公开(公告)号：US20040214006A1

公开(公告)日：2004-10-28

申请号：US10823003

申请日：2004-04-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kumiko Hirayama ,  Fumio Echigo ,  Izuru Nakai ,  Yoji Ueda

IPC: B32B027/38 ,  B32B027/08

CPC classification number: H05K3/4069 ,  H05K1/0201 ,  H05K3/0032 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T428/31522

Abstract: A member for a circuit board according to the present invention includes a prepreg and a mold release film that is provided on at lease one side of the prepreg. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. A method of manufacturing a member for a circuit board according to the present invention includes allowing a mold release film to adhere to at least one side of a prepreg by heating and pressing. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. In the method, the heating is performed at a temperature not lower than a softening point of the prepreg and not higher than an endothermic temperature of the heat absorbing substance. Thus, a member for a circuit board that can prevent or reduce the occurrence of deformation such as contraction of a mold release film even when processing holes using a laser or the like, a method of manufacturing the same, and methods of manufacturing circuit boards are provided.

Abstract translation: 根据本发明的电路板的构件包括预浸料坯和脱模膜，其设置在预浸料的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 根据本发明的制造电路板的部件的方法包括通过加热和压制使脱模膜粘附到预浸料坯的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 在该方法中，在不低于预浸料坯的软化点的温度下进行加热，且不高于吸热物质的吸热温度。 因此，即使使用激光等来处理孔也能够防止或减少脱模膜的收缩等变形的发生的电路板的构件，其制造方法以及制造电路板的方法是： 提供。

公开(公告)号：US06737770B2

公开(公告)日：2004-05-18

申请号：US10042305

申请日：2002-01-11

Applicant: Hideki Sunaga ,  Takeshi Ohba ,  Hiromi Kawarai ,  Kazunori Yamada ,  Narihito Sano

Inventor： Hideki Sunaga ,  Takeshi Ohba ,  Hiromi Kawarai ,  Kazunori Yamada ,  Narihito Sano

IPC: H01H3776

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H2037/046 ,  H01H2037/763 ,  H02K11/01 ,  H02K11/21 ,  H02K11/215 ,  H02K11/25 ,  H02K11/27 ,  H02K11/33 ,  H05K1/0206 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/09572 ,  H05K2201/10181 ,  H05K2203/0455 ,  H05K2203/176

Abstract: A brushless motor for a blower fan unit has a circuit structure constituted by a drive control circuit and a fuse member. The drive control circuit supplying drive current comprises a first circuit section for eliminating surges of electric power and a second circuit section for controlling magnetic field generated by the stator. The first and second circuit sections are three-dimensionally arranged with a predetermined space therebetween. The fuse member electrically connects the first and second circuit sections. An end portion of the fuse member is welded with the first circuit section, and the other end portion of the fuse member is soldered with the second circuit section. The fuse member cuts an electrical connection between the first and second circuit sections when a temperature of solder becomes higher than a predetermined temperature.

Abstract translation: 用于鼓风机单元的无刷电动机具有由驱动控制电路和保险丝构件构成的电路结构。 提供驱动电流的驱动控制电路包括用于消除电力浪涌的第一电路部分和用于控制由定子产生的磁场的第二电路部分。 第一和第二电路部分三维地布置有它们之间的预定间隔。 保险丝构件电连接第一和第二电路部分。 保险丝部件的端部与第一电路部分焊接，并且熔丝部件的另一端部与第二电路部分焊接。 当焊料的温度变得高于预定温度时，熔丝部件切割第一和第二电路部分之间的电连接。

公开(公告)号：US06678138B2

公开(公告)日：2004-01-13

申请号：US09848756

申请日：2001-05-03

Applicant: Ronald William Glaser ,  James Albert Glaser ,  Benny John Whitehead

Inventor： Ronald William Glaser ,  James Albert Glaser ,  Benny John Whitehead

IPC: H02H504

CPC classification number: H02H9/042 ,  H05K1/0201 ,  H05K1/0254 ,  H05K1/18 ,  H05K2201/09781 ,  H05K2201/10181 ,  H05K2203/304

Abstract: A surge suppressor conducts heat from a surge protection component (SSC) through a heat conductive element, such as a copper pad, on a printed circuit board, to at least one thermal fuse to cause the thermal fuse to open when the resistance of the SSC begins to decrease, resulting in an increase of heat generated by the SSC.

Abstract translation: 浪涌抑制器通过印刷电路板上的诸如铜焊盘之类的导热元件将浪涌保护元件（SSC）的热传导至至少一个热熔断体，以在SSC的电阻 开始减少，导致SSC产生的热量增加。

公开(公告)号：US20030227756A1

公开(公告)日：2003-12-11

申请号：US10386466

申请日：2003-03-13

Applicant: Seiko Epson Corporation

Inventor： Takashi Abe

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H05K7/20209 ,  H03F3/343 ,  H03F3/505 ,  H05K1/0201 ,  H05K1/18

Abstract: To provide temperature characteristic compensation apparatus that correct temperature characteristics of control circuits using thermal sensors into linear or optional temperature gradients to guarantee correct and stable operations thereof. It is equipped with a temperature characteristic compensation apparatus, comprising: a constant current source in which a plurality of constant current paths 31, 32, 33 that include the constant current path 32 having a first resistance R1 being interposed therein, which compose current mirror circuits in multiple stages; a band gap circuit 20 formed from a pair of transistors 5, 6 that are connected to the constant current paths 31, 32, respectively; and a voltage follower circuit 60, including the aforementioned constant current source and the band gap circuit that provide a reference voltage VST, which supplies the reference voltage VST at a low impedance, wherein the ratio between the first and second resistances R1 and R2 can be freely selected in connection with the ratio between emitter areas E1 and E2 of the pair of transistors 5 and 6 (the size ratio of the two transistors), such that a gradient of temperature coefficient TC nullmV/null C.null of the output voltage VST can be flexibly set.

Abstract translation: 提供温度特性补偿装置，其使用热传感器将控制电路的温度特性校正为线性或可选的温度梯度，以保证其正确和稳定的操作。 具有温度特性补偿装置，包括：恒流源，其中包括具有插入其中的第一电阻R1的恒流通路32的多个恒流通路31,32,33，其构成电流镜电路 在多个阶段; 由一对分别连接到恒流通路31,32的一对晶体管5,6形成的带隙电路20; 以及电压跟随器电路60，其包括提供参考电压VST的低阻抗的上述恒流源和带隙电路，其中第一和第二电阻R1和R2之间的比率可以是 结合两对晶体管5和6的发射极区域E1和E2之间的比率（两个晶体管的尺寸比）自由选择，使得输出电压的温度系数TC [mV /℃]的梯度 VST可以灵活设置。

公开(公告)号：US06636409B2

公开(公告)日：2003-10-21

申请号：US09836888

申请日：2001-04-16

Applicant: Dalibor Kladar ,  James Funke ,  Chi Thuong Ha ,  Anthony-Cernan Mendoza ,  Mieczyslaw Bandura ,  Mahoud Ghanem

Inventor： Dalibor Kladar ,  James Funke ,  Chi Thuong Ha ,  Anthony-Cernan Mendoza ,  Mieczyslaw Bandura ,  Mahoud Ghanem

IPC: H02H100

CPC classification number: H01H85/44 ,  H01C7/12 ,  H01H37/761 ,  H01H85/463 ,  H01H2037/046 ,  H01H2037/763 ,  H05K1/0201 ,  H05K3/341

Abstract: A surge protection device includes terminals adapted to receive a power source voltage and surge protection circuits, each of which includes a thermal fuse spring, one or more metal oxide varistors (MOVs), and one or more fuse traces corresponding to the MOVs. The thermal fuse spring, one of the fuse traces and the corresponding one of the MOVs are electrically interconnected in series between the terminals, in order to form a series electrical connection therebetween. The thermal fuse spring is adapted to disconnect the series electrical connection between the terminals under first fault conditions including a first current of first duration through one of the MOVs. The thermal fuse spring and each of the fuse traces are adapted to cooperatively disconnect a corresponding one of the series electrical connections between the terminals under second fault conditions including a second greater current of second lesser duration through one of the MOVs.

公开(公告)号：US20030124318A1

公开(公告)日：2003-07-03

申请号：US10037864

申请日：2002-01-02

Inventor： Monte C. Magill ,  Bernard T. Perry

IPC: B32B027/14

CPC classification number: F28D20/02 ,  B32B3/10 ,  F28D2020/0008 ,  F28F2270/00 ,  H05K1/0201 ,  Y02E60/145 ,  Y10T428/24802

Abstract: A thermal barrier comprises a first barrier layer, a second barrier layer, and a base material positioned between the first barrier layer and the second barrier layer. The base material comprises a plurality of regions and a barrier zone separating the regions. The thermal barrier further comprises a non-encapsulated phase change material impregnating one or more of the regions. The barrier zone hinders migration of the phase change material in its liquid state within the base material, and the first barrier layer is bonded to the second barrier layer to enclose the base material. The thermal barrier may be used or incorporated in various products or applications where thermal management is desired. For example, the thermal barrier may be used in textiles, apparel, footwear, medical products, containers and packagings, buildings, appliances, and other products.

Abstract translation: 热障包括第一阻挡层，第二阻挡层和位于第一阻挡层和第二阻挡层之间的基底材料。 基材包括多个区域和隔离区域的阻挡区域。 热障还包括浸渍一个或多个区域的未包封的相变材料。 阻挡区域妨碍基体内液相状态的相变材料的迁移，第一阻挡层与第二阻挡层接合以包围基材。 热障可以被使用或并入到需要热管理的各种产品或应用中。 例如，热障可用于纺织品，服装，鞋类，医疗产品，容器和容器，建筑物，电器和其他产品中。

公开(公告)号：US20030122452A1

公开(公告)日：2003-07-03

申请号：US10137327

申请日：2002-05-03

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hyung Kon Kim

IPC: H01L041/08

CPC classification number: H05K1/141 ,  H03H3/04 ,  H03H9/08 ,  H05K1/0201 ,  H05K2201/049 ,  H05K2201/10075 ,  H05K2201/10515 ,  H05K2201/2018

Abstract: A temperature compensated crystal oscillator, which is manufactured by placing a ring-shaped board on a main board to accommodate compensating components on the main board, and placing a crystal package on the ring-shaped board, is disclosed. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of the ring-shaped board in the case of a rectangular ring-shaped board. The present invention also provides a method of manufacturing the temperature compensated crystal oscillator.

Abstract translation: 公开了一种温度补偿晶体振荡器，其通过将主板上的环形板放置在主板上的补偿部件并将晶体封装放置在环形板上而制造。 主板上的部件安装区域减少，从而减小产品尺寸。 至少一个导电垫可以附接到环形板以将晶体封装连接到主板上的某个电路。 在矩形环形板的情况下，导电垫可以设置在环形板的四个角的每一个处。 本发明还提供一种制造温度补偿晶体振荡器的方法。

公开(公告)号：US06552441B1

公开(公告)日：2003-04-22

申请号：US09321173

申请日：1999-05-27

Applicant: Helmut Gander

Inventor： Helmut Gander

IPC: B60R1600

CPC classification number: B60R16/0239 ,  F16H59/72 ,  F16H61/0003 ,  G01K7/223 ,  H05K1/0201 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/10151 ,  Y10T307/773

Abstract: A control unit has a circuit support, on which electrical and/or electronic components of an electronic circuit of the control unit are disposed. The circuit support is composed of a temperature-resistant ceramic material, and on it there is applied at least one resistive track made of a material whose electrical resistance is temperature-dependent. The resistive track is connected to an evaluation circuit that determines the temperature using resistance values measured on the resistive track. The circuit support is in thermally conductive contact with the environment that is to be taken into consideration.

Abstract translation: 控制单元具有电路支撑件，其上设置有控制单元的电子电路的电气和/或电子部件。 电路支架由耐温陶瓷材料组成，并且在其上施加至少一个由电阻为温度依赖性的材料制成的电阻轨道。 电阻轨道连接到使用在电阻轨迹上测量的电阻值来确定温度的评估电路。 电路支架与待考虑的环境导热接触。

公开(公告)号：US06539137B1

公开(公告)日：2003-03-25

申请号：US09520545

申请日：2000-03-08

Applicant: Larry L. Moresco ,  Vivek Mansingh ,  Teruo Murase

Inventor： Larry L. Moresco ,  Vivek Mansingh ,  Teruo Murase

IPC: G02B612

CPC classification number: G01J5/34 ,  H05K1/0201 ,  H05K1/0237

Abstract: A signal coupler is comprised of a transmitting section and a receiving section. The receiving section includes a polymer pyroelectric film element having a greater than 1% by volume of a high thermal diffusivity material, such as aluminum nitride, to improve the thermal diffusivity of the polymer film. A preferred embodiment of the transmitting section includes a thin film resistive heater to generate thermal pulses which are coupled to the receiving section by a thin film of thermal grease disposed between the receiving section and the transmitting section.

Abstract translation: 信号耦合器由发送部分和接收部分组成。 接收部分包括具有大于1体积％的诸如氮化铝的高热扩散性材料的聚合物热电膜元件，以改善聚合物膜的热扩散率。 传输部分的优选实施例包括薄膜电阻加热器，以产生热脉冲，其通过设置在接收部分和发射部分之间的导热油脂薄膜耦合到接收部分。

公开(公告)号：US06538878B1

公开(公告)日：2003-03-25

申请号：US09914126

申请日：2001-08-21

Applicant: Stefan Van Acker ,  Didier Leclercq

Inventor： Stefan Van Acker ,  Didier Leclercq

IPC: H02B126

CPC classification number: H05K3/3447 ,  H01L25/115 ,  H01L2924/0002 ,  H02G5/005 ,  H05K1/0201 ,  H05K3/202 ,  H05K2201/062 ,  H05K2201/0969 ,  H01L2924/00

Abstract: The present invention relates to a bus bar assembly comprising a high power transistor module directly mounted to a bus bar. The bus bar has an improved solderability characteristic and is designed so that a solid, effective soldered connection results during a conventional soldering process in which the high power transistor module is securely mounted to the bus bar to form the bus bar assembly of the present invention. Accordingly, the soldering process involves soldering a pin which is a part of the high power transistor module to a surface of the bus bar using sufficient heat. The improved solderabilty of the present bus bar results by forming a soldering island in the bus bar at predetermined points thereof. The soldering island comprises a central soldering opening, which receives the soldering pin, and a plurality of thermal barrier openings distributed around the soldering opening.

Abstract translation: 本发明涉及一种母线组件，其包括直接安装在汇流条上的高功率晶体管模块。 母线具有改进的可焊性特征，并且被设计成使得在常规焊接工艺期间产生固体，有效的焊接连接，其中高功率晶体管模块牢固地安装到母线上以形成本发明的汇流条组件。 因此，焊接过程包括使用足够的热量将作为高功率晶体管模块的一部分的引脚焊接到母线的表面。 通过在母线的预定点形成焊接岛，可以改善本母线的可焊性。 焊接岛包括容纳焊接销的中心焊接开口和分布在焊接开口周围的多个隔热开口。