公开(公告)号：US20020020557A1

公开(公告)日：2002-02-21

申请号：US09976376

申请日：2001-10-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: H05K001/11

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。

公开(公告)号：US20010011571A1

公开(公告)日：2001-08-09

申请号：US09770357

申请日：2001-01-26

Applicant: International Business Machines Corporation

Inventor： Mukta S. Farooq ,  Harvey C. Hamel ,  Robert A. Rita ,  Herbert I. Stoller

IPC: C03B029/00 ,  H01G004/06

CPC classification number: H05K1/162 ,  H01G4/30 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H05K1/0306 ,  H05K1/115 ,  H05K2201/0187 ,  H05K2201/09581 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/107

Abstract: A multi-layer ceramic capacitor and method of manufacturing the capacitor, the capacitor having signal vias surrounded by an area containing a material having a low dielectric constant, the via and surrounding area of low dielectric constant material inserted in a material having a high dielectric constant.

公开(公告)号：US06174562B1

公开(公告)日：2001-01-16

申请号：US08888054

申请日：1997-07-03

Applicant: Leif Roland Bergstedt

Inventor： Leif Roland Bergstedt

IPC: B05D512

CPC classification number: H05K3/0094 ,  H05K1/0237 ,  H05K1/113 ,  H05K3/0082 ,  H05K3/3452 ,  H05K2201/09581 ,  H05K2203/0759

Abstract: The present invention relates to a solder stop in through-plated through-holes on micro strip boards (8). A solder resist lacquer (18) with a certain viscosity is applied on a micro strip board (8) wherein the solder resist lacquer (18) flows out over the micro strip (8) and down into a top portion of the through-plated through-hole and dried. A ring-shaped portion of the solder resist lacquer (18) is retained in the top part of the through-plated through-hole.

Abstract translation: 本发明涉及一种在微带板（8）上的通孔中的焊料停止。 具有一定粘度的阻焊漆（18）被施加在微带板（8）上，其中阻焊漆（18）流出微带（8）并且向下流入穿透通孔的顶部 孔和干。 阻焊漆（18）的环形部分保持在穿通通孔的顶部。

公开(公告)号：US6045979A

公开(公告)日：2000-04-04

申请号：US17093

申请日：1998-02-02

Applicant: Gijsbertus A.C.M. Spierings ,  Willem L.C.M. Heijboer ,  Leo O. Remeeus

Inventor： Gijsbertus A.C.M. Spierings ,  Willem L.C.M. Heijboer ,  Leo O. Remeeus

IPC: G03F7/40 ,  C23F1/00 ,  C23F1/02 ,  C25D13/06 ,  G03F1/08 ,  G03F7/00 ,  G03F7/11 ,  G03F7/16 ,  G03F7/30 ,  H01J9/14 ,  H01J17/49 ,  H01J31/12 ,  H01L21/306 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  G03F7/26

CPC classification number: H01J9/148 ,  G03F7/00 ,  G03F7/0007 ,  G03F7/0015 ,  G03F7/11 ,  H01J9/14 ,  H01J9/146 ,  H05K1/09 ,  H05K3/0094 ,  G03F7/164 ,  H01J2209/012 ,  H01J2329/00 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/135 ,  H05K3/064 ,  H05K3/388

Abstract: A description is given of a method of metallizing an electrically insulating plate, for example, of glass having a large number of holes. Said holes are internally provided with a metal layer and the plate is provided with metal tracks. The metal used is mainly aluminum. The aluminum is coated with a thin protective layer of chromium, cobalt, nickel, zirconium or titanium. Said protective layer makes it possible to use a photosensitve, cataphoretic lacquer for providing the metal layer with a structure. The method can very suitably be used for the manufacture of selection plates for thin electron displays.

Abstract translation: 给出了例如具有大量孔的玻璃的电绝缘板的金属化方法的描述。 所述孔内部设置有金属层，并且板上设有金属轨道。 所使用的金属主要是铝。 铝被镀有铬，钴，镍，锆或钛的薄保护层。 所述保护层使得可以使用光敏漆，阴影漆来提供金属层的结构。 该方法可以非常适合用于制造薄电子显示器的选择板。

公开(公告)号：US5786986A

公开(公告)日：1998-07-28

申请号：US283922

申请日：1994-08-01

Applicant: Mark Fielding Bregman ,  Stephen Leslie Buchwalter ,  Karl Hermann ,  Caroline Ann Kovac ,  Paige Adams Poore ,  Alfred Viehbeck

Inventor： Mark Fielding Bregman ,  Stephen Leslie Buchwalter ,  Karl Hermann ,  Caroline Ann Kovac ,  Paige Adams Poore ,  Alfred Viehbeck

IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K7/20

CPC classification number: H05K3/462 ,  H01L23/5385 ,  H01L24/00 ,  H05K1/144 ,  H05K3/445 ,  H01L2924/14 ,  H05K1/0272 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0314 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/1184 ,  H05K2203/1438 ,  H05K3/321 ,  H05K3/325 ,  H05K3/429

Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates each having a thermally and/or electrically conductive core surrounded by a dielectric material. The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

Abstract translation: 用于在其上安装电子设备的结构。 该结构由多个基板制成，每个基板具有由电介质材料包围的热和/或导电芯体。 基板可以与提供接地和电源平面的导电芯贴附放置在一起，或者基板可以安装在一起，连接器将相邻的基板电连接并将相邻的基板间隔开，从而提供流体可以流动的空间，以提取由 安装在其上的电子设备。 导电芯为结构提供电源和接地平面以及用于热耗散所产生的热量的装置。

公开(公告)号：US5510580A

公开(公告)日：1996-04-23

申请号：US413328

申请日：1995-03-30

Applicant: Masaharu Shirai ,  Shuhei Tsuchita

Inventor： Masaharu Shirai ,  Shuhei Tsuchita

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/421 ,  H05K1/116 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09581 ,  H05K2203/135 ,  H05K3/0023 ,  H05K3/0094 ,  H05K3/064 ,  H05K3/4644

Abstract: A blind hole extending from upper or surface wiring of a printed circuit board to inner or lower wiring, and having an opening larger than the bottom, is formed on a substrate, and a conductor pattern is formed on the bottom and the internal wall of the blind hole to connect the inner wiring with the surface wiring.

Abstract translation: 在基板上形成有从印刷电路板的上部或表面布线延伸到内部或下部布线并且具有比底部大的开口的盲孔，并且在底部和内壁上形成导体图案 盲孔将内部接线与表面接线连接。

公开(公告)号：US5258808A

公开(公告)日：1993-11-02

申请号：US925753

申请日：1992-08-07

Applicant: Minoru Watanuki

Inventor： Minoru Watanuki

IPC: G03F7/20 ,  H01L21/027 ,  H05K3/00 ,  H05K3/06 ,  G03B27/04

CPC classification number: G03F7/7005 ,  G03F7/2032 ,  G03F7/70425 ,  H05K3/0082 ,  H05K2201/09581 ,  H05K2203/135 ,  H05K2203/1572 ,  H05K3/0094 ,  H05K3/064

Abstract: An appropriate photochemical reaction is produced in electrodeposited photoresist applied to the surface of a board and to the inner wall surfaces of holes extending through the board, for improving the efficiency of the operation of image formation. Upper and lower ultraviolet illumination devices and upper and lower light condensers 34a, 34b are provided. Each ultraviolet illumination device has a discharge lamp 32 and a reflecting mirror 33. Each light condenser consists of a horizontal array of a multiplicity of lenses 35 placed close to each other. The upper and lower ultraviolet illumination devices are disposed respectively above and below the board 31 in a symmetrical relation with respect to the board. The upper light condenser 34a is disposed between the upper discharge lamp 32 and the board 31, while the lower light condenser 34b is located between the lower discharge lamp 32 and the board 31. These light condenser which are spaced from each other can be moved horizontally. The lenses 35 are optically arranged in such a way that ultraviolet rays passed through the lenses 35 form conical outgoing light surrounding the optical axes of the lenses.

公开(公告)号：US5257452A

公开(公告)日：1993-11-02

申请号：US886722

申请日：1992-05-21

Applicant: Tsutomu Imai ,  Takashi Itoh ,  Takaji Takenaka

Inventor： Tsutomu Imai ,  Takashi Itoh ,  Takaji Takenaka

IPC: H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K3/429 ,  H05K3/225 ,  H05K2201/09581 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2203/175 ,  H05K3/0047 ,  H05K3/3447 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49734

Abstract: A through hole is formed by a drill in a defective through hole in a board. An insulating resin is coated on the inner surface of the through hole and a cylindrical conductor is closely fixed with an adhesive to the hole h1 to form a reproduced through hole. Thereafter, as usual, a part lead is inserted into and soldered in the reproduced through hole to thereby recover the connection of the lead with the wiring circuit copper foil impaired by the recovering operation of the defective through hole using an external lead.

Abstract translation: 通过钻头在板上的缺陷通孔中形成通孔。 绝缘树脂被涂覆在通孔的内表面上，并且圆柱形导体用粘合剂紧密地固定到孔h1上以形成再现的通孔。 此后，像往常一样，将部分引线插入并焊接在再生通孔中，从而恢复引线与布线电路铜箔的连接，该布线电路铜箔通过使用外部引线的缺陷通孔的恢复操作而受损。

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

Applicant: John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

Inventor： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC: C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC classification number: C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

Applicant: John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

Inventor： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC classification number: H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.