公开(公告)号：US06369931B1

公开(公告)日：2002-04-09

申请号：US09367760

申请日：1999-08-18

Applicant: Karsten Funk ,  Wilhelm Frey

Inventor： Karsten Funk ,  Wilhelm Frey

IPC: G02B1700

CPC classification number: B81B3/004 ,  B81B2201/0292 ,  B81B2201/042 ,  B81C1/00142 ,  B81C2201/019 ,  G02B26/0841

Abstract: A method for manufacturing a micromechanical device, in particular a micromechanical vibrating-mirror device, having the following steps: making available a three-layer structure having a first layer, a second layer and a third layer, the second layer lying between the first and the third layers; etching through the first layer up to the second layer to produce an island region, lying on the second layer, which is joined to region of the first layer surrounding the island region by way of one or more connecting webs, and etching through a region of the third layer up to the second layer and removing a region of the second layer below the island region in such a way that the island region can perform movements, preferably torsional vibrations, about the one or more connecting webs, the torsional vibrations having such an amplitude that a part of the island region extends into the etched-through region of the third layer.

Abstract translation: 一种用于制造微机械装置，特别是微机械振镜装置的方法，具有以下步骤：提供具有第一层，第二层和第三层的三层结构，所述第二层位于第一层和第二层之间， 第三层; 蚀刻通过第一层直到第二层，以产生位于第二层上的岛状区域，其通过一个或多个连接幅材连接到围绕岛状区域的第一层的区域，并且蚀刻通过 第三层直到第二层，并且以这样的方式去除岛状区域下面的第二层的区域，使得岛状区域可以围绕一个或多个连接幅材执行运动，优选扭转振动，扭转振动具有这样的 该区域的一部分延伸到第三层的蚀刻穿透区域的振幅。

公开(公告)号：US5683594A

公开(公告)日：1997-11-04

申请号：US217044

申请日：1994-03-24

Applicant: G. Benjamin Hocker ,  David W. Burns ,  Akintunde I. Akinwande ,  Robert D. Horning ,  Amir R. Mirza ,  Thomas G. Stratton ,  Deidrich J. Saathoff ,  James K. Carney ,  Scott A. McPherson

Inventor： G. Benjamin Hocker ,  David W. Burns ,  Akintunde I. Akinwande ,  Robert D. Horning ,  Amir R. Mirza ,  Thomas G. Stratton ,  Deidrich J. Saathoff ,  James K. Carney ,  Scott A. McPherson

IPC: G01L9/04 ,  B81C1/00 ,  G01L9/00 ,  G01L9/12 ,  H01L21/02 ,  H01L21/20 ,  H01L21/306 ,  H01L29/84 ,  B32B31/00

CPC classification number: B81C1/00182 ,  G01L9/0042 ,  G01L9/0073 ,  H01L21/2007 ,  B81B2201/0292 ,  B81B2203/0127

Abstract: This patent relates to the fabrication of diaphragm-based microstructures used primarily for sensing physical phenomena by detecting a change in deflection, resonance, or curvature of the diaphragm. The methods of fabrication described and claimed herein relate primarily to diaphragm-based diaphragms made of silicon, either single crystal or polycrystalline in form, although other materials may be used.

Abstract translation: 该专利涉及通过检测隔膜的偏转，共振或曲率的变化来主要用于感测物理现象的基于隔膜的微结构的制造。 本文所述和要求保护的制造方法主要涉及由硅制成的隔膜式隔膜，其形式为单晶或多晶，尽管可以使用其他材料。

公开(公告)号：US12054386B2

公开(公告)日：2024-08-06

申请号：US17175410

申请日：2021-02-12

Applicant: STMicroelectronics S.r.l.

Inventor： Enrico Rosario Alessi ,  Fabio Passaniti

IPC: B81B7/00 ,  B81B7/02 ,  G06N3/08

CPC classification number: B81B7/007 ,  B81B7/02 ,  G06N3/08 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292

Abstract: An analysis method of a device through a MEMS sensor is provided in which the MEMS sensor includes a control unit and a sensing assembly coupled to the device. The analysis method includes acquiring, through the sensing assembly, first data indicative of an operative state of the device. Testing is performed for the presence of a first abnormal operating condition of the device. If the first abnormal operating condition of the device is confirmed, a self-test of the sensing assembly is performed to generate a quantity indicative of an operative state of the sensing assembly. The self-test includes acquiring, through the sensing assembly, second data indicative of the operative state of the sensing assembly, generating a signature according to the second data, and processing the signature through deep learning techniques to generate said quantity.

公开(公告)号：US11894473B2

公开(公告)日：2024-02-06

申请号：US17363305

申请日：2021-09-09

Applicant: CHIP POSITION SYSTEM CO., LTD.

Inventor： Ruei Chi Chen ,  Chih Lin Yang

IPC: H01L31/0232 ,  B81C1/00 ,  B81B7/00

CPC classification number: H01L31/02322 ,  B81B7/0077 ,  B81C1/00269 ,  H01L31/02325 ,  B81B2201/0285 ,  B81B2201/0292 ,  B81C2203/0109 ,  B81C2203/032

Abstract: The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.

公开(公告)号：US11887906B2

公开(公告)日：2024-01-30

申请号：US17524562

申请日：2021-11-11

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan K. Koduri

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: H01L23/3114 ,  B81B3/0083 ,  B81B7/0006 ,  B81B7/0067 ,  B81B7/0093 ,  B81C1/00095 ,  B81C1/00182 ,  B81C1/00317 ,  H01L23/481 ,  H01L24/09 ,  B81B2201/0264 ,  B81B2201/0292

Abstract: A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

公开(公告)号：US11851319B2

公开(公告)日：2023-12-26

申请号：US16560518

申请日：2019-09-04

Applicant: STMicroelectronics S.r.l.

Inventor： Anna Angela Pomarico ,  Giuditta Roselli ,  Daniele Caltabiano ,  Roberto Brioschi ,  Mohammad Abbasi Gavarti

IPC: B81B3/00 ,  B60T1/06 ,  B60T8/17 ,  B60T8/171 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06

CPC classification number: B81B3/0072 ,  B60T1/065 ,  B60T8/17 ,  B60T8/171 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/0315

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

公开(公告)号：US20230314193A1

公开(公告)日：2023-10-05

申请号：US17855019

申请日：2022-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Vijay Parkhe

IPC: G01F1/56 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01F1/56 ,  B81B7/0061 ,  B81C1/00309 ,  B81B2201/0292 ,  B81B2203/04

Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a substrate having an outer region, an inner region, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the middle region or the outer region to provide a hermetic seal. The sensor assembly further includes a sensor die bonded to the substrate at the inner region. A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum, and/or one or more metals selected from tin, indium, copper, aluminum, and/or nickel.

公开(公告)号：US20230235664A1

公开(公告)日：2023-07-27

申请号：US17582816

申请日：2022-01-24

Applicant: Schlumberger Technology Corporation

Inventor： Remi Robutel ,  Cleverson Souza Chaves ,  Mohamed Salim Cherchali ,  Claire Tassin ,  Nicolas Renoux

IPC: E21B47/07 ,  B81B7/00 ,  E21B47/12 ,  E21B47/01

CPC classification number: E21B47/07 ,  B81B7/0074 ,  E21B47/01 ,  E21B47/12 ,  B81B2201/025 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/07 ,  B81B2207/091

Abstract: A downhole sensor system includes a first sensor package having a substrate, an integrated circuit chip mounted to the substrate, the integrated circuit chip including a processor, a transducer chip mounted to the integrated circuit chip, and a plurality of sensors configured to measure at least shock, pressure, temperature, and humidity. At least one of the plurality of sensors is mounted to the transducer chip such that a stack is formed at least from the substrate, the integrated circuit, the transducer chip, and the sensor. The plurality of sensors are in communication with the processor.

公开(公告)号：US20190195668A1

公开(公告)日：2019-06-27

申请号：US16247543

申请日：2019-01-14

Applicant: INVENSENSE, INC.

Inventor： Andy Milota ,  James Lim ,  William Kerry Keal

IPC: G01D18/00 ,  H03L7/00 ,  H03L1/00 ,  B81B7/02

CPC classification number: G01D18/008 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81B2207/09 ,  H03L1/00 ,  H03L7/00

Abstract: Various aspects of this disclosure comprise systems and methods for synchronizing sensor data acquisition and/or output. For example, various aspects of this disclosure provide for achieving a desired level of timing accuracy in a MEMS sensor system, even in an implementation in which timer drift is substantial.

公开(公告)号：US20190028815A1

公开(公告)日：2019-01-24

申请号：US16137439

申请日：2018-09-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: H04R19/04 ,  H04R7/06 ,  H04R31/00 ,  H04R19/00 ,  H04R3/00 ,  B81C1/00 ,  B06B1/02 ,  H04R1/44 ,  B81B7/04

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.