Abstract:
A lithographic apparatus for patterning a beam of radiation and projecting it onto a substrate, comprising at least two spectral purity filters configured to reduce the intensity of radiation in the beam of radiation in at least one undesirable range of radiation wavelength, wherein the two spectral purity filters are provided with different radiation filtering structures from each other.
Abstract:
A method, for examining an object using an X-ray recording system, includes during an X-ray image recording, moving components relative to one another with the lateral displacement by displacement distances. The method includes generating the X-ray image recording during the displacement from n partial images, so that the total exposure time of the X-ray image recording is made up from a sum of partial exposure times. In each of the partial images, the intensity is determined in each pixel. The position of the second component relative to the first component is determined for each recording of the partial images. Finally, the image information is determined from the partial images and the displacements.
Abstract:
A reflective optical element for a microlithographic projection exposure apparatus, a mask inspection apparatus or the like. The reflective optical element has an optically effective surface, an element substrate (12, 32, 42, 52), a reflection layer system (14, 34, 44, 54) and at least one deformation reduction layer (15, 35, 45, 55, 58). When the optically effective surface (11, 31, 41, 51) is irradiated with electromagnetic radiation, a maximum deformation level of the reflection layer system is reduced in comparison with a deformation level of an analogously constructed reflective optical element without the deformation reduction layer.
Abstract:
An EUV mirror with a substrate and a multilayer arrangement including: a periodic first layer group having N1>1 first layer pairs of period thickness P1 and arranged on a radiation entrance side of the multilayer arrangement; a periodic second layer group having N2>1 second layer pairs of period thickness P2 and arranged between the first layer group and the substrate; and a third layer group having N3 third layer pairs arranged between the first and second layer groups. N1>N2. The third layer group has a mean third period thickness P3 which deviates from an average period thickness PM=(P1+P2)/2 by a period thickness difference ΔP. ΔP corresponds to the quotient of the optical layer thickness (λ/4) of a quarter-wave layer and the product of N3 and cos(AOIM), AOIM being the mean incidence angle for which the multilayer arrangement is designed.
Abstract:
A deflection mirror (1, 501, etc.) for a microlithography projection exposure apparatus for illuminating an object field in an object plane of the projection exposure apparatus (1067) using the deflection mirror with grazing incidence. This deflection mirror has a substrate (3, 503, etc.) and at least one layer system (5, 505, etc.), and during operation light impinges on said mirror at a multiplicity of angles of incidence, wherein the layer system is designed such that, for light having a wavelength of less than 30 nm, for an angle of incidence of between 55° and 70°, the variation of the reflectivity is less than 20%, in particular less than 12%.
Abstract:
A method is provided for producing a microstructure. The method includes the first step of forming a supporting layer on a base substrate including a silicon substrate provided with recessed sections at a first surface thereof and a metal structure filling the recessed sections so as to come in contact with the metal structure at the first surface, the second step of forming a structure including the metal structure and the supporting layer by selectively etching the silicon substrate to expose at least the surface of the metal structure opposite the surface in contact with the supporting layer from the silicon substrate, and the third step of selectively etching the supporting layer of the metal structure.
Abstract:
A mirror (1) for a microlithography projection exposure apparatus including a substrate (3) and a reflective coating (5). A functional coating (11) between the substrate (3) and the reflective coating (5) has a local form variation (19) for correcting the surface form of the mirror (1), wherein the local form variation (19) is brought about by a local variation in the chemical composition of the functional coating (11) and wherein a thickness of the reflective coating (5) is not changed by the local variation in the chemical composition of the functional coating (11). The local variation in the chemical composition of the functional coating (11) can be brought about by bombardment with particles (15), for example with hydrogen ions.
Abstract:
An apparatus for deriving X-ray absorbing and phase information comprises; a splitting element for splitting spatially an X-ray, a detector for detecting intensities of the X-rays transmitted through an object, the intensity of the X-rays changing according to X-ray phase and also position changes, and an calculating unit for calculating an X-ray transmittance image, and an X-ray differential phase contrast or phase sift contrast image as the phase information. The X-ray is split into two or more X-rays having different widths, and emitted onto the detector unit. And, the calculating unit calculates the X-ray absorbing and phase information based on a difference, between the two or more X-rays, in correlation between the changing of the phase of the X-ray and the changing the intensity of the X-ray in the detector unit.
Abstract:
A mirror (13) for use e.g. in an EUV lithography apparatus or an EUV mask metrology system, with: a substrate (15) and a coating (16) reflective to EUV radiation (6), the reflective coating having a capping layer (18) composed of an oxynitride, in particular composed of SiNxOY, wherein a nitrogen proportion x in the oxynitride NxOY is between 0.4 and 1.4. Also provided are an EUV lithography apparatus having at least one such EUV mirror (13) and a method for operating such an EUV lithography apparatus.
Abstract translation:镜子(13) 在EUV光刻设备或EUV掩模测量系统中,具有:反射到EUV辐射(6)的基底(15)和涂层(16),所述反射涂层具有由氮氧化物组成的覆盖层(18),特别是 由SiN x O Y组成,其中氮氧化物N x OY中的氮比例x在0.4和1.4之间。 还提供了具有至少一个这样的EUV反射镜(13)的EUV光刻设备和用于操作这样的EUV光刻设备的方法。
Abstract:
A computation apparatus includes a normalization unit configured to normalize values of two of distributions including a distribution of absorption information of a subject, a distribution of phase information of the subject, and a distribution of scattering information of the subject which are calculated by using a projection image of the subject by X-rays, and a calculation unit configured to calculate a difference or quotient of the normalized two distributions and obtain a composite distribution.