公开(公告)号：US20130256896A1

公开(公告)日：2013-10-03

申请号：US13438370

申请日：2012-04-03

Applicant: Xiaojie Xue

Inventor： Xiaojie Xue

IPC: H01L23/48 ,  H01L21/50

CPC classification number: B81B7/0077 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00325 ,  B81C1/00333 ,  B81C1/00873 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/041 ,  H01L23/49805 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/81

Abstract: Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto the device regions. A capping substrate having recesses is mounted over the device substrate, enclosing the device regions within cavities defined by the recesses. A plurality of aligned through-wafer contacts extend through the capping substrate and the device substrate. The device substrate and capping substrate can be singulated by cutting through the aligned through-wafer contacts, with the severed through-wafer contacts forming vertical mount leads. A vertical mount package includes a device sealed between a device substrate and a capping substrate. At least of the side edges of the package includes exposed conductive elements for vertical mount leads.

Abstract translation: 公开了垂直安装封装及其制造方法。 一种用于制造垂直安装封装的方法包括：在前表面上提供具有多个器件区域的器件基板，以及多个贯通晶片通孔。 MEMS器件或集成电路形成或安装到器件区域上。 具有凹槽的封盖基板安装在器件基板上，将器件区域包围在由凹槽限定的空腔内。 多个对准的跨晶片触点延伸穿过封盖衬底和器件衬底。 可以通过切割对准的通过晶片的触点来切割器件衬底和封盖衬底，切断的晶片接触件形成垂直安装引线。 垂直安装封装包括密封在器件基板和封盖基板之间的器件。 封装的至少侧边缘包括用于垂直安装引线的露出的导电元件。

公开(公告)号：US20130255381A1

公开(公告)日：2013-10-03

申请号：US13854782

申请日：2013-04-01

Applicant: STMICROELECTRONICS S.R.I.

Inventor： Giulio Ricotti ,  Alberto Pagani ,  Fulvio Vittorio Fontana ,  Ubaldo Mastromatteo

IPC: G01P15/105

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

Abstract translation: 惯性传感器，其具有带有激励线圈的主体和沿着第一轴线延伸的第一感测线圈。 悬挂质量体包括磁场集中器，位于对应于激励线圈的位置，并且构造成用于沿沿着第一轴线的平面中的惯性移位。 供电和感测电路电耦合到激励线圈和第一感测线圈，并且被配置为产生在励磁线圈中流动的时间流的电流，以便产生与磁场相互作用的磁场 感应线圈中的电压/电流。 集成电路被配置为测量在第一感测线圈中感应的电压/电流的值，以便检测与悬挂质量沿着第一轴的位移相关联的量。

公开(公告)号：US08530982B2

公开(公告)日：2013-09-10

申请号：US12924160

申请日：2010-09-21

Applicant: Johannes Classen ,  Christian Bierhoff

Inventor： Johannes Classen ,  Christian Bierhoff

IPC: H01L29/84

CPC classification number: G01C19/5783 ,  B81B2201/025 ,  B81C1/00166

Abstract: A micromechanical structure which includes a substrate having a main plane of extension, and a seismic mass which is movable relative to the substrate. The micromechanical structure includes a fixed electrode which is connected to the substrate, and a counterelectrode which is connected to the seismic mass. The fixed electrode has a first fixed electrode region and a second fixed electrode region which is connected in an electrically conductive manner to the first fixed electrode region. The counterelectrode is partially situated between the first and the second fixed electrode region, perpendicular to the main plane of extension.

Abstract translation: 一种微机械结构，其包括具有主平面延伸的基板和相对于基板可移动的地震质量。 微机械结构包括连接到基板的固定电极和连接到地震块的反电极。 固定电极具有第一固定电极区域和与导电方式连接到第一固定电极区域的第二固定电极区域。 反电极部分地位于第一和第二固定电极区域之间，垂直于主延伸平面。

公开(公告)号：US08513747B1

公开(公告)日：2013-08-20

申请号：US13711070

申请日：2012-12-11

Applicant: InvenSense, Inc.

Inventor： Kegang Huang ,  Martin Lim ,  Steven S. Nasiri

IPC: H01L29/84

CPC classification number: B81B3/0051 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0271 ,  B81C1/00293 ,  H01L29/0657

Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

Abstract translation: 集成MEMS器件包括晶片，其中晶片包含两个或更多个不同深度的空腔。 MEMS器件包括在第一深度的第一腔内的一个可移动结构和在第二深度的第二腔内的第二可移动结构。 空腔被密封以保持不同的可移动结构的不同压力以实现最佳操作。 可以在相同的多腔深度处理流程中形成MEMS止动件。 MEMS器件可以与CMOS晶片集成。

公开(公告)号：US20130152688A1

公开(公告)日：2013-06-20

申请号：US13688099

申请日：2012-11-28

Applicant: Chih-Ming Sun ,  Ming-Han Tsai

Inventor： Chih-Ming Sun ,  Ming-Han Tsai

IPC: G01P15/09 ,  B81C1/00 ,  G01P15/00

CPC classification number: G01P15/0802 ,  B81B2201/025 ,  B81C1/0015 ,  G01P15/00 ,  G01P15/09 ,  G01P15/0922 ,  G01P15/125 ,  G01P2015/0837

Abstract: A micro-electro-mechanical sensing device including a substrate, a semiconductor layer, a supporting pillar, a first suspended arm, a connecting member, a second suspended arm, and a proof mass is provided. The semiconductor layer is disposed on or above the substrate. The supporting pillar is disposed on or above the semiconductor layer. The first suspended arm is disposed on the supporting pillar. The supporting connects a portion of the first suspended arm. The connecting member directly or indirectly connects another portion of the first suspended arm. The second suspended arm has a first surface and a second surface opposite to the first surface. The connecting member connects a portion of the first surface. The proof mass connects the second suspended arm and it includes a portion of the second suspended arm as a portion of the proof mass. A method for manufacturing the device is also provided.

Abstract translation: 提供了一种包括衬底，半导体层，支撑柱，第一悬臂，连接构件，第二悬臂和校验块的微机电感测装置。 半导体层设置在基板上或上方。 支撑柱设置在半导体层上或上方。 第一悬挂臂设置在支撑柱上。 支撑件连接第一悬臂的一部分。 连接构件直接或间接连接第一悬臂的另一部分。 第二悬臂具有与第一表面相对的第一表面和第二表面。 连接构件连接第一表面的一部分。 检验质量块连接第二悬臂，并且其包括第二悬臂的一部分作为证明块的一部分。 还提供了一种用于制造该装置的方法。

公开(公告)号：US20130104654A1

公开(公告)日：2013-05-02

申请号：US13658949

申请日：2012-10-24

Applicant: Robert Bosch GmbH

Inventor： Johannes CLASSEN ,  Arnd KAELBERER ,  Lars TEBJE

IPC: G01P15/08 ,  H05K3/00

CPC classification number: G01P15/125 ,  B81B3/0072 ,  B81B2201/025 ,  G01P15/18 ,  G01P2015/0805 ,  Y10T29/49155

Abstract: A micromechanical component includes: a substrate; a seismic weight joined to the substrate at a first suspension mount; at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount. The first electrode is mechanically connected to the second suspension mount with the aid of a support arm and set apart from the second suspension mount.

Abstract translation: 微机械部件包括：基板; 在第一悬挂安装座处接合到所述基板的地震重量; 至少一个第一电极，用于测量所述地震重量在第一方向上的运动，所述第一电极在第二悬架安装件处连接到所述基板; 以及至少一个第二电极，用于测量在与所述第一方向不同的第二方向上的所述地震重量的运动，所述第二电极在第三悬架安装件处连接到所述基板。 借助于支撑臂​​将第一电极机械地连接到第二悬架安装座，并与第二悬架安装件分离。

公开(公告)号：US08387854B2

公开(公告)日：2013-03-05

申请号：US13402210

申请日：2012-02-22

Applicant: Noureddine Hawat

Inventor： Noureddine Hawat

IPC: B23K31/02

CPC classification number: B23K1/0008 ,  B81B7/02 ,  B81B2201/025 ,  B81B2207/012 ,  B81C3/005 ,  B81C2203/057 ,  B81C2203/0792

Abstract: This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically.

Abstract translation: 本发明使用表面张力来对准安装在定向在xy平面中的衬底或引线框架上的z轴MEMS感测装置。 根据本发明的教导，z轴感测装置的高度小于或基本上等于其宽度（y-尺寸），而器件在纵向（x维）上的长度大于 任何一个y或z维。 结果，代替像墙一样薄而高的形状，这种配置是非常难以垂​​直对准的，细长的z轴感测装置安装在短的z轴上，使得它更容易垂直对准。

公开(公告)号：US20130042681A1

公开(公告)日：2013-02-21

申请号：US13586226

申请日：2012-08-15

Applicant: Johannes Classen ,  Jochen Reinmuth ,  Sebastian Guenther ,  Pia Bustian-Todorov

Inventor： Johannes Classen ,  Jochen Reinmuth ,  Sebastian Guenther ,  Pia Bustian-Todorov

IPC: H05K13/00 ,  G01P3/44

CPC classification number: G01C19/5783 ,  B81B2201/025 ,  B81C1/00182 ,  G01P15/0802 ,  G01P2015/0882

Abstract: A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.

Abstract translation: 微机械结构的制造方法和微机械结构。 微机械结构包括由第一材料制成的第一微机械功能层，其包括具有第一端和第二端的埋管; 微机械传感器结构，其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

公开(公告)号：US20130020693A1

公开(公告)日：2013-01-24

申请号：US13548663

申请日：2012-07-13

Applicant: Ho-Yin Yiu ,  Chien-Hung Liu ,  Tsang-Yu Liu ,  Ying-Nan Wen ,  Yen-Shih Ho

Inventor： Ho-Yin Yiu ,  Chien-Hung Liu ,  Tsang-Yu Liu ,  Ying-Nan Wen ,  Yen-Shih Ho

IPC: H01L29/02 ,  H01L21/50 ,  H01L21/02

CPC classification number: B81B3/0051 ,  B81B2201/025 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost.

Abstract translation: 公开了一种用于形成芯片封装结构的芯片封装结构和方法。 至少一个块形成在盖的表面上，盖安装在其上形成有感测装置的基板上，用于覆盖感测装置，并且该块设置在盖和感测装置之间。 在本发明中，该块安装在盖上，不需要蚀刻盖以形成突出部分，因此本发明的方法简单且成本低。

公开(公告)号：US20120267825A1

公开(公告)日：2012-10-25

申请号：US13184564

申请日：2011-07-17

Applicant: Sung Jun LEE ,  Won Kyu JEUNG

Inventor： Sung Jun LEE ,  Won Kyu JEUNG

IPC: B29C70/00

CPC classification number: G01C19/56 ,  B81B2201/025 ,  B81C1/00182 ,  B81C2201/0108 ,  B81C2201/0187 ,  G01P15/0802 ,  G01P15/09

Abstract: The method of manufacturing an inertial sensor includes: (A) disposing a first mold 120 and a second mold 125 on both surfaces of a predetermined region R in a plate-shaped membrane 110, (B) forming a mass body 130, a post 140, and an upper cap 150 through a plating process or a filling process, (C) disposing a third mold 160 on an exposed surface of the first mold 120 and the mass body 130, and (D) forming a lower cap 170 through the plating process or the filling process. Since the mass body 130 is made of metal by a plating process or a filling process, the density of the mass body 130 may be increased and the mass body 130 may be formed to have a structure of a high aspect ratio, thereby improving the sensitivity of the inertial sensor 100.

Abstract translation: 惯性传感器的制造方法包括：（A）在板状膜110中的规定区域R的两面上设置第一模具120和第二模具125，（B）形成质量体130，柱140 ，以及通过电镀处理或填充处理的上盖150，（C）在第一模具120和质量体130的暴露表面上设置第三模具160，以及（D）通过电镀形成下盖170 过程或填充过程。 由于质量体130通过电镀处理或填充处理由金属制成，因此可以增加质量体130的密度，并且可以将质量体130形成为具有高纵横比的结构，从而提高灵敏度 的惯性传感器100。