公开(公告)号：US07248355B2

公开(公告)日：2007-07-24

申请号：US10939754

申请日：2004-09-13

Applicant: Thane Michael Larson

Inventor： Thane Michael Larson

IPC: G01N21/00

CPC classification number: H05K13/08 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/09936 ,  H05K2203/161 ,  H01L2224/0401

Abstract: The invention in one implementation encompasses the use of special visibility material to enhance the ability of computer-aided visual inspection machines to detect errors in placement or orientation of components mounted to a printed circuit board. In another implementation, the visibility of labels to a repair technician is enhanced by using indicia formed using special visibility material disposed in a housing which substantially restricts the penetration outside ambient light into the interior of the housing.

Abstract translation: 本发明在一个实施方案中包括使用特殊的可见性材料来增强计算机辅助视觉检查机器检测安装到印刷电路板的部件的位置或方向上的错误的能力。 在另一个实施方式中，通过使用设置在壳体中的特殊可见性材料形成的标记来增强标签对维修技术人员的可视性，该标记基本上将外部环境光的穿透基本上限制到壳体的内部。

公开(公告)号：US07181838B2

公开(公告)日：2007-02-27

申请号：US10965888

申请日：2004-10-18

Applicant: Chih-Ching Chen ,  Yi-Jing Leu

Inventor： Chih-Ching Chen ,  Yi-Jing Leu

IPC: H05K3/02 ,  H05K3/10

CPC classification number: B41J2/17559 ,  B41J2/1753 ,  B41J2/17546 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/09936 ,  H05K2203/0514 ,  H05K2203/161 ,  Y10S29/016 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/31507 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786

Abstract: A method of fabricating identifiable flexible printed circuit board (PCB) disposed to an inkjet cartridge includes, providing a flexible substrate having a first surface. A conductive layer is formed on the first surface. A printing ink layer is coated over the first surface. The printing ink layer is exposed and developed to uncover parts of the conductive layer and form at least one identifiable area on the printing ink layer.

Abstract translation: 设置在喷墨盒上的可识别柔性印刷电路板（PCB）的制造方法包括提供具有第一表面的柔性基板。 导电层形成在第一表面上。 印刷油墨层涂覆在第一表面上。 印刷油墨层被曝光和显影以露出导电层的部分并在印刷油墨层上形成至少一个可识别区域。

公开(公告)号：US20060265870A1

公开(公告)日：2006-11-30

申请号：US11442115

申请日：2006-05-30

Applicant: Kiyozumi Gotou ,  Naoto Nakamura

Inventor： Kiyozumi Gotou ,  Naoto Nakamura

IPC: H05K3/20 ,  H05K1/16

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/28 ,  H05K3/303 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/0588 ,  H05K2203/166 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An alignment mark for aligning a resist film and a silk film relative to a printed circuit board is used as a reference mark based on which a position of an electronic component on the printed circuit board is acquired when a component mounting machine mounts the electronic component on the printed circuit board. This makes it unnecessary to additionally provide a board recognition mark and an individual recognition mark, thereby making it possible to effectively use an area of the printed circuit board. In addition, since the number of marks to be recognized is decreased, a recognition processing is reduced. Accordingly, mounting time and a mounting program can be reduced, and a manufacturing cost of the printed circuit board can be reduced.

Abstract translation: 用于将抗蚀剂膜和丝膜相对于印刷电路板对准的对准标记用作参考标记，当组件安装机将电子部件安装在基板上时，基准装置将电子部件在印刷电路板上的位置取得 印刷电路板。 这使得不需要另外提供板识别标记和单独的识别标记，从而可以有效地使用印刷电路板的区域。 此外，由于要识别的标记的数量减少，因此识别处理降低。 因此，可以减少安装时间和安装程序，并且可以降低印刷电路板的制造成本。

公开(公告)号：US07107212B2

公开(公告)日：2006-09-12

申请号：US10304122

申请日：2002-11-25

Applicant: Renatus J. Van Der Vleuten ,  Alphons A. M. L. Bruekers ,  Arnoldus W. J. Oomen

Inventor： Renatus J. Van Der Vleuten ,  Alphons A. M. L. Bruekers ,  Arnoldus W. J. Oomen

IPC: G10L19/02

CPC classification number: G11B20/10 ,  G11B20/00007 ,  G11B20/10037 ,  G11B20/10527 ,  G11B2020/00065 ,  H03M7/3002 ,  H05K1/0266 ,  H05K3/381 ,  H05K2201/09936 ,  H05K2203/161

Abstract: A data processing apparatus for data processing an audio signal includes an input terminal (1) for receiving the audio signal, a 1-bit A/D converter (4) for A/D converting the audio signal to for a bitstream signal, a prediction unit (10) for carrying out a prediction step on the bitstream signal to form a predicted bitstream signal, a signal combination unit (42) for combining the bitstream signal and the predicted bitstream signal to form a residue bitstream signal, and an output terminal (14) for supplying the residual bitstream signal.

Abstract translation: 用于数据处理音频信号的数据处理装置包括用于接收音频信号的输入端（1），用于将音频信号A / D转换为位流信号的1位A / D转换器（4），预测 单元（10），用于对比特流信号进行预测步骤以形成预测比特流信号;信号组合单元（42），用于组合比特流信号和预测比特流信号以形成残留比特流信号;以及输出终端 14）用于提供残留比特流信号。

公开(公告)号：US07019982B2

公开(公告)日：2006-03-28

申请号：US10452455

申请日：2003-06-03

Applicant: Kazuyuki Nagata

Inventor： Kazuyuki Nagata

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/02 ,  H05K7/06 ,  H05K7/08

CPC classification number: H05K1/0266 ,  H05K1/0295 ,  H05K1/18 ,  H05K2201/09936 ,  H05K2201/09954 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2203/168

Abstract: A foolproof polarity indication for poled electronics parts or devices to be mounted to a printed circuit board assures that the poled electronics parts and/or devices are correctly mounted with respect of their polarities to meet occasional requirements dependent on different specifications. Each pair of terminal holes is allotted to a given poled electronics part or device. Two symbols representative of such electronics part or device are arranged side by side on either side of a line drawn from one terminal hole to the other terminal hole. The poled electronics part or device symbols are of reversed polarities. This dual symbol arrangement is effective to draw a worker's attention in the mounting of electrode components in terms of their polarities. When extra components or dummy components are combined with such a poled component, they are encircled by a boundary line, thereby showing the correct polarity direction of the poled component with respect to whether it is enclosed or not.

Abstract translation: 用于安装到印刷电路板的极化电子部件或设备的绝对极性指示确保极化的电子部件和/或设备相对于它们的极性被正确地安装以满足取决于不同规格的偶尔要求。 每对终端孔分配给给定的极化电子部件或设备。 代表这种电子部件或装置的两个符号并列地布置在从一个端子孔到另一个端子孔的线的任一侧上。 极化的电子部件或器件符号具有相反的极性。 这种双重符号排列在使用工作人员的极性方面有助于注意电极组件的安装。 当额外的部件或虚拟部件与这种极化部件组合时，它们被边界线包围，从而显示极化部件相对于是否被封闭的正确的极性方向。

公开(公告)号：US20050274787A1

公开(公告)日：2005-12-15

申请号：US10865103

申请日：2004-06-10

Applicant: Walter Parsadayan ,  Hagop Sakadjian

Inventor： Walter Parsadayan ,  Hagop Sakadjian

IPC: B42D15/00 ,  G06F17/00 ,  G06K19/00 ,  G09B19/00 ,  G09B29/00 ,  G09F7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K7/00

CPC classification number: G06K19/0775 ,  H05K1/0266 ,  H05K1/18 ,  H05K2201/055 ,  H05K2201/09936 ,  H05K2201/10575

Abstract: Information regarding electrical components and their use is provided with a foldable information sheet having instructions thereon. The sheet has apertures which fit over the electrical components and information is printed on the sheet in proximity to the electrical component or components to which it applies. A portion of the information sheet may be adhered to a planar surface on which the components are mounted and non-adhered portions of the information sheet may be folded over the components.

Abstract translation: 关于电气部件及其使用的信息被提供有具有指令的可折叠信息表。 纸张具有适合于电气部件的孔，并且信息被印刷在靠近其所应用的电气部件或组件的片材上。 信息表的一部分可以附着在其上安装有部件的平面上，并且信息表的非粘附部分可以在部件上折叠。

公开(公告)号：US20050018356A1

公开(公告)日：2005-01-27

申请号：US10858782

申请日：2004-06-01

Applicant: Manuel Hernandez

Inventor： Manuel Hernandez

IPC: G11B33/12 ,  G11B5/48 ,  G11B5/60 ,  G11B21/21 ,  G11B25/04 ,  H05K1/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  G11B5/486 ,  H05K1/0266 ,  H05K2201/09145 ,  H05K2201/09936

Abstract: A wireless suspension design is described that can be used in varying types of drive designs. In one embodiment, a flex circuit is provided with at least two indicia to indicate where the flex circuit is to be bent when attaching it to a head stack assembly.

Abstract translation: 描述了可用于不同类型的驱动器设计的无线悬架设计。 在一个实施例中，柔性电路设置有至少两个标记，以指示当将柔性电路连接到磁头堆叠组件时弯曲电路的何处。

公开(公告)号：US06843407B2

公开(公告)日：2005-01-18

申请号：US10201935

申请日：2002-07-25

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: H05K1/02 ,  H05K3/12 ,  H05K3/34 ,  B23K1/20 ,  B23K31/02

CPC classification number: H05K3/3452 ,  H05K1/0266 ,  H05K3/1216 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/09936

Abstract: A solder bump fabrication method is disclosed. First, a printed circuit board, having a plurality of devices, is provided. A material is formed on the printed circuit board, and it is disposed between pins of the devices to prevent the devices from short-circuiting due to the solder bumps. Then, the solder bumps are formed on the pins of the devices so that the devices are fixed on the printed circuit board. The printed circuit board is passed through an infrared oven to melt the solder bumps. The material separates the solder bumps attached to the pins of the devices so that the devices are prevented from short-circuiting.

Abstract translation: 公开了一种焊料凸块制造方法。 首先，提供具有多个装置的印刷电路板。 在印刷电路板上形成材料，并且将其设置在器件的引脚之间，以防止器件由于焊料凸块而短路。 然后，在器件的引脚上形成焊料凸块，使得器件固定在印刷电路板上。 印刷电路板通过红外线烘箱熔化焊料凸块。 该材料将附着在器件引脚上的焊料凸块分开，以防止器件短路。

公开(公告)号：US20040256714A1

公开(公告)日：2004-12-23

申请号：US10860133

申请日：2004-06-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromichi Kitajima ,  Keiji Ogawa ,  Mitsuhide Kato

IPC: H01L023/053 ,  H01L021/4763

CPC classification number: H01L23/544 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/48 ,  H01L2223/5442 ,  H01L2223/54486 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0266 ,  H05K1/115 ,  H05K3/4623 ,  H05K2201/09781 ,  H05K2201/09936 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.

Abstract translation: 层压电子部件包括具有第一主表面和第二主表面的层压体。 四个预定指示位置设置在第一主表面上。 一个或多个通孔导体布置在对应的一个或多个指示位置。 指示通孔导体的位置和数量允许识别关于层压电子部件的信息。 每个指示通孔导体在第一主表面露出，不到达第二主表面，并且与内置于层压板中的布线导体电绝缘。

公开(公告)号：US20030178470A1

公开(公告)日：2003-09-25

申请号：US10103572

申请日：2002-03-22

Inventor： Sakari Tada ,  Eietsu Hasegawa

IPC: B23K031/02

CPC classification number: B23K1/018 ,  B23K2101/42 ,  H05K1/0266 ,  H05K3/3463 ,  H05K2201/09936 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49757 ,  Y10T29/49787 ,  Y10T29/49821

Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.

Abstract translation: 根据印刷电路板上使用的焊料中的合金元素分选抛光印刷电路板。 分选后，印刷电路板被加热以熔化焊料，并且收集熔融的焊料。