公开(公告)号：US20110315526A1

公开(公告)日：2011-12-29

申请号：US12973235

申请日：2010-12-20

Applicant: Christopher V. JAHNES ,  Anthony K. STAMPER

Inventor： Christopher V. JAHNES ,  Anthony K. STAMPER

IPC: H01H57/00 ,  H01G4/018 ,  G06F19/00 ,  H01H11/00

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Abstract translation: 形成微机电系统（MEMS）的方法包括在MEMS的空腔内的第一绝缘体层上形成下电极。 该方法还包括在下部电极的顶部上形成上部电极，该上部电极至少部分地与下部电极接触。 下电极和上电极的形成包括调节下电极和上电极的金属体积以改变光束弯曲。

公开(公告)号：US20110220471A1

公开(公告)日：2011-09-15

申请号：US12932992

申请日：2011-03-11

Applicant: Hubert Benzel ,  Christoph Schelling

Inventor： Hubert Benzel ,  Christoph Schelling

IPC: H01H59/00 ,  H01H11/00

CPC classification number: B81C1/00484 ,  B81B2201/014 ,  B81C2201/0143 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T29/49105

Abstract: A micromechanical component, e.g., a switch, includes a substrate having at least one recess, at least two electrically conductive contact surfaces provided in the region of the recess, and an actuator. The contact surfaces are able to be brought into contact with one another for electrical conduction with the aid of the actuator.

Abstract translation: 微机械部件例如开关包括具有至少一个凹部，设置在凹部的区域中的至少两个导电接触表面和致动器的基板。 接触表面能够在致动器的帮助下彼此接触以进行导电。

公开(公告)号：US07977137B1

公开(公告)日：2011-07-12

申请号：US12152130

申请日：2008-05-08

Applicant: John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser ,  Donald E. Strawser, legal representative

Inventor： John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser

IPC: H01L21/00

CPC classification number: H01H59/0009 ,  B81B7/0064 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2207/096 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01H2059/0045

Abstract: A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.

Abstract translation: 公开了一种用于制造特别适用于微波射频信号的电容耦合信号切换的闭锁拉链模式致动单晶片MEMS开关的方法。 用于开关的单个晶片制造工艺采用牺牲层和这些层的液体移除，以便为超脆弱的开关移动臂构件提供所需的永久物理保护。 还实现了不使用常规保持电极或磁场的实现的MEMS开关的锁定操作。 公开了单个MEMS开关的制造，但是可以实现大的或小的阵列。 公开了一种基于液体去除的制造方法。

公开(公告)号：US20110156537A1

公开(公告)日：2011-06-30

申请号：US12974121

申请日：2010-12-21

Applicant: Takamichi FUJII

Inventor： Takamichi FUJII

IPC: H01L41/04 ,  H01L41/09 ,  G01R29/22 ,  H01H57/00 ,  H01L41/22

CPC classification number: B81C1/00976 ,  B81B2201/014 ,  H01H57/00 ,  H01H2057/006 ,  H01L41/094 ,  H01L41/316 ,  Y10T29/42

Abstract: An actuator element includes: a piezoelectric body; a pair of electrodes mutually opposing to each other via the piezoelectric body; a diaphragm to which the piezoelectric body sandwiched between the pair of electrodes is bonded; and a base substrate arranged to oppose a movable part including the piezoelectric body and the diaphragm, the movable part being displaced in a direction toward the base substrate by application of a drive voltage to the pair of electrodes, wherein polarization (Pr)-electric field (E) hysteresis characteristics of the piezoelectric body are biased with respect to an electric field, and by application of a voltage in an opposite direction to the drive voltage, to the pair of electrodes, the movable part is displaced in a direction away from the base substrate.

Abstract translation: 致动器元件包括：压电体; 经由压电体彼此相对的一对电极; 夹在一对电极之间的压电体接合的隔膜; 以及基板，被配置为与包括所述压电体和所述隔膜的可动部相对，所述可动部通过对所述一对电极施加驱动电压而朝向所述基板的方向移位，其中，所述极化（Pr）电场 （E）压电体的滞后特性相对于电场偏移，并且通过向驱动电压施加相反方向的电压而偏移到一对电极，可动部分沿远离 基底。

公开(公告)号：US07928584B2

公开(公告)日：2011-04-19

申请号：US12582183

申请日：2009-10-20

Applicant: Liam O Suilleabhain ,  Raymond Goggin ,  Eva Murphy ,  Kieran P. Harney

Inventor： Liam O Suilleabhain ,  Raymond Goggin ,  Eva Murphy ,  Kieran P. Harney

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: B81B7/007 ,  B81B2201/014 ,  B81B2207/015 ,  B81B2207/017 ,  B81C1/0023 ,  B81C2203/032 ,  H01H59/0009 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.

Abstract translation: MEMS装置具有夹在基座和电路芯片之间的MEMS器件。 MEMS器件的可移动部件的一侧上靠在电路芯片上。 可移动部件可以安装在MEMS器件的基板上，或直接形成在电路芯片上的钝化层上。 电路芯片通过引线键合，通过MEMS器件的通孔或导电路径（例如MEMS器件外部的焊球）向MEMS器件提供控制信号。

公开(公告)号：US07772745B2

公开(公告)日：2010-08-10

申请号：US12040582

申请日：2008-02-29

Applicant: Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki

Inventor： Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki

IPC: H01L41/08

CPC classification number: H01L41/094 ,  B81B3/001 ,  B81B2201/014 ,  H01G5/18 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2059/0072

Abstract: It is made possible to provide a MEMS device that has a low operation voltage, a large contact pressure force, and a large separation force. A MEMS device includes: a substrate; a supporting unit that is provided on the substrate; a fixed electrode that is provided on the substrate; an actuator that includes a first electrode, a first piezoelectric film formed on the first electrode, and a second electrode formed on the first piezoelectric film, one end of the actuator being fixed onto the substrate with the supporting unit, the actuator extending in a direction connecting the supporting unit and the fixed electrode, the first electrode being located to face the fixed electrode; and a stopper unit that is located above a straight line connecting the supporting unit and the fixed electrode, and is located on the substrate so as to face the first electrode.

Abstract translation: 可以提供具有低操作电压，大的接触压力和大的分离力的MEMS器件。 MEMS器件包括：衬底; 设置在基板上的支撑单元; 设置在基板上的固定电极; 致动器，其包括第一电极，形成在第一电极上的第一压电膜和形成在第一压电膜上的第二电极，致动器的一端通过支撑单元固定到基板上，致动器沿着方向 连接所述支撑单元和所述固定电极，所述第一电极位于与所述固定电极相对的位置; 以及位于连接支撑单元和固定电极的直线上方并且位于基板上以与第一电极相对的止动单元。

公开(公告)号：US07760065B2

公开(公告)日：2010-07-20

申请号：US11772039

申请日：2007-06-29

Applicant: Arman Gasparyan ,  John VanAtta Gates, II ,  Maria Elina Simon

Inventor： Arman Gasparyan ,  John VanAtta Gates, II ,  Maria Elina Simon

IPC: H01H71/18 ,  H01H61/00

CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H37/00 ,  H01H2001/0047 ,  H01H2037/008 ,  H01H2061/006 ,  H01H2061/008

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract translation: 本发明提供一种双向微电子机械元件，包括双向元件的微机电开关，以及减少双向元件中机械蠕变的方法。 在一个实施例中，双向微机电元件包括​​具有自由端的冷梁和连接到冷束锚的第一端。 冷梁锚附接到基板。 第一束对通过自由端系绳连接到冷束，并且被构造成在被加热时延伸到比冷束的温度更大的温度。 第二光束对位于与第一光束对的冷光束的相对侧上，并且通过自由端系绳耦合到第一光束对和冷光束。 第二束对被配置成在被加热时延长到更高的温度。

公开(公告)号：US20100032268A1

公开(公告)日：2010-02-11

申请号：US12582183

申请日：2009-10-20

Applicant: Liam O. Suilleabhain ,  Raymond Goggin ,  Eva Murphy ,  Kieran P. Harney

Inventor： Liam O. Suilleabhain ,  Raymond Goggin ,  Eva Murphy ,  Kieran P. Harney

IPC: H01H57/00 ,  H01L29/84

CPC classification number: B81B7/007 ,  B81B2201/014 ,  B81B2207/015 ,  B81B2207/017 ,  B81C1/0023 ,  B81C2203/032 ,  H01H59/0009 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.

Abstract translation: MEMS装置具有夹在基座和电路芯片之间的MEMS器件。 MEMS器件的可移动部件的一侧上靠在电路芯片上。 可移动部件可以安装在MEMS器件的基板上，或直接形成在电路芯片上的钝化层上。 电路芯片通过引线键合，通过MEMS器件的通孔或导电路径（例如MEMS器件外部的焊球）向MEMS器件提供控制信号。

公开(公告)号：US07658831B2

公开(公告)日：2010-02-09

申请号：US11306291

申请日：2005-12-21

Applicant: Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

Inventor： Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

IPC: C25D5/02

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。

公开(公告)号：US20080238257A1

公开(公告)日：2008-10-02

申请号：US12040582

申请日：2008-02-29

Applicant: Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki

Inventor： Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki

IPC: H01L41/083 ,  H01L41/047 ,  H01L41/053

CPC classification number: H01L41/094 ,  B81B3/001 ,  B81B2201/014 ,  H01G5/18 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2059/0072

Abstract: It is made possible to provide a MEMS device that has a low operation voltage, a large contact pressure force, and a large separation force. A MEMS device includes: a substrate; a supporting unit that is provided on the substrate; a fixed electrode that is provided on the substrate; an actuator that includes a first electrode, a first piezoelectric film formed on the first electrode, and a second electrode formed on the first piezoelectric film, one end of the actuator being fixed onto the substrate with the supporting unit, the actuator extending in a direction connecting the supporting unit and the fixed electrode, the first electrode being located to face the fixed electrode; and a stopper unit that is located above a straight line connecting the supporting unit and the fixed electrode, and is located on the substrate so as to face the first electrode.

Abstract translation: 可以提供具有低操作电压，大的接触压力和大的分离力的MEMS器件。 MEMS器件包括：衬底; 设置在基板上的支撑单元; 设置在基板上的固定电极; 致动器，其包括第一电极，形成在第一电极上的第一压电膜和形成在第一压电膜上的第二电极，致动器的一端通过支撑单元固定到基板上，致动器沿着方向 连接所述支撑单元和所述固定电极，所述第一电极位于与所述固定电极相对的位置; 以及位于连接支撑单元和固定电极的直线上方并且位于基板上以与第一电极相对的止动单元。