公开(公告)号：US09813831B1

公开(公告)日：2017-11-07

申请号：US15363863

申请日：2016-11-29

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Axel Thomsen

IPC: H04R29/00 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R29/004 ,  H04R3/06 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mechanically displace relative to the backplate as a function of sound pressure incident upon the diaphragm. The diaphragm may comprise third and fourth electrodes electrically isolated from one another and mechanically coupled to the diaphragm in a fixed relationship relative to the diaphragm such that the third and fourth electrodes mechanically displace relative to the backplate as the function of the sound pressure. The first and third electrodes may form a first capacitor, the second and fourth electrodes may form a second capacitor, and the first capacitor may be configured to sense a displacement of the diaphragm responsive to which the second capacitor may be configured to apply an electrostatic force to the diaphragm to return the diaphragm to an original position.

公开(公告)号：US09809444B2

公开(公告)日：2017-11-07

申请号：US15443922

申请日：2017-02-27

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H02N2/02 ,  H04R19/00

CPC classification number: B81B3/0021 ,  B81B3/0059 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0307 ,  B81C1/00158 ,  B81C2201/0197 ,  H01L29/84 ,  H02N1/008 ,  H02N2/02 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003 ,  H04R2207/021 ,  H04R2231/003 ,  H04R2410/03

Abstract: According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.

公开(公告)号：US20170318395A1

公开(公告)日：2017-11-02

申请号：US15141335

申请日：2016-04-28

Applicant: INVENSENSE, INC.

Inventor： Kieran Harney ,  Adrianus Maria Lafort ,  Brian Moss ,  Dion Ivo De Roo

IPC: H04R19/04 ,  H04R1/04

CPC classification number: H04R19/04 ,  B81B3/0018 ,  H04R1/04 ,  H04R7/06 ,  H04R19/01 ,  H04R2201/003 ,  H04R2410/03

Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.

公开(公告)号：US20170318393A1

公开(公告)日：2017-11-02

申请号：US15142682

申请日：2016-04-29

Applicant: Infineon Technologies AG

Inventor： Luca Valli ,  Benno Muehlbacher ,  Richard Gaggl

IPC: H04R19/00 ,  H02M3/07 ,  H03F3/183

CPC classification number: H04R19/005 ,  H02M3/07 ,  H03F3/183 ,  H03F3/187 ,  H03F3/45475 ,  H03F2200/03 ,  H03F2200/144 ,  H03F2203/45526 ,  H04R3/06 ,  H04R2201/003 ,  H04R2410/00 ,  H04R2410/03

Abstract: According to an embodiment, a circuit includes a high-Ω resistor including a plurality of semiconductor junction devices coupled in series and a plurality of additional capacitances formed in parallel with the plurality of semiconductor junction devices. Each semiconductor junction device of the plurality of semiconductor junction devices includes a parasitic doped well capacitance configured to insert a parasitic zero in a noise transfer function of the high-Ω resistor. Each additional capacitance of the plurality of additional capacitances is configured to adjust a parasitic pole in the noise transfer function of the high-Ω resistor in order to compensate for the parasitic zero.

公开(公告)号：US20170313579A1

公开(公告)日：2017-11-02

申请号：US15362556

申请日：2016-11-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Omar GHIDONI ,  Roberto BRIOSCHI

IPC: B81B7/02 ,  H04R1/04

CPC classification number: B81B7/02 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

公开(公告)号：US09807516B2

公开(公告)日：2017-10-31

申请号：US14832913

申请日：2015-08-21

Applicant: Chao Wang ,  Bin Xu

Inventor： Chao Wang ,  Bin Xu

IPC: H04R1/04 ,  H04R19/04 ,  B81B7/00 ,  H04R19/00

CPC classification number: H04R19/04 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  H04R19/005 ,  H04R2201/003 ,  H04R2209/022

Abstract: A micro-electro-mechanical system (MEMS) microphone package is provided in the present disclosure. The MEMS microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board. The shielding ring is configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board.

公开(公告)号：US20170311088A1

公开(公告)日：2017-10-26

申请号：US15497366

申请日：2017-04-26

Applicant: DONGBU HITEK CO., LTD.

Inventor： Jong Won SUN ,  Han Choon LEE

IPC: H04R19/04 ,  B81B7/00 ,  H04R19/00 ,  B81C1/00 ,  H04R31/00 ,  H04R7/18

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  B81C2201/0109 ,  B81C2201/013 ,  H04R7/18 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and an anchor extending from a circumference of the diaphragm to be connected with an end portion of the diaphragm. The diaphragm is spaced apart from the substrate and the back plate to covers the cavity, and the diaphragm senses an acoustic pressure to generate a displacement. The anchor extends from a circumference of the diaphragm to be connected with an end portion of the diaphragm, and is connected with the substrate to support the diaphragm. Thus, the MEMS microphone can prevent a portion of an insulation layer located around the anchor from remaining and can prevent a buckling phenomenon of the diaphragm from occurring.

公开(公告)号：US20170311082A1

公开(公告)日：2017-10-26

申请号：US15643842

申请日：2017-07-07

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Reinhard Gabl

IPC: H04R7/02 ,  H04R19/00 ,  H04R23/00

CPC classification number: H04R7/02 ,  H04R19/005 ,  H04R23/00 ,  H04R2201/003

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

公开(公告)号：US20170304121A1

公开(公告)日：2017-10-26

申请号：US15517552

申请日：2015-10-01

Applicant: SAVOX COMMUNICATIONS OY AB (LTD)

Inventor： Janne ROSTI ,  Ville RIIKONEN

IPC: A61F11/14 ,  G10L21/0232 ,  H04R3/04 ,  H04R1/10 ,  H04R19/04

CPC classification number: A61F11/14 ,  A61F2011/145 ,  G10L21/0232 ,  H04R1/1008 ,  H04R1/1041 ,  H04R3/04 ,  H04R19/04 ,  H04R2201/003

Abstract: An ear cup for a hearing protector includes a cup-shaped outer casing, a sealing ring on a rim of the outer casing, and at least one electrical component such as a microphone. The electrical component is mounted on a flexible circuit board attached on the outer surface of the outer casing, where the outer casing includes a slit through which the flexible circuit board extends to the inside of the outer casing so as to provide electrical connections between the electrical component and an electrical circuitry inside the outer casing. Thus, there is no need for wide openings on the outer casing of the ear cup, instead only a narrow slit suffices. This facilitates achieving good noise reduction properties.

公开(公告)号：US09800971B2

公开(公告)日：2017-10-24

申请号：US15064277

申请日：2016-03-08

Applicant: Knowles Electronics, LLC

Inventor： Matthew Manley ,  John Rodack

IPC: H04R19/04 ,  H04R1/34 ,  H04R19/00 ,  H04R1/04

CPC classification number: H04R1/342 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: An apparatus includes a microphone and a gasket. The microphone includes a base having an inner surface and an outer surface. The inner surface is generally parallel with the outer surface. The base has a port extending from the outer surface to the inner surface. The microphone includes a micro electro mechanical system (MEMS) transducer coupled to the inner surface of the base over the port. The microphone has a cover coupled to the base and the cover encloses the MEMS transducer. The gasket is coupled to the outer surface of the base and forms a channel. The channel has a first end and a second end. The first end communicates with the port of the microphone, and the second end of the channel is generally aligned with an edge of the base.