公开(公告)号：US20180190891A1

公开(公告)日：2018-07-05

申请号：US15740131

申请日：2016-06-01

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Masahiro ADACHI ,  Takashi MATSUURA

IPC: H01L35/26 ,  H01L35/22 ,  H01L35/34 ,  G01J1/04

CPC classification number: H01L35/26 ,  B82Y15/00 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B33/06 ,  G01J1/02 ,  G01J1/0407 ,  G01J5/046 ,  G01J5/12 ,  H01J37/24 ,  H01L35/22 ,  H01L35/34 ,  Y10S977/773 ,  Y10S977/814 ,  Y10S977/90 ,  Y10S977/954

Abstract: This invention relates to a thermoelectric material constituted of nanostructures and a thermoelectric element and an optical sensor including the same, as well as to a method for manufacturing a thermoelectric material constituted of nanostructures. An object of the present disclosure is to achieve better thermoelectric characteristics of the thermoelectric material containing nanoparticles. The thermoelectric material includes a first material having a band gap and a second material different from the first material. The thermoelectric material contains a plurality of nanoparticles distributed in a base material which is a mixture of the first material and the second material. A composition of the second material in the thermoelectric material is not lower than 0.01 atomic % and not higher than 2.0 atomic % of the thermoelectric material.

公开(公告)号：US20180188107A1

公开(公告)日：2018-07-05

申请号：US15736381

申请日：2016-06-15

Applicant: National Institute of Advanced Industrial Science and Technology

Inventor： Nobuyuki Zen ,  Yasunori Mawatari ,  Go Fujii ,  Nobuyuki Yoshikawa

IPC: G01J1/44 ,  G01J1/02 ,  H01L39/10 ,  H01L39/02

CPC classification number: G01J1/44 ,  G01J1/02 ,  G01J2001/442 ,  G01J2001/4446 ,  H01L39/00 ,  H01L39/025 ,  H01L39/10 ,  H04L9/0852

Abstract: Provided are a photon detection device and a photon detection method being practical, capable of performing photon detection in which no afterpulse is generated and generation of a dark count is suppressed, and capable of obtaining a high counting rate with low jitter. The photon detection device of the present invention includes: a photon detection section having a long plate-shaped superconducting stripline whose plate surface is a photon detection surface, and a bias current supply section supplying a bias current to the superconducting stripline; and a single flux quantum comparator circuit capable of detecting magnetic flux scattered from the superconducting stripline upon photon detection.

公开(公告)号：US20180077333A1

公开(公告)日：2018-03-15

申请号：US15552083

申请日：2015-11-20

Applicant: Sony Corporation

Inventor： Yusuke Fujimoto ,  Masahiro Watanabe ,  Masahiro Shimizu ,  Tetsunori Nakayama

IPC: H04N5/232

CPC classification number: H04N5/23203 ,  G01J1/02 ,  G03B15/00 ,  G03B17/38 ,  H04N5/225 ,  H04N5/232 ,  H04N5/23216 ,  H04N7/188

Abstract: To provide an imaging control device, an imaging control method, and an imaging control system, which can capture an image at a proper timing, while suppressing increase of the cost.The imaging control device includes: an acquisition unit that acquires radio wave strength information indicating strength of a received radio wave; and a control unit that performs imaging control on the basis of a change of the radio wave strength information acquired by the acquisition unit. The imaging control system includes: a communication device that includes a communication unit that transmits a radio wave; and an imaging control device that includes an acquisition unit that acquires radio wave strength information indicating a strength of the radio wave received from the communication unit of the communication device, and a control unit that performs imaging control on the basis of a change of the radio wave strength information acquired by the acquisition unit.

公开(公告)号：US09904012B2

公开(公告)日：2018-02-27

申请号：US15628273

申请日：2017-06-20

Applicant: Luxtera, Inc.

Inventor： Thierry Pinguet ,  Attila Mekis ,  Steffen Gloeckner

IPC: G02B6/34 ,  G02B6/124 ,  G01J1/02 ,  G02B6/42 ,  G02B6/30 ,  G01J1/04 ,  G02B6/12

CPC classification number: G02B6/124 ,  G01J1/02 ,  G01J1/0425 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4208 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12157

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.

公开(公告)号：US20180031417A1

公开(公告)日：2018-02-01

申请号：US15549713

申请日：2016-02-09

Applicant: Nissan Motor Co., Ltd.

Inventor： Naoyuki MORIMIYA ,  Naoyuki TORII ,  Naoki OKAMOTO ,  Naoya YOSHIDA ,  Tsuneo SAITO

IPC: G01J1/04 ,  G02B7/00 ,  G02B27/12 ,  G02B5/00 ,  G02B27/10

CPC classification number: G01J1/0418 ,  G01J1/02 ,  G02B5/003 ,  G02B7/008 ,  G02B27/108 ,  G02B27/126 ,  H01S3/00

Abstract: An optical attenuator has a sampling prism, a biconcave lens and an absorption member. A branch member splits a laser beam. An expansion member expands the shape of the split laser beam. The absorption member absorbs the energy of the expanded laser beam. A light receiving part of the absorption member receives the expanded laser beam. A first distribution part of the absorption member adjacent to the light receiving part, introduces or leads out a medium (cooling water) from a first opening and distributes the medium, which absorbs heat generated in the light receiving part by the laser beam. A second distribution part of the absorption member leads out or introduces cooling water from a second opening, and distributes the cooling water, which moves through a communicating part that communicates with the first distribution part.

公开(公告)号：US20180026145A1

公开(公告)日：2018-01-25

申请号：US15551099

申请日：2015-12-14

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shogo KAMAKURA ,  Ryuta YAMADA ,  Kenichi SATO

IPC: H01L31/02 ,  G01J1/02 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/107 ,  G01J1/44 ,  H01L27/144

CPC classification number: H01L31/02005 ,  G01J1/02 ,  G01J1/44 ,  G01J2001/4466 ,  G01J2001/448 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/1446 ,  H01L31/02027 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/10 ,  H01L31/107 ,  H01L2224/05554 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/12043 ,  H01L2924/30105 ,  H04N5/369 ,  H01L2924/00014

Abstract: A semiconductor substrate includes a first region in which a plurality of pixels are disposed and a second region located inside the first region to be surrounded by the first region when viewed from a direction in which a principal surface and a principal surface oppose each other. A through-hole penetrating through the semiconductor substrate is formed in the second region of the semiconductor substrate. An electrode disposed on a side of the principal surface of the semiconductor substrate and electrically connected to the plurality of pixels and an electrode disposed on a side of a principal surface of a mount substrate are connected to each other via a bonding wire inserted through the through-hole.

公开(公告)号：USRE46586E1

公开(公告)日：2017-10-24

申请号：US14721236

申请日：2015-05-26

Applicant: Lutron Electronics Co., Inc.

Inventor： James P. Steiner ,  Greg Edward Sloan

IPC: G08B13/08 ,  G01J1/02 ,  G01J1/32 ,  G01J1/44 ,  H05B37/02 ,  G01J1/16

CPC classification number: H05B37/0218 ,  G01J1/02 ,  G01J1/0219 ,  G01J1/0228 ,  G01J1/0247 ,  G01J1/16 ,  G01J1/32 ,  G01J1/44 ,  H05B37/02 ,  H05B37/0272 ,  Y02B20/46

Abstract: A wireless battery-powered daylight sensor for measuring a total light intensity in a space is operable to transmit wireless signals using a variable transmission rate that is dependent upon the total light intensity in the space. The sensor comprises a photosensitive circuit, a wireless transmitter for transmitting the wireless signals, a controller coupled to the photosensitive circuit and the wireless transmitter, and a battery for powering the photosensitive circuit, the wireless transmitter, and the controller. The photosensitive circuit is operable to generate a light intensity control signal in response to the total light intensity in the space. The controller transmits the wireless signals in response to the light intensity control signal using the variable transmission rate that is dependent upon the total light intensity in the space. The variable transmission rate may be dependent upon an amount of change of the total light intensity in the space. In addition, the variable transmission rate may be further dependent upon a rate of change of the total light intensity in the space.

公开(公告)号：US20170285263A1

公开(公告)日：2017-10-05

申请号：US15628273

申请日：2017-06-20

Applicant: Luxtera, Inc.

Inventor： Thierry Pinguet ,  Attila Mekis ,  Steffen Gloeckner

IPC: G02B6/124 ,  G01J1/02

CPC classification number: G02B6/124 ,  G01J1/02 ,  G01J1/0425 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4208 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12157

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.

公开(公告)号：US20170167948A1

公开(公告)日：2017-06-15

申请号：US15390854

申请日：2016-12-27

Applicant: FFEI Limited

Inventor： Martin Philip GOUCH

IPC: G01M11/02 ,  G02B21/00 ,  G02B21/24 ,  G01J1/02

CPC classification number: G01M11/0257 ,  G01J1/02 ,  G02B21/0016 ,  G02B21/006 ,  G02B21/008 ,  G02B21/245 ,  G02B21/367

Abstract: A method of estimating an in-focus level of a target in an image scanning apparatus is provided, wherein the image scanning apparatus comprises a first line scan detector configured to obtain one or more image scan lines of the target and a second line scan detector configured to obtain one or more focus scan lines of the target. The method comprises obtaining at least one image scan line of the target using the first line scan detector, each at least one image scan line being obtained at a respective focus level; obtaining at least one focus scan line of the target using the second line scan detector, each at least one focus scan line being obtained at a respective focus level; calculating at least one focus parameter using at least the at least one focus scan line; and estimating a nominal in-focus level of the target using the calculated focus parameter(s).

公开(公告)号：US09638573B2

公开(公告)日：2017-05-02

申请号：US14235483

申请日：2012-07-27

Applicant: Martin Philip Gouch

Inventor： Martin Philip Gouch

IPC: G01J1/00 ,  G01J1/02 ,  G02B21/24 ,  G02B21/36 ,  G02B21/00

CPC classification number: G01M11/0257 ,  G01J1/02 ,  G02B21/0016 ,  G02B21/006 ,  G02B21/008 ,  G02B21/245 ,  G02B21/367

Abstract: A method of estimating an in-focus level of a target in an image scanning apparatus is provided, wherein the image scanning apparatus comprises a first line scan detector configured to obtain one or more image scan lines of the target and a second line scan detector configured to obtain one or more focus scan lines of the target. The method comprises obtaining at least one image scan line of the target using the first line scan detector, each at least one image scan line being obtained at a respective focus level; obtaining at least one focus scan line of the target using the second line scan detector, each at least one focus scan line being obtained at a respective focus level; calculating at least one focus parameter using at least one focus scan line; and estimating a nominal in-focus level of the target using the calculated focus parameter(s).