B2

    公开(公告)日：2004-10-05

    申请号：US10261727

    申请日：2002-10-01

    Applicant: Stuart D. Downes

    Inventor： Stuart D. Downes

    IPC: H01L2144

    CPC classification number: H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

    Abstract: The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

    Abstract translation: 本发明涉及使用具有通道的销形成焊接连接​​的技术。 该通道使引脚与通孔形成牢固的连接（例如，通过在焊接期间促进气体渗透出通孔，以改善焊料流动，通过在引脚插入和焊接之前保持焊料，或通过促进精确的引脚弯曲来保持 焊接或插针插入，然后插入和焊接），以提高连接系统的可靠性并提高制造产量。 在一种布置中，销具有表面，其包括（i）第一表面区域，（ii）基本上平行于第一表面区域的第二表面区域，以及（iii）限定延伸的通道的通道表面区域 从第一表面区域朝向第二表面区域。 为了形成焊接连接​​，销在与通孔的中心轴平行的方向插入到由连接构件（例如电路板）的通孔限定的空腔中。 然后将引脚焊接到通孔，以在引脚和通孔之间建立电路径。 根据具体的布置，通道通常有助于将焊料引入到通孔的空腔中。 因此，通孔的腔体尺寸可以小于常规回流焊接方法的通孔所需的腔体尺寸（即，对于传统的回流焊接方法，其小于最大引脚横截面的100％）。 因此，本发明适用于高密度，微焊接的连接装置（例如，在通孔比常规回流焊接方法更靠近的情况下）。

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