Abstract:
A differential transmission line includes: a substrate; a ground conductor layer; and a first and a second signal conductor disposed in parallel to each other on the substrate. The first signal conductor and the ground conductor layer compose a first transmission line, whereas the second signal conductor and the ground conductor layer compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line. The differential transmission line includes two straight regions and a curved region, interconnecting the two straight regions.
Abstract:
A wiring pattern is disclosed including: a variable wettability layer including a material whose critical surface tension changes in response to energy provided thereto, the wettability changing layer including a high surface energy part exhibiting a high critical surface tension and a low surface energy part exhibiting low critical surface tension; and a conductive pattern layer formed on the variable wettability layer at the high surface energy part. The conductive pattern layer has an elongated shape with a chamfered corner part in a plan view.
Abstract:
A differential transmission line according to the present invention includes: a substrate 101; a ground conductor layer 105 formed on a rear side of the substrate 101; and a first signal conductor 102a and a second signal conductor 102b disposed in parallel to each other on a front side of the substrate 101. The first signal conductor 102a and the ground conductor layer 105 compose a first transmission line, whereas the second signal conductor 102b and the ground conductor layer 105 compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line 102c. The differential transmission line 102c includes a curved region 104a, with a straight region 104b being connected to each end of the curved region 104a. The line width of the first signal conductor 102a in the curved region 104a is denoted as Wb1; the line width of the second signal conductor 102b in the curved region 104a is denoted as Wb2; the gap width between the first signal conductor 102a and the second signal conductor 102b in the curved region 104a is denoted as Gb; the line width of the first signal conductor 102a in the straight region 104b is denoted as Ws1; the line width of the second signal conductor 102b in the straight region 104b is denoted as Ws2; the gap width between the first signal conductor 102a and the second signal conductor 102b in the straight region 104b is denoted as Gs; the shortest distance from the center of curvature 115 of the curved region to a line edge of the curved region of the first signal conductor 102a that is closer to the center of curvature is denoted as Rb1; and the perpendicular distance from the center of curvature 115 of the curved region to an extension of a line edge of the straight region of the first signal conductor 102a that is closer to the center of curvature is denoted as Rs1. Wb1 is prescribed to be narrower than Ws1; Wb2 is prescribed to be narrower than Ws2; Gb is prescribed to be narrower than Gs; and Rb1 is prescribed to be greater than Rs1.
Abstract:
A portable telephone including an integrated circuit chip module with a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip including a third power source pad for the first power voltage and an adjacent fourth power source pad for the second power voltage, and a wiring board including a first power source wire electrically connected to the first power source pad, a second power source wire electrically connected to the second power source pad, a third power source wire electrically connected to the third power source pad, and a fourth power source wire electrically connected to the fourth power source pad. Distance between the first and second power source wires is shorter than distance between the first or second power source wires and the third or fourth power source wires, and distance between the third and fourth power source wires is shorter than distance between the first or second power source wires and the third or fourth power source wires.
Abstract:
A printed circuit board having right-angled trace and a method for making the right-angled trace is to apply semi-conductor material and form an interface with a P-type semi-conductive layer and a N-type semi-conductive layer. The semi-conductive right-angled interface does not reflect signals transmitting from the first line portion to the second line portion and via the right-angled portion so as to reduce signal reflection interference. The right-angled line arrangement also shortens the connection distance and reduces the circuit board dimensions.
Abstract:
On the circuit surfaces of integrated circuit chips, there are adjacently laid out a power source pad for a power source wire at a plus voltage side and a power source pad for a power source wire at a minus voltage side. On a single-surface printed wiring board, a first set of two power source wires and a second set of two power source wires respectively are flip-chip mounted to two power source pads of the integrated circuit chips. The first and second sets of the power source wires are substantially parallel to each other, with substantially constant wire widths and with a substantially constant wire interval. Near the outer periphery of the printed wiring board, the first and second sets of the power source wires are bent smoothly and follow the periphery of the printed wiring board.
Abstract:
The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
Abstract:
Provided is a printed circuit board and a display device having the same. The printed circuit board includes a base substrate including a first outline that extends in a first direction and a second outline facing the first outline, the base substrate having a first area, a second area, and a third area successively defined thereon in the first direction and a pad part disposed on the second area. A central outline of the second outline which overlaps the second area has a stepped shape that gradually decreases in distance between the central outline and the first outline from a first point of the central outline contacting the first area to a second point of the central outline contacting the third area.
Abstract:
The present disclosure provides a touch substrate and a touch screen, which belongs to the field of touch technology. The touch substrate includes a touch region and a black matrix pattern surrounding the touch region, the touch substrate including a plurality of touch electrode patterns, wherein the touch electrode pattern includes a first portion overlapped on the black matrix pattern, and wherein in the first portion, if an included angle formed by a first edge and an extending line of a second edge is less than 120°, the first edge and the second edge are formed to be connected with at least one third edge, such that included angles between two edges adjacent to each other among the first edge, the second edge and the third edge are greater than 120°.
Abstract:
A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.