公开(公告)号：US3670409A

公开(公告)日：1972-06-20

申请号：US3670409D

申请日：1970-11-19

Applicant: GTE AUTOMATIC ELECTRIC LAB INC

Inventor： REIMER WILLIAM A

IPC: G01R31/28 ,  H01R12/71 ,  H05K3/06 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H01R9/12 ,  H05K3/00

CPC classification number: H05K3/326 ,  H01R12/58 ,  H05K3/06 ,  H05K3/306 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/1059 ,  Y10T29/49167

Abstract: A planar receptacle for pluggable mounting of electronic component leads therein which is formed by applying a resilient, electrically conductive material over an apertured base, and forming a pattern of planar cuts in said resilient layer over each aperture in the base such that when an electronic component lead is pressed onto the resilient layer over an aperture, the resilient layer will deform into the aperture to form at least one contact apron capable of supporting said electronic component lead and capable of making electrical contact with said lead.

Abstract translation: 一种用于在其中可插拔安装电子部件引线的平面插座，其通过在有孔基底上施加弹性导电材料形成，并且在所述基座中的每个孔上形成所述弹性层中的平面切口图案，使得当电子部件 导线被压在孔的弹性层上，弹性层将变形到孔中以形成能够支撑所述电子部件引线并能够与所述引线电接触的至少一个触点挡板。

公开(公告)号：US3492627A

公开(公告)日：1970-01-27

申请号：US3492627D

申请日：1967-12-04

Applicant: COMTECH CORP

Inventor： TAUSCHER HEINRICH E

IPC: H01R29/00 ,  H05K1/00 ,  H05K3/40

CPC classification number: H01R29/00 ,  H05K1/0289 ,  H05K3/4046 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/1059

公开(公告)号：US2599488A

公开(公告)日：1952-06-03

申请号：US857148

申请日：1948-02-16

Applicant: UNITED CARR FASTENER CORP

Inventor： SAMPSON FREDERICK S

IPC: H01R12/58 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/326 ,  H05K3/306 ,  H05K2201/10295 ,  H05K2201/1059

公开(公告)号：US12010790B2

公开(公告)日：2024-06-11

申请号：US17504401

申请日：2021-10-18

Applicant: Robert Bosch GmbH

Inventor： Christian Hollaender ,  Klaus Baur ,  Gustav Klett ,  Klaus Voigtlaender ,  Michael Schoor ,  Ronny Ludwig

IPC: H05K1/02 ,  H01Q1/52 ,  H01Q21/06 ,  H01Q23/00

CPC classification number: H05K1/0243 ,  H01Q1/526 ,  H01Q21/064 ,  H01Q23/00 ,  H05K2201/09985 ,  H05K2201/10098 ,  H05K2201/1059

Abstract: A high-frequency circuit including a circuit board which bears at least one electronic component and a conductor structure, and including a waveguide structure manufactured separately from the circuit board. The waveguide structure is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure. The waveguide structure is held with the aid of press-fit pins on the circuit board.

公开(公告)号：US20230387615A1

公开(公告)日：2023-11-30

申请号：US18098242

申请日：2023-01-18

Applicant: Luxshare Precision Industry Company Limited

Inventor： Liang YU ,  Min FAN

IPC: H01R12/58 ,  H01R12/71

CPC classification number: H01R12/585 ,  H01R12/716 ,  H05K2201/1059

Abstract: An electrical connector includes an insulating body, a conductive terminal, an adapter circuit board and a cable. The insulating body includes a terminal receiving groove extending along a first direction. The conductive terminal includes a fixing portion, a mating portion and a mounting portion. The mating portion is located in the terminal receiving groove. The transfer circuit board includes a conductive hole. The mounting portion of the conductive terminal is inserted into the conductive hole. The cable is electrically connected to the adapter circuit board. The cable extends in a second direction perpendicular to the first direction. A method for making the electrical connector and a connector assembly having the electrical connector are disclosed.

公开(公告)号：US20230262943A1

公开(公告)日：2023-08-17

申请号：US18169090

申请日：2023-02-14

Applicant: AUDI AG

Inventor： Daniel RUPPERT

IPC: H05K7/20 ,  H05K1/18

CPC classification number: H05K7/20509 ,  H05K1/18 ,  H05K7/209 ,  H05K2201/10522 ,  H05K2201/1059

Abstract: An electrical circuit device comprises at least one first power electronics module, at least one second power electronics module, a circuit board and a supporting structure, wherein the power electronics modules each lie by a contact side against an associated contact surface of the supporting structure and have one or more terminal pins connected to the circuit board on and/or next to a connection side situated opposite the contact side, wherein the first power electronics module has a lesser thickness between the contact side and the connection side than the second power electronics module, wherein the contact surface against which the contact side of the first power electronics module bears has a lesser distance from the circuit board than the contact surface against which the contact side of the second power electronics module bears, and/or wherein the terminal pins of the first power electronics module are longer than the terminal pins of the second power electronics module.

公开(公告)号：US10314164B1

公开(公告)日：2019-06-04

申请号：US15851195

申请日：2017-12-21

Applicant: Astec International Limited

Inventor： Edgardo Hernando Vergara ,  Adriane Cabral Ginez ,  Joel Cadiente Macadangdang

IPC: H05K1/02 ,  H01R12/58 ,  H01R12/71 ,  H01R12/70 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0263 ,  H01R12/585 ,  H01R12/7064 ,  H01R12/718 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10272 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2203/1581

Abstract: According to some aspects of the present disclosure, circuit board assemblies are disclosed. Example circuit board assemblies include a printed circuit board having a first surface and a second surface, and defining an opening having at least one side extending from the first surface to the second surface. The assembly also includes a bus bar having a first surface, a second surface, and at least one side. The bus bar is secured in the opening of the printed circuit board via a press-fit, such that a slot is defined between the at least one side of the bus bar and the at least one side of the opening defined by the printed circuit board. The assembly further includes an electrical lead positioned in the slot, and solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar.

公开(公告)号：US10079193B2

公开(公告)日：2018-09-18

申请号：US15453123

申请日：2017-03-08

Applicant: ABB Schweiz AG ,  Audi AG

Inventor： Fabian Mohn ,  Jürgen Schuderer

IPC: H01L23/22 ,  H01L23/24 ,  H01L23/367 ,  H01L23/498 ,  H01L23/31 ,  H01L23/04 ,  H01L23/373 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/3675 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2225/1017 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0665 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/186 ,  H05K1/0263 ,  H05K1/115 ,  H05K3/325 ,  H05K3/368 ,  H05K7/1432 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1316 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor module comprises a semiconductor device; a substrate, on which the semiconductor device is attached; a molded encasing, into which the semiconductor device and the substrate are molded; at least one power terminal partially molded into the encasing and protruding from the encasing, which power terminal is electrically connected with the semiconductor device; and an encased circuit board at least partially molded into the encasing and protruding over the substrate in an extension direction of the substrate, wherein the encased circuit board comprises at least one receptacle for a pin, the receptacle being electrically connected via the encased circuit board with a control input of the semiconductor device.

公开(公告)号：US20180261936A1

公开(公告)日：2018-09-13

申请号：US15573845

申请日：2016-04-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Yoshihisa Kawate

IPC: H01R12/58 ,  H01R12/59 ,  H01R12/62 ,  H01B11/20

CPC classification number: H01R12/585 ,  H01B11/203 ,  H01R12/596 ,  H01R12/62 ,  H05K2201/1059

Abstract: A connector and a connector assembly for electrically connecting an electrical cable to a circuit board is described. The connector includes an insulative housing and a plurality of self-supporting terminals. Each of the self-supporting terminal has a retaining portion retained in a corresponding receiving through hole disposed through the housing, a contact portion extending from an upper end of, and perpendicular to the retaining portion such that the contact portion is disposed on an upper surface of the housing and a press-fit portion extending from a lower end of, and substantially parallel to the retaining portion, wherein the press-fit portion extends down from the lower surface of the housing. The connector electrically and physically connecting a conductive wire of an electrical cable with a conductive via of a circuit board by inserting each press-fit portion of the self-supporting terminals into said conductive via.

公开(公告)号：US20180242460A1

公开(公告)日：2018-08-23

申请号：US15882223

申请日：2018-01-29

Applicant: Robert Bosch GmbH

Inventor： Eszter Varga ,  Frank Schou ,  Jian Zhu ,  Peter Gyimesi ,  Timea Sesztak ,  Jesus Omar Murillo Murguia

IPC: H05K3/30 ,  H01G2/06 ,  H01G9/08 ,  H01G9/14

CPC classification number: H05K3/301 ,  H01G2/06 ,  H01G4/228 ,  H01G9/08 ,  H01G9/14 ,  H01G9/26 ,  H01R12/7023 ,  H01R12/7076 ,  H01R12/7088 ,  H01R2103/00 ,  H01R2201/26 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10325 ,  H05K2201/1059

Abstract: A connector module for connecting an energy store to a printed circuit board, wherein the connector module is designed in such a way as to receive at least two electrolytic capacitors as energy stores.