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公开(公告)号:US20190107604A1
公开(公告)日:2019-04-11
申请号:US16149256
申请日:2018-10-02
Applicant: Melexis Technologies NV
Inventor: Gaetan KOERS , Wouter LETEN , Sam MADDALENA , Ross KAY
Abstract: A sensor device (100) comprises an emitter device (106) arranged to emit electromagnetic radiation and having an emission region associated therewith. The sensor device (100) also comprises a detector device (108) arranged to receive electromagnetic radiation and having a detection region associated therewith, and an optical system (122). The emission region is spaced at a predetermined distance from the detection region. The optical system (122) defines a plurality of principal rays, a number of the plurality of principal rays intersecting the detection region. The number of the plurality of principal rays also intersect the emission region.
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公开(公告)号:US20190043599A1
公开(公告)日:2019-02-07
申请号:US16048691
申请日:2018-07-30
Applicant: Melexis Technologies NV
Inventor: Darrell LIVEZEY
Abstract: The present invention relates to a sample-and-hold circuit comprising a plurality of sample-and-hold branches arranged in parallel and each comprising a buffer and a sample-and-hold block comprising one or more sample-and-hold cells characterised in that said sample-and-hold circuit further comprises a clock and timing circuit arranged for setting an adaptable time delay to enable sampling and sampling phase for each sample-and-hold block, wherein the time delay of at least one sample-and-hold block can be set to value bigger than one sampling clock period.
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公开(公告)号:US20180321065A1
公开(公告)日:2018-11-08
申请号:US15967809
申请日:2018-05-01
Applicant: Melexis Technologies NV
Inventor: Johan VERGAUWEN
CPC classification number: G01D18/00 , H03L7/0802 , H03L7/093 , H03L7/099 , H03M1/0604 , H03M1/1014 , H03M1/60
Abstract: An oscillator-based sensor interface circuit comprises at least two oscillators, at least one of which is arranged for receiving an electrical signal representative of an electrical quantity being a converted physical quantity, phase detection means arranged to compare output signals of the at least two oscillators and for outputting a digital phase detection output signal in accordance with the outcome of the comparing, a feedback element arranged for converting a representation of the digital phase detection output signal into a feedback signal used directly or indirectly to maintain a given relation between oscillator frequencies of the at least two oscillators, detection means for detecting a difference between the at least two oscillators; and at least one tuning element arranged for receiving the detected difference and for tuning at least one characteristic of the oscillator-based sensor interface circuit.
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公开(公告)号:US20180283956A1
公开(公告)日:2018-10-04
申请号:US15997836
申请日:2018-06-05
Applicant: Melexis Technologies NV
Inventor: Carl VAN BUGGENHOUT , Ben MAES , Karel VANROYE , Stijn REEKMANS
CPC classification number: G01J5/06 , G01J5/045 , G01J5/10 , G01J2005/0048 , G01J2005/065 , G01J2005/067 , G01J2005/106
Abstract: An infrared sensor assembly for sensing infrared radiation comprises infrared sensing elements and the infrared sensing compensation elements that are different so that, for a same flux on the infrared sensing elements and the infrared sensing compensation elements, the radiation responsive element of the infrared sensing elements absorbs more radiation than the radiation responsive element of the infrared sensing compensation elements, as to receive substantially more radiation than the radiation responsive element of the infrared sensing compensation elements. An output of the sensor array is a subtractive function of a sum of the signals of the plurality of infrared sensing elements and a sum of the signals of the plurality of the infrared sensing compensation elements such that at least linear and/or non-linear parasitic thermal fluxes are at least partly compensated for.
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公开(公告)号:US20180218984A1
公开(公告)日:2018-08-02
申请号:US15882073
申请日:2018-01-29
Applicant: MELEXIS TECHNOLOGIES NV
Inventor: Appolonius Jacobus VAN DER WIEL
IPC: H01L23/552 , H01L29/84 , H01L29/45 , H01L29/06 , H01L23/522 , H01L23/532 , H01L23/00 , H01L21/768
Abstract: A sensor device for use in harsh media, comprising a silicon die comprises a lowly doped region, and a contact layer, contacting the silicon die. The contact layer comprises a refractory metal and an ohmic contact to the silicon die via a silicide of the refractory metal. A noble metal layer is provided over the contact layer such that the contact layer is completely covered by the noble metal layer. The noble metal layer comprises palladium, platinum or a metal alloy of palladium and/or platinum. The noble metal layer is patterned to form an interconnect structure and a contact connecting via the contact layer to the ohmic contact. The noble metal layer is adapted for providing a shield to prevent modulation of the lowly doped region by surface charges. The noble metal layer may advantageously protect the contact layer against harsh media in an external environment of the sensor device.
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公开(公告)号:US20180203059A1
公开(公告)日:2018-07-19
申请号:US15873325
申请日:2018-01-17
Applicant: Melexis Technologies NV
Inventor: Vincenzo SACCO , Mathieu POEZART
IPC: G01R31/26 , G01D3/08 , G06F11/16 , G01R31/28 , G01R31/3187
CPC classification number: G01R31/2644 , G01D3/08 , G01D5/24466 , G01R31/2829 , G01R31/2856 , G01R31/2884 , G01R31/3187 , G05B9/03 , G06F11/1633
Abstract: A sensor system for providing a main signal and an error signal, comprising: a sensor unit providing a sensor signal; a first signal processor downstream of the sensor unit, adapted for receiving a second signal equal to or derived from a sensor signal, and for performing a first operations on the second signal so as to provide a first processed signal; a second signal processor for receiving the first processed signal and for performing second operations inverse of the first operations, so as to provide a second processed signal; and an evaluation unit for receiving the second signal and the second processed signal, and for evaluating whether the second signal matches the second processed signal within a predefined tolerance margin, and for providing the error signal.
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公开(公告)号:US20180145002A1
公开(公告)日:2018-05-24
申请号:US15819260
申请日:2017-11-21
Applicant: Melexis Technologies NV
Inventor: Gunnar MUNDER , Heiko GRIMM , Thomas FREITAG
CPC classification number: H01L22/34 , G01R31/2858 , G01R31/2896 , H01L23/562 , H01L23/645 , H01L23/66 , H01L2223/6677
Abstract: An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 kΩ, adapted for reducing self-resonance.
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公开(公告)号:US20180100902A1
公开(公告)日:2018-04-12
申请号:US15829223
申请日:2017-12-01
Applicant: MELEXIS TECHNOLOGIES NV , X-CELEPRINT LIMITED
Inventor: Christian SCHOTT , Matthew MEITL , Christopher BOWER
CPC classification number: G01R33/0047 , G01R15/207 , G01R33/0052 , G01R33/0094 , G01R33/07 , G01R33/077 , G01R33/09 , G01R33/093 , G01R33/098 , H01L24/00 , H01L24/24 , H01L24/82 , H01L24/94 , H01L43/04 , H01L2224/24146 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73227 , H01L2224/73265 , H01L2224/73267 , H01L2224/83005 , H01L2224/92137 , H01L2224/92244 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/10253 , H01L2924/10329 , H01L2924/181 , H01L2924/00012 , H01L2224/82 , H01L2224/83 , H01L2224/45099 , H01L2924/00
Abstract: A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit and comprises a fractured tether. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.
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公开(公告)号:US09906175B2
公开(公告)日:2018-02-27
申请号:US15276887
申请日:2016-09-27
Applicant: Melexis Technologies NV
Inventor: Michaël Bernardus Petrus Esvelt , Robert Filusch
Abstract: Method of starting a three-phase sinusoidal BLDC motor, comprising: a) determining an initial position of the rotor; b) applying a first set of sinusoidal energizing signals to the windings, corresponding to a set of sinusoidal waveforms shifted apart by 120° and 240° sampled at a first angle (Φ1); and maintaining the energizing signals for allowing the rotor to move to a first angular position; c) while maintaining the energizing signals, monitoring two of the phase currents, and determining whether a predefined condition is satisfied, comprising testing whether a ratio of two total current values is equal to a predefined value, and if true, to repeat steps b) and c), but with second and further sinusoidal energizing signals sampled at a second or further angular position, selected from a limited group of discrete angular positions.
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公开(公告)号:US20170328962A1
公开(公告)日:2017-11-16
申请号:US15524003
申请日:2015-11-03
Applicant: MELEXIS TECHNOLOGIES NV , X-CELEPRINT LIMITED
Inventor: Christian SCHOTT , Matthew MEITL , Christopher BOWER
CPC classification number: G01R33/07 , G01R33/0052 , G01R33/077 , H01L24/24 , H01L24/82 , H01L24/94 , H01L43/04 , H01L2224/24146 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73227 , H01L2224/73265 , H01L2224/73267 , H01L2224/83005 , H01L2224/92137 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/82 , H01L2224/83
Abstract: A semiconductor chip for measuring a magnetic field. The semiconductor chip comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.
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