公开(公告)号：US20080221424A1

公开(公告)日：2008-09-11

申请号：US12123773

申请日：2008-05-20

Applicant: Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

Inventor： Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

IPC: A61B5/04 ,  H01B1/14 ,  C09J133/08

CPC classification number: C08K5/19 ,  C08K5/42 ,  C08L33/00 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/06 ,  C09J2201/602 ,  C09J2433/00 ,  Y10T428/24008 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891

Abstract: An alternating current responsive composite is disclosed. The composite includes a polymeric material and a polar material that is substantially dispersed within the polymeric material. The polar material is responsive to the presence of an alternating current.

Abstract translation: 公开了一种交流响应复合材料。 复合材料包括聚合物材料和基本上分散在聚合材料内的极性材料。 极性材料响应于交流电的存在。

公开(公告)号：US20070212521A1

公开(公告)日：2007-09-13

申请号：US10593622

申请日：2005-03-29

Applicant: Hisami Bessho ,  Hideyuki Sato ,  Akio Sato ,  Masatsugu Shimomura ,  Masaru Tanaka ,  Hiroshi Yabu

Inventor： Hisami Bessho ,  Hideyuki Sato ,  Akio Sato ,  Masatsugu Shimomura ,  Masaru Tanaka ,  Hiroshi Yabu

IPC: B32B3/10

CPC classification number: H01R12/7076 ,  C09J7/22 ,  C09J7/26 ,  C09J2201/128 ,  C09J2201/602 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/0116 ,  H05K2201/09945 ,  H05K2201/10378 ,  Y10T428/24322

Abstract: To provide an anisotropic conductive film which can respond to increasing pitch reduction of connection targets while maintaining connection reliability, and can be manufactured at a lower cost than conventional, and to provide a method of manufacturing the same. The anisotropic conductive film is provided with a porous film consisting of polymer, having numerous holes penetrating in a film thickness direction, the holes being in a honeycomb arrangement and having inner wall surfaces which curve outwards, a conductive material that fills the holes in the porous film, and an adhesive layer coated on both surfaces of the porous film. The porous film is formed by leaving a supporting substrate on which cast is a polymer solution where a polymer is dissolved in a hydrophobic, volatile organic solvent, under high humidity conditions.

Abstract translation: 为了提供能够对维持连接可靠性的连接目标的减小的增加作出响应的各向异性导电膜，并且可以以比传统的更低的成本制造并提供其制造方法。 各向异性导电膜设置有由聚合物组成的多孔膜，其具有沿膜厚度方向穿透的多个孔，该孔为蜂窝结构，并且具有向外弯曲的内壁表面，填充多孔的孔的导电材料 膜和涂覆在多孔膜的两个表面上的粘合剂层。 多孔膜通过在高湿度条件下留下支撑基底而形成，其上浇注聚合物溶液，其中聚合物溶解在疏水性挥发性有机溶剂中。

公开(公告)号：US07253740B2

公开(公告)日：2007-08-07

申请号：US11070454

申请日：2005-03-02

Applicant: Russell P. Cain ,  Bliss G. Carkhuff ,  Andrew M. Lennon

Inventor： Russell P. Cain ,  Bliss G. Carkhuff ,  Andrew M. Lennon

IPC: G08B7/06

CPC classification number: G01K3/14 ,  C09J7/29 ,  C09J2201/602 ,  C09J2400/163 ,  G01K3/005 ,  G01K11/06 ,  G01K2007/166 ,  Y10T428/28

Abstract: An apparatus for monitoring a temperature of a structure, comprising: one or more electrically conductive loops adapted to be affixed to the structure, each including first and second elongate connection strips each made of a first metal composition having a first melting point, and a temperature sensitive band connected between the first and second connection strips and made of a second metal composition having a second melting point less than the first melting point. The apparatus further comprises a monitor, connected to respective ends of the first and second connection strips spaced-apart from the temperature sensitive band, configured to detect an open-circuit in the one or more electrically conductive loops caused when the temperature sensitive band separates from either of the connection strips.

Abstract translation: 一种用于监测结构的温度的装置，包括：一个或多个导电环，其适于固定到所述结构上，每个导电环包括第一和第二细长连接条，每个细长连接条由具有第一熔点的第一金属组合物和温度 敏感带连接在第一和第二连接条之间并且由具有小于第一熔点的第二熔点的第二金属组合物制成。 该装置还包括监测器，连接到与温度敏感带间隔开的第一和第二连接条的相应端部，被配置为检测当温度敏感带分离时引起的一个或多个导电环路中的开路 任一个连接条。

公开(公告)号：US20070116961A1

公开(公告)日：2007-05-24

申请号：US11553523

申请日：2006-10-27

Applicant: Glen Connell ,  Michael Kropp ,  Eric Larson

Inventor： Glen Connell ,  Michael Kropp ,  Eric Larson

IPC: B32B27/38 ,  C08L63/00 ,  B32B37/00

CPC classification number: C09J9/02 ,  C08G59/4261 ,  C08G59/5086 ,  C08G59/621 ,  C08G59/686 ,  C08K3/08 ,  C08L63/00 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/602 ,  C09J2463/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  Y10T428/31511

Abstract: The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activated curing agent, and electrically conductive particles.

Abstract translation: 本发明提供各向异性导电粘合剂组合物，其包含多官能缩水甘油醚环氧树脂，苯氧基树脂，核 - 壳聚合物，任选的热塑性树脂，热活化固化剂和导电颗粒的混合物。

公开(公告)号：US20070087153A1

公开(公告)日：2007-04-19

申请号：US11545194

申请日：2006-10-10

Applicant: Anthony Port ,  Janet Yeatts

Inventor： Anthony Port ,  Janet Yeatts

IPC: B32B33/00

CPC classification number: B32B7/06 ,  B32B27/08 ,  B32B27/283 ,  B32B27/286 ,  B32B27/302 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/748 ,  B32B2323/10 ,  B32B2325/00 ,  B32B2333/04 ,  B32B2363/00 ,  B32B2367/00 ,  B32B2369/00 ,  B32B2383/00 ,  C09J7/201 ,  C09J7/22 ,  C09J7/401 ,  C09J7/405 ,  C09J2201/602 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2425/006 ,  C09J2433/006 ,  C09J2467/006 ,  C09J2479/026 ,  C09J2483/005 ,  H01L21/6835 ,  Y10T428/14 ,  Y10T428/31507

Abstract: A release liner 10 comprising a polymeric film substrate 11, typically PET film, having a transparent layer 12 of electrically conductive polymer, preferably a PEDOT-PSS (Polyethylenedioxythiophene/polystyrenesulphonic acid), formed on one side thereof, the conductive polymer layer 12 being over coated with a transparent layer 13 of a curable silicone polymer or copolymer.

Abstract translation: 包含聚合物膜基材11（通常为PET膜）的隔离衬垫10，其一侧形成有导电聚合物的透明层12，优选为PEDOT-PSS（聚亚乙基二氧噻吩/聚苯乙烯磺酸），导电聚合物层12结束 涂覆有可固化的硅氧烷聚合物或共聚物的透明层13。

公开(公告)号：US20060255029A1

公开(公告)日：2006-11-16

申请号：US11254483

申请日：2005-10-20

Applicant: Marvin Bone

Inventor： Marvin Bone

IPC: H05B6/36

CPC classification number: C09J5/06 ,  C09J2201/602 ,  H05B6/105 ,  H05B6/365

Abstract: An elongated workpiece is inductively heated by a difference in an amount of magnetic flux flowing in a portion of the elongated workpiece compared to an amount of magnetic flux around the same portion of the elongated workpiece. The flux differential induces circumferential eddy currents to heat that portion of the workpiece. The alternating magnetic flux is conducted to the workpiece in a high permeability flux guide.

Abstract translation: 与细长工件的相同部分周围的磁通量相比，细长工件通过在细长工件的一部分中流动的磁通量的差感应加热。 通量差异引起周向涡流以加热工件的该部分。 交变磁通在高磁导率磁通引导件中传导到工件。

公开(公告)号：US07084516B2

公开(公告)日：2006-08-01

申请号：US10483270

申请日：2002-07-15

Applicant: Atsushi Takei ,  Hisatsugu Tokunaga ,  Mikio Shimizu

Inventor： Atsushi Takei ,  Hisatsugu Tokunaga ,  Mikio Shimizu

IPC: H01L29/40

CPC classification number: C09J133/08 ,  C08L2666/36 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/602 ,  C09J2433/00 ,  C09J2467/006 ,  G02F1/133502 ,  G02F2202/22 ,  G02F2202/28 ,  H01L2224/274 ,  H01L2924/01019 ,  H01L2924/09701

Abstract: A surface protection film which comprises a substrate layer and an adhesive layer, and of which the electrostatic charge by peeling from an adherend is from +0.01 to −0.01 nC/mm2.

Abstract translation: 一种表面保护膜，其包括基材层和粘合剂层，其中通过从被粘物剥离的静电电荷为+ 0.01至-0.01nC / mm 2。

公开(公告)号：US07033668B2

公开(公告)日：2006-04-25

申请号：US10190799

申请日：2002-07-08

Applicant: Uwe Schümann ,  Kirstin Weiland ,  Harald Kehler

Inventor： Uwe Schümann ,  Kirstin Weiland ,  Harald Kehler

IPC: B32B7/12 ,  B32B15/00

CPC classification number: B03C3/60 ,  C08K3/26 ,  C08L75/04 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2475/00 ,  Y10T156/10 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2896

Abstract: A preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and comprises an alkaline, solid, pulverized, mineral filler with a weight fraction of between more than 5% by weight and 60% by weight, based on the total weight of the adhesive, so that the permanently pressure sensitively adhesive surface of the adhesive tape has a pH of more than 8, and a conductive additive, especially a metal powder, a powder coated with a metal, and/or metallized beads, with a weight fraction of between more than 5% by weight and 60% by weight, so that the adhesive tape is electrically conductive in the z direction, i.e., in the direction of the thickness of the tape.

公开(公告)号：US20060060296A1

公开(公告)日：2006-03-23

申请号：US10946701

申请日：2004-09-22

Applicant: David Sigler ,  James Schroth

Inventor： David Sigler ,  James Schroth

IPC: B32B37/00 ,  B29C65/00

CPC classification number: H01B1/22 ,  B32B37/12 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2457/18 ,  C09J5/06 ,  C09J9/02 ,  C09J2201/602 ,  C09J2400/163 ,  Y10T156/1016

Abstract: Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed together and an electric current passed between them to momentarily melt the conductive particles. The molten droplets agglomerate and wet the facing surfaces. When the molten clusters re-solidify, electrically conductive paths are formed between the workpieces. For example, the practice is useful for bonding ferrous-based or aluminum-based alloy sheets, strips or plates in making products such as bipolar plates for fuel cells.

公开(公告)号：US20050153101A1

公开(公告)日：2005-07-14

申请号：US11003731

申请日：2004-12-06

Applicant: Miho Yamaguchi ,  Yuji Hotta

Inventor： Miho Yamaguchi ,  Yuji Hotta

IPC: C09J7/00 ,  C09J7/02 ,  H01L21/56 ,  H01L21/60 ,  H01L23/14 ,  H01L23/31 ,  H01R4/04 ,  B32B3/10

CPC classification number: H01R4/04 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/602 ,  C09J2203/326 ,  H01L21/563 ,  H01L23/145 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/27438 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/249953 ,  Y10T428/249982 ,  Y10T428/249983 ,  Y10T428/249984 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00

Abstract: A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.

Abstract translation: 一种多孔粘合片1，其具有在粘合有机膜3的厚度方向A上彼此大致平行的多个通孔2，其中，所述通孔具有从一个开口2a到另一个开口的直径方向上的大致相等的部分 2b及其制造方法，以及具有多孔粘合片31的半导体晶片，其包括具有电极33的半导体晶片32，粘附到半导体晶片的多孔粘合片1和通过填充 设置有导电材料的电极33上的通孔2及其制造方法。