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    Packaging Compatible Wafer Level Capping of MEMS Devices
    141.
    发明申请
    Packaging Compatible Wafer Level Capping of MEMS Devices 有权
    MEMS器件的封装兼容晶圆级封装

    公开(公告)号：US20130341736A1

    公开(公告)日：2013-12-26

    申请号：US13706488

    申请日：2012-12-06

    Applicant: Georgia Tech Research Corporation

    Inventor： Paul A. Kohl ,  Rajarshi Saha ,  Nathan Fritz

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

    Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

    Abstract translation: 本发明公开并要求用于微机电装置（MEMS）的成本有效的晶片级封装工艺。 具体来说，MEMS器件的可移动部件以晶片形式被封装和保护，从而可以使用商品的引线框架封装。 已经使用外涂聚合物，例如环氧环己基多面体低聚倍半硅氧烷（EPOSS）作为掩模材料来模制牺牲聚合物以及覆盖空气腔。 所产生的空气腔是干净，无碎片和坚固的。 空腔具有相当大的强度以承受MEMS器件的引线框架封装期间的成型压力。 已经制造了从20mum×400mum到300mum×400mum的宽范围的空腔，显示出机械稳定。 这些可能会在各种尺寸范围内容纳MEMS器件。 已经使用纳米压痕研究了腔的强度，并使用分析和有限元技术进行了建模。 使用该协议封装的电容谐振器已经显示出清洁的感测电极和良好的功能。

    Packaging for micro electro-mechanical systems and methods of fabricating thereof
    143.
    发明授权
    Packaging for micro electro-mechanical systems and methods of fabricating thereof 有权
    微机电系统的包装及其制造方法

    公开(公告)号：US08476096B2

    公开(公告)日：2013-07-02

    申请号：US10534956

    申请日：2005-03-15

    Applicant: Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

    Inventor： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

    IPC: H01L21/00

    CPC classification number: B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

    Abstract translation: 本公开的实施例提供了用于生产微机电装置包装的系统和方法。 简要描述，在架构中，系统的一个实施例包括形成在基底层上的微电子机械装置; 以及可热分解的牺牲结构，其保护所述微机电装置的至少一部分，其中所述牺牲结构形成在所述基底层上并且围绕包围所述微机电装置的有效表面的气体腔。 还提供了其他系统和方法。

    Latching zip-mode actuated mono wafer MEMS switch method
    147.
    发明授权
    Latching zip-mode actuated mono wafer MEMS switch method 有权
    闭锁拉链模式致动单晶片MEMS开关方法

    公开(公告)号：US07977137B1

    公开(公告)日：2011-07-12

    申请号：US12152130

    申请日：2008-05-08

    Applicant: John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser ,  Donald E. Strawser, legal representative

    Inventor： John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser

    IPC: H01L21/00

    CPC classification number: H01H59/0009 ,  B81B7/0064 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2207/096 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01H2059/0045

    Abstract: A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.

    Abstract translation: 公开了一种用于制造特别适用于微波射频信号的电容耦合信号切换的闭锁拉链模式致动单晶片MEMS开关的方法。 用于开关的单个晶片制造工艺采用牺牲层和这些层的液体移除，以便为超脆弱的开关移动臂构件提供所需的永久物理保护。 还实现了不使用常规保持电极或磁场的实现的MEMS开关的锁定操作。 公开了单个MEMS开关的制造，但是可以实现大的或小的阵列。 公开了一种基于液体去除的制造方法。

    MANUFACTURING METHOD OF THREE-DIMENSIONAL STRUCTURE
    150.
    发明申请
    MANUFACTURING METHOD OF THREE-DIMENSIONAL STRUCTURE 有权
    三维结构的制造方法

    公开(公告)号：US20090304928A1

    公开(公告)日：2009-12-10

    申请号：US12478298

    申请日：2009-06-04

    Applicant: Taisuke Isano ,  Kosuke Asano ,  Yasushi Kaneda

    Inventor： Taisuke Isano ,  Kosuke Asano ,  Yasushi Kaneda

    IPC: B05D5/00

    CPC classification number: B05D5/00 ,  B81C1/00126 ,  B81C2201/0108 ,  B81C2203/038

    Abstract: A method for manufacturing a three-dimensional structure includes forming a first structure having a relief pattern on a substrate, forming a sacrifice layer on the first structure such that the sacrifice layer can be filled in a concave part of the first structure and the sacrifice layer can cover a surface of a convex part of the first structure on a side opposite to the substrate, forming a second structure having a relief pattern on the sacrifice layer, and a fourth step of removing the sacrifice layer from between the first structure and the second structure, and thereby bringing the second structure into contact with the surface of the first structure.

    Abstract translation: 一种制造三维结构的方法包括在基板上形成具有浮雕图案的第一结构，在第一结构上形成牺牲层，使得牺牲层可以填充在第一结构的凹部中，牺牲层 可以在与基板相对的一侧覆盖第一结构的凸部的表面，在牺牲层上形成具有浮雕图案的第二结构，以及从第一结构和第二结构之间移除牺牲层的第四步骤 结构，从而使第二结构与第一结构的表面接触。

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