公开(公告)号：US07221049B2

公开(公告)日：2007-05-22

申请号：US11139263

申请日：2005-05-27

Applicant: Yusuke Igarashi ,  Sadamichi Takakusaki ,  Hideki Mizuhara ,  Ryosuke Usui

Inventor： Yusuke Igarashi ,  Sadamichi Takakusaki ,  Hideki Mizuhara ,  Ryosuke Usui

IPC: H01I23/12

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0266 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A circuit device having a multilayered wiring structure and an excellent heat dissipation property, and a method of manufacturing the circuit device are provided. In a circuit device, a multilayered wiring structure including a first conductive pattern and a second conductive pattern is formed on a surface of a circuit substrate. A first insulating layer is formed entirely on the surface of the circuit substrate. The first conductive pattern and the second conductive pattern are mutually insulated by a second insulating layer. An amount and grain sizes of filler included in the second insulating layer are smaller than an amount and grain sizes of filler included in the first insulating layer. Therefore, it is easier to connect the above two conductive patterns by way of penetrating the second insulating layer.

Abstract translation: 具有多层布线结构和散热性优异的电路装置以及制造该电路装置的方法。 在电路装置中，在电路基板的表面上形成包括第一导电图案和第二导电图案的多层布线结构。 第一绝缘层整体形成在电路基板的表面上。 第一导电图案和第二导电图案由第二绝缘层相互绝缘。 包含在第二绝缘层中的填料的量和晶粒尺寸小于包含在第一绝缘层中的填料的量和晶粒尺寸。 因此，通过穿透第二绝缘层更容易连接上述两个导电图案。

公开(公告)号：US07155820B2

公开(公告)日：2007-01-02

申请号：US10695302

申请日：2003-10-27

Applicant: Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

Inventor： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC: H01K3/10 ,  H01R12/04

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

Abstract translation: 本发明提供一种制造印刷电路板的方法，其包括制备电介质基板，电介质基板的涂层表面，用导体填充通孔，剥离脱模膜，压缩电介质基板和形成金属箔。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。

公开(公告)号：US20060204733A1

公开(公告)日：2006-09-14

申请号：US11362516

申请日：2006-02-27

Applicant: Makoto Murai ,  Ryosuke Usui

Inventor： Makoto Murai ,  Ryosuke Usui

IPC: B32B3/00

CPC classification number: C23C28/00 ,  C23C28/322 ,  C23C28/345 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0315 ,  Y10T428/24331 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on the insulating layer, and a circuit element formed on the conductive layer, wherein an average particle diameter of the filler filled into the insulating layer is controlled so that a Young's modulus of a part of the insulating layer on a substrate side can be smaller than a Young's modulus of a part of the insulating layer on an opposite side relative to the substrate side.

公开(公告)号：US20050282002A1

公开(公告)日：2005-12-22

申请号：US10998702

申请日：2004-11-29

Applicant: Marc Husemann ,  Maren Klose

Inventor： Marc Husemann ,  Maren Klose

IPC: B32B5/16 ,  C08J5/18 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  G06K19/067 ,  G06K19/077 ,  H05K1/18 ,  H05K3/32

CPC classification number: G06K19/07745 ,  C09J5/06 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2201/61 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/323 ,  H05K2201/0266 ,  H05K2201/10727 ,  Y10T428/256 ,  Y10T428/261 ,  H01L2924/00

Abstract: Adhesive sheet, especially for adhesively bonding electrical modules in card bodies, composed at least of a layer of an adhesive system based on at least one heat-activable adhesive, characterized in that the softening temperature of the adhesive system is situated in the range from 65° C. to 165° C., electrically conductive particles are admixed with the adhesive system, the particles having on average a diameter of from 25 to 100 μm, with the proviso that the average diameter of the conductive particles is greater than the layer thickness of the adhesive system, the conductive particles have a copper or nickel core.

Abstract translation: 粘合片，特别是用于将至少一层基于至少一种可热激活粘合剂的粘合剂系统的至少组成的卡体中的电模块粘合地粘合，其特征在于粘合剂体系的软化温度位于65 导电颗粒与粘合剂体系混合，颗粒平均直径为25至100μm，条件是导电颗粒的平均直径大于层厚度 的粘合剂系统，导电颗粒具有铜或镍芯。

公开(公告)号：US20050172483A1

公开(公告)日：2005-08-11

申请号：US10509755

申请日：2004-01-21

Applicant: Yuichiro Sugita ,  Toshiaki Takenaka

Inventor： Yuichiro Sugita ,  Toshiaki Takenaka

IPC: H01B1/20 ,  H01B1/22 ,  H05K1/09 ,  H05K3/40 ,  C09J9/02

CPC classification number: H05K3/4069 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T428/2982

Abstract: It is intended to reliably form high-quality via-hole conductor with less variation, and to realize a circuit forming board having excellent connection reliability. It provides a conductive paste comprising primary particles and agglomerate of primary particles, conductive particles of 0.5 to 20 μm in average particle diameter and 0.07 to 1.7 m2/g in specific surface area, and a binder based on thermosetting resin, and also provides an inexpensive circuit forming board with high connection reliability by using the paste.

Abstract translation: 旨在可靠地形成具有较小变化的高品质通孔导体，并实现具有优异的连接可靠性的电路形成板。 它提供一种导电糊料，其包含一次粒子和一次粒子附聚物，平均粒径为0.5至20μm的导电颗粒和比表面积为0.07至1.7m 2 / g的粘合剂，以及基于 热固性树脂，并且还通过使用该膏料提供了具有高连接可靠性的廉价的电路形成板。

公开(公告)号：US06881278B2

公开(公告)日：2005-04-19

申请号：US10407422

申请日：2003-04-07

Applicant: Hitoshi Amita ,  Takashi Shoji ,  Shunsuke Nagasaki ,  Yoshinori Shibuya ,  Isamu Taguchi ,  Noriko Murase

Inventor： Hitoshi Amita ,  Takashi Shoji ,  Shunsuke Nagasaki ,  Yoshinori Shibuya ,  Isamu Taguchi ,  Noriko Murase

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  H05K3/34 ,  B23K35/363

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3618 ,  H05K2201/0266

Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.

Abstract translation: 焊料粉末包含具有使粒径为20μm以下的粒子的数量为30％以下的分布的焊料粒子，其中氧含量为500ppm以下。 用于焊膏的焊剂包括由有机酸酯和酯分解催化剂，有机卤素化合物，还原剂和树脂组分组成的有机酸组分。 焊膏主要包含焊剂和焊料粉末，其中焊膏的含水量为0.5重量％以下。

公开(公告)号：US06423154B1

公开(公告)日：2002-07-23

申请号：US08586443

申请日：1996-01-11

Applicant: Johannes A. H. Van Gerven ,  Michael T. W. De Langen

Inventor： Johannes A. H. Van Gerven ,  Michael T. W. De Langen

IPC: B23K3522

CPC classification number: B23K35/025 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/10689 ,  H05K2203/043 ,  H05K2203/0545

Abstract: A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energy lower than the critical surface energy of the metallic pad but higher than the critical surface energy of the substrate surface outside the borders of the pad, whereby application of heat causes metallic solder particles within the paste lying upon the pad to melt and fuse together into an essentially continuous metallic solder layer, whereas the metallic solder particles within any paste lying upon the substrate surface outside the borders of the pad do not thus fuse together into a layer but are instead deposited as mutually-isolated solder beads, which beads can be subsequently removed from the substrate surface after completion of the heating process.

Abstract translation: 一种焊接涂覆设置在基板上的金属焊盘的方法，由此至少焊盘的表面设置有焊膏沉积物，该焊膏包括金属焊料颗粒的悬浮液，其在熔融时具有较低的表面能 比金属垫的临界表面能高但高于衬垫边界外的衬底表面的临界表面能，由此施加热量使得位于衬垫上的膏中的金属焊料颗粒熔化并融合成基本上 连续的金属焊料层，而位于焊盘边界之外的衬底表面上的任何糊料内的金属焊料颗粒不会熔化成一层，而是沉积成相互隔离的焊料珠，该珠可以随后从 完成加热过程后的基材表面。

公开(公告)号：US20020046627A1

公开(公告)日：2002-04-25

申请号：US09951486

申请日：2001-09-14

Inventor： Hitoshi Amita ,  Takashi Shoji ,  Shunsuke Nagasaki ,  Yoshinori Shibuya ,  Isamu Taguchi ,  Noriko Murase

IPC: B22F001/00 ,  B22F001/02

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3618 ,  H05K2201/0266

Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 nullm or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.

Abstract translation: 焊料粉末包含具有使粒径为20μm以下的粒子的数量为30％以下的分布的焊料粒子，其中氧含量为500ppm以下。 用于焊膏的焊剂包括由有机酸酯和酯分解催化剂，有机卤素化合物，还原剂和树脂组分组成的有机酸组分。 焊膏主要包含焊剂和焊料粉末，其中焊膏的含水量为0.5重量％以下。

公开(公告)号：US5403376A

公开(公告)日：1995-04-04

申请号：US268878

申请日：1994-06-30

Applicant: Gerald A. DeVolk ,  Burt DeVolk

Inventor： Gerald A. DeVolk ,  Burt DeVolk

IPC: B22F1/00 ,  H05K3/10 ,  C22C1/08 ,  C22C9/00

CPC classification number: H05K3/102 ,  B22F1/0014 ,  H05K2201/0266 ,  H05K2203/101 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/128 ,  Y10S428/901

Abstract: Electrical conductors on printed circuit board substrates are made from metal particles having a particular particle size range distribution used to control the flow of molten metal when entering the liquid phase such as during fusing. The distribution can follow a bimodal curve wherein the mixture contains approximately 45% by weight of large copper particles between 44-74 microns, 45% by weight of small copper particles less than 5 microns in size with the remaining 10% by weight being particles with sizes between the smaller and larger sizes.

Abstract translation: 印刷电路板基板上的电导体由具有特定粒度范围分布的金属颗粒制成，用于在熔融时进入液相时控制熔融金属的流动。 分布可以遵循双峰曲线，其中混合物含有大约45重量％的44-74微米之间的大铜颗粒，45重量％的小尺寸小于5微米的小铜颗粒，剩余的10重量％是具有 尺寸在较小和较大尺寸之间。

公开(公告)号：US5287620A

公开(公告)日：1994-02-22

申请号：US894984

申请日：1992-06-08

Applicant: Hitoshi Suzuki ,  Wataru Yamagishi ,  Koichi Niwa ,  Kaoru Hashimoto ,  Nobuo Kamehara

Inventor： Hitoshi Suzuki ,  Wataru Yamagishi ,  Koichi Niwa ,  Kaoru Hashimoto ,  Nobuo Kamehara

IPC: H01L23/15 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC classification number: H01L21/486 ,  H01L21/4867 ,  H05K3/4061 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0266 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K3/1291 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49165

Abstract: A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

Abstract translation: 一种制造具有铜导体的多层玻璃 - 陶瓷电路板的方法，包括以下步骤：在玻璃 - 陶瓷生片中形成通孔，该通孔将形成通孔接触点; 用与陶瓷粉末混合的铜粉末的粉末混合物填充通孔，所述铜粉末和陶瓷粉末具有提供与玻璃 - 陶瓷生片相当或更大的填充密度的粉末粒度，当填充在 通孔 在具有填充有粉末混合物的通孔的生片上印刷导体膏，以在生片上形成电路导体图案; 层叠形成有导体图案的多个生片，以形成层压体; 加热层压体，从而除去粘合剂，预热层压体; 并开火初烧机构。