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公开(公告)号：US20170135215A1
公开(公告)日：2017-05-11
申请号：US15346847
申请日：2016-11-09
Inventor： Bashir I. Morshed
IPC: H05K1/18 , H05K1/11 , H05K3/40 , H05K3/46 , H05K1/03 , H05K3/12 , H05K1/09 , H05K1/02 , H05K3/30
CPC classification number: H05K1/181 , H05K1/028 , H05K1/0353 , H05K1/0393 , H05K1/097 , H05K1/113 , H05K1/118 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/125 , H05K3/303 , H05K3/4007 , H05K3/4053 , H05K3/4069 , H05K3/4664 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10143 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/0759 , H05K2203/1131
Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.
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142.发明授权公开(公告)号：US09648747B2
公开(公告)日：2017-05-09
申请号：US14704376
申请日：2015-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeong-Sik Yu
CPC classification number: H05K1/181 , G06F1/1626 , H01L23/642 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/73253 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/1436 , H01L2924/1438 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H05K1/0231 , H05K1/0262 , H05K1/115 , H05K2201/10015 , H05K2201/10734 , Y02P70/611
Abstract: A companion integrated circuit (IC) and a mobile device having the same are provided. The companion IC may include a decoupling capacitor that stably supplies voltage to an application processor, at least one auxiliary semiconductor device that communicates with the application processor, and a multi-chip package that includes the decoupling capacitor and the auxiliary semiconductor device.
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公开(公告)号：US09646769B2
公开(公告)日：2017-05-09
申请号：US14877765
申请日：2015-10-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Seok Kyoon Woo , Soon Ju Lee , So Yeon Song
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H05K1/111 , H05K1/181 , H05K3/3426 , H05K2201/0311 , H05K2201/10015 , H05K2201/10757 , H05K2201/10946 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.
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公开(公告)号：US20170127521A1
公开(公告)日：2017-05-04
申请号：US15288299
申请日：2016-10-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Su Youn YOU , Jae Yeol CHOI , Hyun Hee GU , Byoung Jin CHUN
CPC classification number: H05K1/181 , H01G2/06 , H01G2/065 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H05K1/111 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.
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公开(公告)号：US20170127520A1
公开(公告)日：2017-05-04
申请号：US15182255
申请日：2016-06-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil PARK , Jong Hwan PARK , Young Ghyu AHN
CPC classification number: H05K1/181 , H01G4/005 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/38 , H05K1/111 , H05K2201/10015 , H05K2201/1053 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer electronic component includes a first multilayer capacitor electrically connected to a first surface of a support plate formed of an insulating material; and first and second metal frames electrically connected to first and second ends of the support plate, respectively. The first and second metal frames extend in an amount greater than a thickness of the first multilayer capacitor so that a first end of the first and second metal frames constitutes a mounting part.
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Patent Agency Ranking
公开(公告)号：US20170099728A1
公开(公告)日：2017-04-06
申请号：US15295207
申请日：2016-10-17
Applicant: LEONI KABEL HOLDING GMBH
Inventor： BERND JANSSEN , CHRISTOPH UNTIEDT , HERGEN BLESSEN
CPC classification number: H05K1/0245 , H01P3/026 , H03H1/0007 , H04B3/28 , H04B3/30 , H05K1/0234 , H05K1/0246 , H05K1/025 , H05K1/0298 , H05K1/117 , H05K2201/09672 , H05K2201/10015
Abstract: A device, in particular a pre-assembled transmission cable, is used to transmit differential data signals in a high-speed data connection. The device contains a circuit board with a conductor pair with two signal conductors for transmitting the differential data signal. An output line which is insulated from the conductor pair is paired with the conductor pair, the output line running parallel to the signal conductors in a non-interrupted manner and additionally being connected to a measuring conductor via at least one damping element. By virtue of the configuration, an undesired common-mode signal component is at least partly coupled into the output line, where the signal component is absorbed during operation.
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147.发明申请公开(公告)号：US20170099727A1
公开(公告)日：2017-04-06
申请号：US15195685
申请日：2016-06-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Soo Hwan SON
IPC: H05K1/02 , H01G4/30 , H01G4/38 , H01G9/00 , H01G2/10 , H01G9/042 , H01G2/06 , H01G15/00 , H05K1/18
CPC classification number: H05K1/0231 , H01G2/065 , H01G2/10 , H01G4/12 , H01G4/30 , H01G4/38 , H01G9/0029 , H01G9/042 , H01G9/28 , H01G15/00 , H05K1/181 , H05K3/3431 , H05K2201/10015 , H05K2201/10515 , H05K2201/10522 , H05K2201/10636 , H05K2201/2045 , Y02P70/611
Abstract: A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.
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公开(公告)号：US20170093357A1
公开(公告)日：2017-03-30
申请号：US15254430
申请日：2016-09-01
Applicant: KITAGAWA INDUSTRIES CO., LTD.
Inventor： Yuya OKADA , Kazushige UENO
CPC classification number: H03H1/00 , H01F2017/065 , H02M1/126 , H02M1/44 , H02M3/156 , H03H1/0007 , H03H7/0115 , H03H2001/005 , H03H2001/0057 , H05K1/181 , H05K5/0213 , H05K5/04 , H05K9/0049 , H05K9/0066 , H05K9/0071 , H05K2201/10015
Abstract: Provided is a noise reduction device including: a conductive bar of conductive material; a metal tubular portion with a through hole having the conductive bar penetrating therethrough and accommodating a magnetic material core and a substrate therein; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar with respect to the metal housing and the tubular portion. The tubular portion includes an outer peripheral surface having a threaded engagement part threadedly engaged with the metal housing; and the conductive bar has an outer end that functions as an output terminal.
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149.发明申请公开(公告)号：US20170087355A1
公开(公告)日：2017-03-30
申请号：US15375235
申请日：2016-12-12
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC: A61N1/08 , H01R13/7195 , H01G4/40 , A61N1/375 , H03H1/00 , H03H7/01 , H05K1/18 , A61N1/37 , H05K5/00 , H01G4/35
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , A61N2001/086 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K2201/10015
Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.
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公开(公告)号：US09607768B2
公开(公告)日：2017-03-28
申请号：US14335613
申请日：2014-07-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Hwa Lee , Jin Man Jung , Jin Woo Lee , Eun Sang Na , Young Don Choi
CPC classification number: H01G4/30 , H01G2/065 , H01G4/012 , H01G4/12 , H05K1/181 , H05K1/185 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic capacitor includes first through fourth internal electrodes. The first and second internal electrodes are connected to first and second external electrodes, respectively, and disposed to face each other. The third and fourth internal electrodes are connected to the first and second external electrodes, respectively, and disposed to face each other, with a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from the connection area where the first and second internal electrodes connect with the first and second external electrodes. The first and second external electrodes include first and second conductive layers disposed in inner portions thereof, and first and second conductive resin layers disposed in outer portions thereof, respectively.
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