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    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    134.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US20150213955A1

    公开(公告)日：2015-07-30

    申请号：US14254662

    申请日：2014-04-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Min Gon LEE ,  Jong Han Kim ,  Kyu Ha Lee ,  Jae Hyuk Sim

    IPC: H01G4/30 ,  H01G4/005 ,  H05K1/18 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor may include: an active part including a plurality of first and second internal electrodes; upper and lower cover layers; and first and second external electrodes including head parts and band parts. When a thickness of the upper or lower cover layer is defined as C, a width of a margin portion of the ceramic body in a width direction is defined as M, a cross-sectional area of the ceramic body in a width-thickness direction is defined as Ac, a cross-sectional area of the active part in a width-thickness direction in a portion thereof in which the first and second internal electrodes are overlapped with each other in a thickness direction is defined as Aa, and a width of the band part of the first or second external electrode is defined as B, 1.826≦C/M≦4.686, 0.2142≦Aa/Ac≦0.4911, and 0.5050≦C/B≦0.9094 may be satisfied.

    Abstract translation: 多层陶瓷电容器可以包括：有源部分，包括多个第一和第二内部电极; 上下盖层; 以及包括头部和带部分的第一和第二外部电极。 当上盖层或下盖层的厚度定义为C时，将陶瓷体的宽度方向的边缘部分的宽度定义为M，陶瓷体的宽度方向的横截面积为 定义为Ac，其中第一和第二内部电极在厚度方向上彼此重叠的部分中的宽度厚度方向上的有源部分的横截面面积被定义为Aa，并且宽度 第一或第二外部电极的带部分被定义为B，1.826＆amp; NlE; C / M＆amp; NlE; 4.686,0.2142＆amp; NlE; Aa / Ac＆NlE; 0.4911和0.5050＆amp; N; E / C＆B＆NlE; 0.9094。

    Electronic chip component and board having the same mounted thereon
    136.
    发明授权
    Electronic chip component and board having the same mounted thereon 有权
    具有安装在其上的电子芯片部件和板

    公开(公告)号：US09024202B2

    公开(公告)日：2015-05-05

    申请号：US14137741

    申请日：2013-12-20

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Young Ghyu Ahn ,  Soon Ju Lee ,  Heung Kil Park ,  Sang Soo Park

    IPC: H05K1/00 ,  H01G2/06 ,  H05K1/18 ,  H05K1/03

    CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.

    Abstract translation: 电子芯片部件包括陶瓷体; 外部电极形成在陶瓷体的端部上; 支撑所述陶瓷体并与外部电极电连接的插入件，其中所述插入件包括形成在其表面上并具有设置在其上的外部电极的第一电极焊盘，形成在其相对表面上的第二电极焊盘和连接电极 衬垫，其将第一电极焊盘连接到第二电极焊盘并形成在插入件的表面和相对表面之间的侧表面上，第一电极焊盘被分成基于空间设置在插入器的端部处的第一和第二电极图案 形成在第一电极焊盘的端部和插入件的端部之间的非电极边缘部分，并且连接电极焊盘形成在插入器的侧表面上。

    COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME
    137.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME 有权
    复合电子元器件及其安装板

    公开(公告)号：US20150116891A1

    公开(公告)日：2015-04-30

    申请号：US14258711

    申请日：2014-04-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Min Cheol PARK ,  Sang Soo PARK

    IPC: H01G4/40 ,  H05K1/18 ,  H01F27/28

    CPC classification number: H01G4/40 ,  H01F17/0013 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H05K1/0233 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A composite electronic component may include: a composite body including a combination of a capacitor formed of a ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face one another with the dielectric layers interposed therebetween, and an inductor formed of a magnetic body including a coil unit; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrodes and a second external electrode formed on the second lateral surface of the ceramic body and electrically connected to the second internal electrodes; third and fourth external electrodes formed on first and second end surfaces of the magnetic body and connected to the coil unit, and first and second dummy electrodes formed on first and second end surfaces of the magnetic body.

    Abstract translation: 复合电子部件可以包括：复合体，包括由包括多个电介质层的陶瓷体形成的电容器和彼此相对设置的电介质层彼此相对设置的第一和第二内部电极的组合，以及由 包括线圈单元的磁体; 第一外部电极，形成在陶瓷体的第一侧面上并与第一内部电极电连接，第二外部电极形成在陶瓷体的第二侧面上并电连接到第二内部电极; 形成在磁体的第一和第二端面上并连接到线圈单元的第三和第四外部电极，以及形成在磁体的第一和第二端面上的第一和第二虚拟电极。

    Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures
    138.
    发明申请
    Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures 有权
    使用弹性阻尼和阻尼结构的印刷电路板降噪电子设备

    公开(公告)号：US20150070864A1

    公开(公告)日：2015-03-12

    申请号：US14020059

    申请日：2013-09-06

    Applicant: Apple Inc.

    Inventor： Amanda R. Rainer ,  Connor R. Duke ,  James W. Bilanski ,  Jeffrey M. Thoma ,  Michael Eng ,  Mingzhe Li ,  Sung Woo Yoo ,  Miguel Alejandro Lara-Pena ,  Weng Choy Foo ,  Kieran Poulain

    IPC: H01L23/29 ,  H01L25/065 ,  H05K1/03 ,  H01L21/56

    CPC classification number: H05K1/0393 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73204 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10977 ,  H05K2201/2045 ,  H05K2203/0126 ,  H05K2203/304

    Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

    Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。

    MOUNTING CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR
    139.
    发明申请
    MOUNTING CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器安装电路板

    公开(公告)号：US20150047887A1

    公开(公告)日：2015-02-19

    申请号：US14146534

    申请日：2014-01-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa LEE ,  Heung Kil PARK ,  Soon Ju LEE ,  Young Ghyu AHN ,  Sang Soo PARK

    IPC: H05K1/02

    CPC classification number: H05K1/111 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: There is provided a mounting circuit board of a multilayer ceramic capacitor including a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, and first and second external electrodes extended from both end surfaces of the ceramic body to a portion of a lower surface thereof; and a printed circuit board having first and second electrode pads so that the first and second external electrodes are mounted thereon, wherein the first and second electrode pads are disposed in positions diagonally opposed to each other, based on the ceramic body.

    Abstract translation: 提供了一种多层陶瓷电容器的安装电路板，其包括多层陶瓷电容器，该多层陶瓷电容器包括堆叠有多个电介质层的陶瓷体，包括交替暴露于两个端面的多个第一和第二内部电极的有源层 陶瓷体，其间具有电介质层，以及从陶瓷体的两个端面延伸到其下表面的一部分的第一和第二外部电极; 以及印刷电路板，其具有第一和第二电极焊盘，使得第一和第二外部电极安装在其上，其中基于陶瓷体将第一和第二电极焊盘设置在彼此相对的位置。

    ELECTRONIC CHIP COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    140.
    发明申请
    ELECTRONIC CHIP COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    电子芯片组件与其安装在一起的板

    公开(公告)号：US20150041195A1

    公开(公告)日：2015-02-12

    申请号：US14137741

    申请日：2013-12-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Soon Ju LEE ,  Heung Kil PARK ,  Sang Soo PARK

    IPC: H01G2/06

    CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.

    Abstract translation: 电子芯片部件包括陶瓷体; 外部电极形成在陶瓷体的端部上; 支撑所述陶瓷体并与外部电极电连接的插入件，其中所述插入件包括形成在其表面上并具有设置在其上的外部电极的第一电极焊盘，形成在其相对表面上的第二电极焊盘和连接电极 衬垫，其将第一电极焊盘连接到第二电极焊盘并形成在插入件的表面和相对表面之间的侧表面上，第一电极焊盘被分成基于空间设置在插入器的端部处的第一和第二电极图案 形成在第一电极焊盘的端部和插入件的端部之间的非电极边缘部分，并且连接电极焊盘形成在插入器的侧表面上。

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