公开(公告)号：US12196825B2

公开(公告)日：2025-01-14

申请号：US18056490

申请日：2022-11-17

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01R33/07 ,  G01R33/02 ,  G01R33/09

Abstract: A sensor device contains a first magnetic field sensor chip having a first sensor element. The first magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the first sensor element. The sensor device contains a second magnetic field sensor chip having a second sensor element. The second magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the second sensor element. The sensor device contains a current conductor configured to carry a measurement current that induces a magnetic field at the locations of the sensor elements. The magnetic field sensor chips and the current conductor are arranged relative to one another in such a way that an influence of a homogeneous magnetic stray field on the first components is compensated for upon difference formation or summation applied to the first components.

公开(公告)号：US11967562B2

公开(公告)日：2024-04-23

申请号：US17221974

申请日：2021-04-05

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/552 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/6677 ,  H01L2224/214 ,  H01L2924/3025

Abstract: A method for fabricating packaged semiconductor devices is disclosed. In one example the method comprises providing a plurality of semiconductor dies, the semiconductor dies being arranged in an array on a carrier such that a first side of the semiconductor dies faces the carrier and such that an empty space is arranged laterally besides each semiconductor die. A substrate comprising a plurality of conductive elements is arranged over the plurality of semiconductor dies such that a conductive element is arranged in the respective empty space besides each one of the semiconductor dies. The plurality of semiconductor dies are molded over to form a molded body, and singulating packaged semiconductor devices from the molded body by cutting through the molded body.

公开(公告)号：US11921032B2

公开(公告)日：2024-03-05

申请号：US17993024

申请日：2022-11-23

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: G01N21/17 ,  B81C1/00 ,  G01N29/24 ,  G01R33/028

CPC classification number: G01N21/1702 ,  B81C1/00119 ,  G01N29/2418 ,  G01R33/0286 ,  B81C2203/0118 ,  B81C2203/035 ,  G01N2021/1704 ,  G01N2291/021

Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.

公开(公告)号：US11655143B2

公开(公告)日：2023-05-23

申请号：US17116021

申请日：2020-12-09

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Bernhard Knott ,  Horst Theuss

IPC: B81B7/00 ,  H01L23/04 ,  H01L23/24 ,  H01L23/498 ,  H01L23/16 ,  B81C1/00 ,  H01L21/311 ,  H01L21/52 ,  H01L21/56 ,  H01L23/055 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: B81B7/0058 ,  B81C1/00301 ,  H01L21/31144 ,  H01L21/52 ,  H01L21/56 ,  H01L23/04 ,  H01L23/055 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/85 ,  B81B2201/0264 ,  H01L23/49551 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/45144 ,  H01L2924/00014

Abstract: A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.

公开(公告)号：US11652084B2

公开(公告)日：2023-05-16

申请号：US17078460

申请日：2020-10-23

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss ,  Peter Scherl

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/677 ,  H01L21/56 ,  H01L21/67 ,  H01L21/48 ,  H01L21/78

CPC classification number: H01L24/96 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/561 ,  H01L21/677 ,  H01L21/67011 ,  H01L21/67703 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/97 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/8384 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.

公开(公告)号：US20230094566A1

公开(公告)日：2023-03-30

申请号：US17954711

申请日：2022-09-28

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H01L23/00 ,  G01R15/20 ,  H01L23/31 ,  H01L23/29 ,  H01L23/367 ,  H01L25/065

Abstract: According to an exemplary embodiment, a semiconductor component includes a chip carrier, a semiconductor chip mounted on the chip carrier, and a chip package made of potting compound. The potting compound only partially surrounds the semiconductor chip, such that at least part of an upper side of the semiconductor chip is not covered by the potting compound. The semiconductor component further includes a clip that is mechanically connected to the upper side of the semiconductor chip.

公开(公告)号：US11573204B2

公开(公告)日：2023-02-07

申请号：US17116029

申请日：2020-12-09

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Jochen Dangelmaier ,  Matthias Eberl ,  Simon Gassner ,  Franz Jost ,  Stefan Kolb ,  Horst Theuss

IPC: G01N21/17 ,  G01N29/02 ,  B81B3/00

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

公开(公告)号：US11422144B2

公开(公告)日：2022-08-23

申请号：US16841870

申请日：2020-04-07

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Horst Theuss ,  Michael Weber

IPC: G01P3/44 ,  H01L25/16 ,  H01L23/62 ,  H01L49/02 ,  H01L23/31 ,  G01D5/14 ,  G01D5/16 ,  H01L23/00

Abstract: A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.

公开(公告)号：US11275059B2

公开(公告)日：2022-03-15

申请号：US16699993

申请日：2019-12-02

Applicant: Infineon Technologies AG

Inventor： Stefan Kolb ,  Alfons Dehe ,  Jochen Huber ,  Franz Jost ,  Horst Theuss ,  Juergen Woellenstein

IPC: G01N29/30 ,  G01N29/24

Abstract: An apparatus for in-situ calibration of a photoacoustic sensor is provided. The apparatus includes a calibration unit that includes at least one processor configured to calculate calibration information. A light emitter of the photoacoustic sensor is configured to emit an electromagnetic spectrum and the photoacoustic sensor is configured to provide at least two measurement signals based on at least two electromagnetic spectra. The calibration unit is configured to compare the at least two measurement signals to obtain the calibration information and apply the calibration information to the photoacoustic sensor to perform the in-situ calibration.

公开(公告)号：US20220065773A1

公开(公告)日：2022-03-03

申请号：US17407803

申请日：2021-08-20

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01N21/17 ,  G01N29/24 ,  B81B7/02

Abstract: A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.