公开(公告)号：US09119319B2

公开(公告)日：2015-08-25

申请号：US14512754

申请日：2014-10-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Wataru Kaneda ,  Noriyoshi Shimizu ,  Akio Rokugawa ,  Kaori Yokota

IPC: H01L23/12 ,  H05K1/18 ,  H01L23/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/18 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16054 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/043 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/2072 ,  H05K2203/025 ,  H05K2203/0773 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A wiring board includes a first insulating layer containing a thermosetting resin, a first wiring layer stacked on an upper surface of the first insulating layer, a second insulating layer stacked on the upper surface of the first insulating layer, a second wiring layer stacked on an upper surface of the second insulating layer, and a third insulating layer stacked on the upper surface of the second insulating layer. The second and third insulating layers contain a first photosensitive resin. An outer side surface of the second insulating layer is flush with an outer side surface of the first insulating layer. An outer side surface of the third insulating layer is located inside the outer side surface of the second insulating layer in a plan view. The upper surface of the second insulating layer connecting to the outer side surface thereof is exposed from the third insulating layer.

Abstract translation: 布线基板包括含有热固性树脂的第一绝缘层，堆叠在第一绝缘层的上表面上的第一布线层，堆叠在第一绝缘层的上表面上的第二绝缘层，堆叠在第一绝缘层上的第二布线层 第二绝缘层的上表面和堆叠在第二绝缘层的上表面上的第三绝缘层。 第二和第三绝缘层包含第一感光树脂。 第二绝缘层的外侧表面与第一绝缘层的外侧表面齐平。 第三绝缘层的外侧表面在平面图中位于第二绝缘层的外侧表面内。 连接到其外侧表面的第二绝缘层的上表面从第三绝缘层露出。

公开(公告)号：US20150181696A1

公开(公告)日：2015-06-25

申请号：US14636916

申请日：2015-03-03

Applicant: NEOLOGY, INC.

Inventor： Paul Elizondo ,  John Azevedo

IPC: H05K1/02 ,  G06K19/077

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

公开(公告)号：US08991714B2

公开(公告)日：2015-03-31

申请号：US14108216

申请日：2013-12-16

Applicant: Neology

Inventor： Paul Elizondo ,  John Azevedo

IPC: G06K19/06 ,  G06Q10/08 ,  G06K7/00 ,  G06K19/077 ,  G06K19/07

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

公开(公告)号：US08975535B2

公开(公告)日：2015-03-10

申请号：US13393447

申请日：2010-12-24

Applicant: Kazuhito Imamura ,  Yousuke Moriyama

Inventor： Kazuhito Imamura ,  Yousuke Moriyama

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H05K1/03

CPC classification number: H05K3/0052 ,  H01L21/481 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/96 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0008 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09918 ,  H05K2203/1572 ,  H01L2924/00

Abstract: In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality of wiring substrate regions being arranged in a matrix, when seen in a transparent plan view, dividing grooves of the main surface and dividing grooves of an opposite main surface are formed to be deviated in one direction of transverse direction or longitudinal direction, and a distance between bottoms of the dividing grooves of one main surface and bottoms of the dividing grooves of the opposite main surface is smaller than a distance between the bottoms of the dividing grooves of the one main surface and the opposite main surface and a distance between the bottoms of the dividing grooves of the opposite main surface and the one main surface.

Abstract translation: 在具有形成为主要部分的分隔槽的基底基板的多个布线基板中，沿着多个布线基板区域的边界，当以透明的方案看时，将多个布线基板区域布置成矩阵状 如图所示，主表面的分割槽和相对的主表面的分隔槽形成为在横向或纵向的一个方向上偏离，并且分隔槽的一个主表面和底部的分隔槽的底部之间的距离 相对的主表面的分隔槽的底部与相对的主表面的分隔槽的底部之间的距离以及相对的主表面和一个主表面的分隔槽的底部之间的距离小于相对主表面的距离。

公开(公告)号：US08912023B2

公开(公告)日：2014-12-16

申请号：US13781095

申请日：2013-02-28

Applicant: LedEngin, Inc.

Inventor： Xiantao Yan

IPC: H01L21/00 ,  H01L33/48 ,  H01L33/08 ,  F21K99/00 ,  F21V5/04 ,  F21Y101/02 ,  F21V5/00 ,  H05K1/18 ,  H01L33/58 ,  H01L25/075

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A method for forming a flexible sheet of LED light emitters includes forming a micro lens sheet having a plurality of micro lenses, forming a phosphor sheet including a wave-length converting material, forming a flexible circuit sheet, forming a ceramic substrate sheet including a plurality of LED light emitters, and forming a support substrate including a thermally conductive material. The method also includes attaching the above sheets to form a stack including, from top to bottom, the micro lens sheet, the phosphor sheet, the flexible circuit sheet, the ceramic substrate sheet, and the support substrate.

Abstract translation: 一种用于形成LED发光体的柔性片的方法包括：形成具有多个微透镜的微透镜片，形成包括波长转换材料的荧光体片，形成柔性电路片，形成包括多个微透镜的陶瓷基片; 的LED发光体，并且形成包括导热材料的支撑基板。 该方法还包括连接上述片材以形成从顶部到底部的微透镜片，荧光片，柔性电路片，陶瓷基片和支撑基片的叠层。

公开(公告)号：US20140247595A1

公开(公告)日：2014-09-04

申请号：US14192733

申请日：2014-02-27

Applicant: The Sloan Company, Inc. dba SloanLED

Inventor： Justin Lind ,  Timothy Drew Ferrie ,  Bruce Quaal

IPC: F21K99/00

CPC classification number: F21K9/20 ,  F21S4/20 ,  F21S4/22 ,  G09F13/0404 ,  H05K1/028 ,  H05K2201/0909 ,  H05K2201/10106

Abstract: The invention described herein is directed to different embodiments of a low profile lighting unit that in some embodiments is adapted to conform to the shape of the mounting surface and/or adapted to be adjustable so as to be arranged in different configurations to accommodate various lighting applications.

Abstract translation: 本文描述的本发明涉及低调照明单元的不同实施例，其在一些实施例中适于符合安装表面的形状和/或适于可调节，以便布置成不同的构造以适应各种照明应用 。

公开(公告)号：US20140216787A1

公开(公告)日：2014-08-07

申请号：US14043609

申请日：2013-10-01

Applicant: NAN YA PCB Corporation

Inventor： Hung-Wei Chang ,  Tai-Yi Chou

IPC: H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4661 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0909 ,  Y10T29/49155

Abstract: A method for forming a printed circuit board is disclosed. A substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region is provided. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.

Abstract translation: 公开了一种形成印刷电路板的方法。 提供了包括在第一器件区域和第二器件区域之间的第一器件区域，第二器件区域和切割沟道区域的衬底。 在基板上形成第一电路。 在第一电路和基板上形成绝缘层。 在绝缘层上形成至少一个积聚电路。 在至少一个积聚电路上形成光致抗蚀剂层。 执行图像转印处理以对切割通道区域中的光致抗蚀剂层进行图案化以形成坝结构。 在至少一个积聚电路上形成焊接掩模层。 去除坝结构以在焊接掩模层中形成沟槽。

公开(公告)号：US20140078699A1

公开(公告)日：2014-03-20

申请号：US13723364

申请日：2012-12-21

Applicant: Daniela Rus ,  Robert J. Wood ,  Cagdas Denizel Onal ,  Michael Tolley

Inventor： Daniela Rus ,  Robert J. Wood ,  Cagdas Denizel Onal ,  Michael Tolley

IPC: H05K3/00 ,  H05K7/06 ,  H05K3/30

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K3/0005 ,  H05K3/0052 ,  H05K3/06 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/1453 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: Methods to systematize the development of machines using inexpensive, fast, and convenient fabrication processes are disclosed. In an embodiment, a folding pattern and corresponding circuit design can provide the blueprints for fabrication. The folding pattern may be provided (e.g. laser machined) on a flat sheet of substrate material, such as a polymer. The circuit pattern may be generated by etching or applying (e.g. sputtering) a copper foil layer onto the substrate. Circuit components and actuators may then be added at specified locations. The flat substrate may then be folded along the predefined locations to form the final machine. The machine may operate autonomously to perform a task.

Abstract translation: 公开了使用便宜，快速和方便的制造工艺来使机器开发系统化的方法。 在一个实施例中，折叠图案和相应的电路设计可以提供用于制造的蓝图。 折叠图案可以在诸如聚合物的基片材料的平板上提供（例如激光加工）。 可以通过将铜箔层蚀刻或施加（例如溅射）到衬底上来产生电路图案。 然后可以在指定位置添加电路部件和致动器。 然后可以沿着预定位置折叠平面基板以形成最终机器。 机器可以自主操作来执行任务。

公开(公告)号：US08658908B2

公开(公告)日：2014-02-25

申请号：US13254138

申请日：2010-06-23

Applicant: Shuzou Nakashima

Inventor： Shuzou Nakashima

IPC: H05K1/16

CPC classification number: H05K3/0052 ,  H01L23/055 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/1531 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/10371 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00

Abstract: A multiple patterning wiring board includes a base substrate including a plurality of wiring board regions arranged in rows and columns, the wiring board regions each including an electronic component mounting region in a center portion thereof, a dividing groove at borders between wiring board regions in one main face of the base substrate, a lid member bonding region being formed between the electronic component mounting region and the dividing groove in the main face of the base substrate, and the lid member bonding region 1c including a groove, the groove having a width less than or equal to the width of the region and a depth that is less than a depth of the dividing groove.

Abstract translation: 多个图案形成配线板包括：基板，其具有配置成行和列的多个布线基板区域，布线基板区域各自包括中央部的电子元件安装区域，一侧的布线基板区域之间的边界处的分隔槽 基底基板的主面，形成在基板的主面的电子部件安装区域与分隔槽之间的盖部件接合区域，以及包括槽的盖部件接合区域1c，该槽部的宽度较小 大于或等于区域的宽度，并且深度小于分隔槽的深度。

公开(公告)号：US20140034369A1

公开(公告)日：2014-02-06

申请号：US14110680

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

Abstract translation: 提供一种陶瓷布线基板，其具有能够可靠地夹持或钩挂的侧面; 用于提供多个布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板由陶瓷材料形成，在平面图中具有正方形（矩形）形状，并且具有前表面，后表面和位于前表面和后表面之间的侧表面，其中每个侧面 表面具有带状的不平坦表面，该表面包括多个交替平行的凸起部分和形成为沿前表面延伸的凹部，并且还具有位于背面侧的断裂面。