公开(公告)号：US20170216914A1

公开(公告)日：2017-08-03

申请号：US15104745

申请日：2015-03-03

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Shigekatsu Ohnishi

IPC: B22F1/02 ,  B22F9/08 ,  B22F9/16 ,  C22F1/08 ,  C23C8/20 ,  C23C16/26 ,  C23C16/44 ,  C23C16/56 ,  C09K5/14 ,  C09D5/24 ,  C09D5/26 ,  C09C1/62 ,  C09C1/66 ,  C09D161/06 ,  B22F1/00

CPC classification number: B22F1/02 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0059 ,  B22F1/0085 ,  B22F1/025 ,  B22F9/082 ,  B22F9/16 ,  B22F2201/10 ,  B22F2201/30 ,  B22F2301/10 ,  B22F2302/10 ,  B22F2302/25 ,  B22F2302/45 ,  B22F2304/054 ,  B22F2304/10 ,  B22F2998/10 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/011 ,  C09C1/627 ,  C09C1/66 ,  C09D5/24 ,  C09D5/26 ,  C09D161/06 ,  C09K5/14 ,  C22F1/08 ,  C23C8/20 ,  C23C16/26 ,  C23C16/4417 ,  C23C16/56

Abstract: There is provided conductive paste excellent in electro-conductivity and thermal conductivity. Conductive paste comprising conductive filler being composite particles including copper powder and nanosize precipitates which are disposed on the surface of the copper powder and composed of at least one kind of transition metal belonging to the group 8 to group 10 of the periodic table or a compound of the transition metal, and a binder resin.

公开(公告)号：US09701862B2

公开(公告)日：2017-07-11

申请号：US14404184

申请日：2013-05-31

Applicant: LG CHEM, LTD.

Inventor： Joon Koo Kang ,  Yeong Rae Chang ,  Sung Don Hong ,  Soon Hwa Jung ,  Eun Kyu Her

IPC: C09D4/00 ,  C08K3/36 ,  B05D3/06 ,  C09D135/02 ,  C09D133/04 ,  G02B1/10 ,  C08K5/3475 ,  C09D7/12 ,  C09D105/16 ,  C09D133/14 ,  C09D167/00 ,  C08J7/04 ,  C08J5/18 ,  C08K3/22

CPC classification number: C09D135/02 ,  B05D3/067 ,  C08J5/18 ,  C08J7/04 ,  C08J7/042 ,  C08J7/047 ,  C08J2301/12 ,  C08J2367/02 ,  C08J2433/14 ,  C08J2435/02 ,  C08K3/36 ,  C08K5/3475 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2296 ,  C08K2201/005 ,  C08K2201/011 ,  C09D4/00 ,  C09D7/48 ,  C09D7/61 ,  C09D105/16 ,  C09D133/04 ,  C09D133/14 ,  C09D167/00 ,  G02B1/10 ,  G02B1/105 ,  G02B1/14 ,  Y10T428/2495 ,  Y10T428/259 ,  Y10T428/269 ,  Y10T428/31507 ,  Y10T428/31797 ,  Y10T428/31884 ,  Y10T428/31928 ,  C08F222/1006 ,  C08F220/20

Abstract: A method of preparing a hard coating film by applying a hard coating composition onto both sides of a supporting substrate, thereby forming a hard coating layer on each side of the supporting substrate, the hard coating composition comprising a binder including a tri- to hexa-functional acrylate-based monomer, inorganic particles and a photoinitiator; and irradiating the applied hard coating layers with ultraviolet to simultaneously photocure the hard coating layers, wherein the hard coating film has a pencil hardness of 7H or more under a load of 1 kg, and properties such that when the hard coating film is exposed to a temperature of 50 to 90° C. and a humidity of 80 to 90% for 70 to 100 hours and then placed on a plane, the maximum distance at which each edge of the hard coating film is spaced apart from the plane is 1.0 mm or less.

公开(公告)号：US20170183426A1

公开(公告)日：2017-06-29

申请号：US15325317

申请日：2015-07-10

Applicant: KURARAY CO., LTD.

Inventor： Hiroshi KAWAI ,  Yasuhiro NONAKA ,  Syunsuke FUJIOKA ,  Hatsuyo MIYAKE

IPC: C08F8/12 ,  C23C14/24 ,  B32B27/08 ,  B32B27/30 ,  B65D1/40 ,  C08J5/18 ,  C08K3/36 ,  C08L23/06 ,  B65D65/38 ,  C23C14/20 ,  C08K5/098

CPC classification number: C08F8/12 ,  B29B9/06 ,  B29B9/12 ,  B29C49/0005 ,  B29C49/22 ,  B29C51/002 ,  B29C51/14 ,  B29K2023/083 ,  B29K2105/253 ,  B32B7/12 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/20 ,  B32B27/28 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/31 ,  B32B2307/518 ,  B32B2307/538 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/7242 ,  B32B2307/7244 ,  B32B2307/738 ,  B32B2307/746 ,  B32B2307/748 ,  B32B2439/40 ,  B32B2439/46 ,  B32B2439/70 ,  B32B2439/80 ,  B65D1/40 ,  B65D65/38 ,  C08F216/06 ,  C08J5/18 ,  C08J2323/08 ,  C08K3/36 ,  C08K5/098 ,  C08K2201/005 ,  C08L23/06 ,  C08L23/0861 ,  C08L29/04 ,  C08L2205/02 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2207/066 ,  C23C14/20 ,  C23C14/24 ,  C08F210/02 ,  C08K13/02 ,  C08L77/02 ,  C08L51/06

Abstract: Provided are an ethylene-vinyl alcohol copolymer, a resin composition and a molded product thereof being superior in long-run stability of melt molding, with inhibited coloring and generation of film forming defects such as flaws in formed film and streaks, and also being superior in appearance characteristics. An ethylene-vinyl alcohol copolymer (A) obtained by saponifying a copolymer of ethylene and a vinyl ester, in which molecular weights determined by using gel permeation chromatography with a differential refractive index detector and an ultraviolet and visible absorbance detector after a heat treatment in a nitrogen atmosphere at 220° C. for 50 hrs satisfy the inequality (1): (Ma−Mb)/Ma

公开(公告)号：US20170174914A1

公开(公告)日：2017-06-22

申请号：US15450246

申请日：2017-03-06

Applicant: FUJIFILM CORPORATION

Inventor： Tokihiko MATSUMURA ,  Yasuaki MATSUSHITA

IPC: C09D11/03 ,  C09D11/037 ,  H01L27/28 ,  H01L51/00 ,  H01B1/22 ,  H05K1/09 ,  C09D11/52 ,  H01L51/10

CPC classification number: C09D11/03 ,  C08K3/28 ,  C08K5/13 ,  C08K2201/005 ,  C09D1/00 ,  C09D5/24 ,  C09D7/40 ,  C09D7/63 ,  C09D11/037 ,  C09D11/30 ,  C09D11/52 ,  H01B1/22 ,  H01L21/28 ,  H01L21/288 ,  H01L27/283 ,  H01L29/786 ,  H01L51/0021 ,  H01L51/004 ,  H01L51/005 ,  H01L51/0073 ,  H01L51/0545 ,  H01L51/102 ,  H05K1/09 ,  H05K1/097

Abstract: The present invention provides a conductive film forming composition which makes it possible to prepare an organic thin film transistor having excellent insulation reliability while inhibiting the deterioration of mobility and has excellent coating properties and provides a conductive film and an organic thin film transistor which are prepared using the composition. The present invention also provides electronic paper and a display device which contain the organic thin film transistor and wiring board which has wiring formed using the conductive film forming composition. The conductive film forming composition according to the present invention contains water, conductive particles, and a migration inhibitor containing a compound having a group represented by Formula (1). In Formula (1), W1 represents any one of a hydrogen atom, Formula (A), Formula (B), and Formula (C). In Formula (1), R1, R2, R3, and R4 each independently represent any one of a hydrogen atom, a substituent, and W2. W2 represents Formula (D), Formula (E), or Formula (F). Here, in a case where W1 is a hydrogen atom, at least one of R1, R2, R3, or R4 is W2. In Formula (1), * represents a binding position.

公开(公告)号：US09683119B2

公开(公告)日：2017-06-20

申请号：US14754939

申请日：2015-06-30

Applicant: CORNING INCORPORATED

Inventor： Tzu-Han Chen ,  Ruei-ming Huang ,  Yongsheng Yan

IPC: C09D11/00 ,  C09D11/102 ,  C09D11/324 ,  G06F1/16 ,  C09D11/36 ,  H05K3/12 ,  H05K1/09

CPC classification number: C09D11/324 ,  C08K3/04 ,  C08K5/06 ,  C08K2201/005 ,  C08K2201/011 ,  C09D7/68 ,  C09D11/102 ,  C09D11/36 ,  G06F1/16 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0323 ,  H05K2203/013

Abstract: A jet ink composition, a jet ink coating method and a resulting jet ink coated article are all predicated upon the jet ink composition which includes in addition to a particulate pigment material and a solvent composition a resin composition. The resin composition includes an uncured silicone resin, an uncured epoxy resin and an uncured melamine resin. Upon thermal cure the uncured resin composition forms a cured resin composition with superior adhesion to substrates such as but not limited to glass substrates, ceramic substrates and metal oxide substrates.

公开(公告)号：US09666342B2

公开(公告)日：2017-05-30

申请号：US15160233

申请日：2016-05-20

Applicant: Thomas Weller ,  Jing Wang ,  Hariharan Srikanth ,  Cesar A. Morales-Silva ,  Kristen L. S. Repa ,  Susmita Pal

Inventor： Thomas Weller ,  Jing Wang ,  Hariharan Srikanth ,  Cesar A. Morales-Silva ,  Kristen L. S. Repa ,  Susmita Pal

IPC: H01F37/00 ,  H01F1/37 ,  H01F1/34 ,  C08K9/04 ,  H01F1/00 ,  H01F1/01 ,  H01B3/00 ,  H01F41/00 ,  H01B3/44

CPC classification number: H01F1/0045 ,  C08J5/18 ,  C08J2300/00 ,  C08J2309/00 ,  C08K3/22 ,  C08K9/04 ,  C08K9/10 ,  C08K2003/2275 ,  C08K2003/2289 ,  C08K2201/005 ,  C08K2201/01 ,  C08K2201/011 ,  H01B3/006 ,  H01B3/441 ,  H01F1/0018 ,  H01F1/0063 ,  H01F1/01 ,  H01F1/344 ,  H01F1/37 ,  H01F41/005 ,  H01P7/082

Abstract: In accordance with the present invention, novel superparamagnetic magneto-dielectric polymer nanocomposites are synthesized using a novel process. The tunability of the dielectric/magnetic properties demonstrated by this novel highly-viscous solvent-free polymer nanocomposite that is amenable to building 3D electromagnetic structures/devices by using processes such as 3D printing, compression molding or injection molding, when an external DC magnetic field is applied, exceeds what has been previously reported for magneto-dielectric polymer nanocomposite materials.

公开(公告)号：US20170145225A1

公开(公告)日：2017-05-25

申请号：US15323162

申请日：2015-03-26

Applicant: SUMITOMO METAL MINING CO., LTD.

Inventor： Hiroshi Okada ,  Yu Yamashita

IPC: C09D5/32 ,  H05K9/00 ,  C09D7/12 ,  C09D161/06 ,  B22F1/00 ,  C09D5/24

CPC classification number: C09D5/32 ,  B22F1/00 ,  B22F1/0014 ,  B22F2301/10 ,  B22F2304/10 ,  C08K7/00 ,  C08K2201/001 ,  C08K2201/005 ,  C09C1/02 ,  C09D5/24 ,  C09D7/68 ,  C09D7/70 ,  C09D161/06 ,  C09D201/00 ,  C25C5/02 ,  H01B1/026 ,  H01B1/22 ,  H01B5/00 ,  H05K9/0081

Abstract: To provide a copper powder exhibiting a high electric conductivity suitable for a metallic filler used in an electrically conductive paste, a resin for electromagnetic shielding, an antistatic coating, etc., and having excellent uniform dispersibility required for forming a paste so as to inhibit an increase in viscosity due to flocculation. This copper powder 1 forms a branch shape having a plurality of branches through the conglomeration of copper particles 2. The copper particles 2 have a spheroidal shape, with diameters ranging from 0.2 μm-0.5 μm, inclusive, and lengths ranging from 0.5 μm-2.0 μm, inclusive. The average particle diameter (D50) of the copper powder 1 in which the spheroidal copper particles 2 have conglomerated is 5.0 μm-20 μm. By mixing this tree-branch-shaped copper powder 1 into a resin, it is possible to produce an electrically conductive paste, etc., exhibiting excellent electric conductivity, for example.

公开(公告)号：US20170130074A1

公开(公告)日：2017-05-11

申请号：US15405092

申请日：2017-01-12

Applicant: INNOVIA FILMS LIMITED

Inventor： Simon READ

IPC: C09D7/00 ,  B41M5/26 ,  C09D5/29 ,  C09C1/00 ,  C09D7/12 ,  C09D5/32

CPC classification number: C09D7/41 ,  B41M3/14 ,  B41M5/267 ,  C01P2004/60 ,  C08K3/22 ,  C08K5/18 ,  C08K5/19 ,  C08K5/20 ,  C08K2003/2231 ,  C08K2201/005 ,  C08K2201/011 ,  C09C1/00 ,  C09D5/00 ,  C09D5/29 ,  C09D5/32 ,  C09D7/61 ,  C09D7/67 ,  C09D7/68 ,  C09D133/00 ,  Y10T428/2982 ,  Y10T428/2998

Abstract: The present invention relates to a film, in particular to a laser writable film, and to substances used therein, and components thereof. The present invention further relates to a method of manufacturing the film, uses thereof and products comprising the film.

公开(公告)号：US20170112969A1

公开(公告)日：2017-04-27

申请号：US15401455

申请日：2017-01-09

Applicant: BIOALPHA INC.

Inventor： JUNG JU KIM ,  SU HYUN JUNG ,  HYUN SEUNG RYU ,  JUN HYUK SEO

IPC: A61L27/46 ,  C08K7/18 ,  C01B25/32 ,  C08K3/32 ,  A61L27/52 ,  A61L27/54

CPC classification number: A61L27/46 ,  A61L27/12 ,  A61L27/20 ,  A61L27/52 ,  A61L27/54 ,  A61L27/56 ,  A61L27/58 ,  A61L2300/414 ,  A61L2430/02 ,  C01B25/327 ,  C01P2004/32 ,  C01P2004/61 ,  C08K3/32 ,  C08K7/18 ,  C08K2003/325 ,  C08K2201/005 ,  C08L5/08

Abstract: The present invention relates to a carrier for growth factor related to regeneration of bone tissues that is capable of arbitrarily controlling the delivery rate of growth factors related to bone regeneration and thus especially applicable to a bone void filler in the fields of the dental or orthopedic applications.The carrier for controlling the delivery rate of the growth factor in the present invention is composed of a hyaluronic acid hydrogel having a distribution of interconnected pores and a calcium phosphate microsphere being distributed in the pores of the hyaluronic acid hydrogel. The calcium phosphate microsphere having a porosity suitable for delivery of the growth factor is positioned into the pores of the cross-linked hyaluronic acid hydrogel to complete the carrier.

公开(公告)号：US20170051164A1

公开(公告)日：2017-02-23

申请号：US15308408

申请日：2015-04-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raghunath Padiyath ,  Naota Sugiyama ,  Richard J. Pokorny ,  Ta-Hua Yu ,  Gregory F. King ,  Stephen P. Maki ,  Robert R. Owings

IPC: C09D7/12 ,  C09D133/08 ,  C03C17/32 ,  C03C17/00 ,  C03C17/25 ,  C03C17/30 ,  C09D175/04 ,  C09D175/16

CPC classification number: C09D175/04 ,  C03C17/009 ,  C03C17/25 ,  C03C17/30 ,  C03C17/322 ,  C03C17/326 ,  C03C2217/29 ,  C03C2217/445 ,  C03C2217/478 ,  C03C2217/78 ,  C03C2218/114 ,  C03C2218/32 ,  C08K3/36 ,  C08K9/04 ,  C08K2003/2231 ,  C08K2003/2296 ,  C08K2201/005 ,  C09D5/00 ,  C09D7/67 ,  C09D133/08 ,  C09D175/16

Abstract: Article comprising a substrate having a first major surface, wherein the major surface has an emissivity not greater than 0.2 and an exposed hardcoat on the first major surface, the hardcoat comprising binder, wherein the hardcoat has a thickness less than 200 nanometers and has a scratch rating of not greater than 1 as determined by the Linear Abrasion Test in the Examples. Articles described herein are useful, for example, for sun control window films having insulative properties. Such films are applied on the interior or exterior surfaces of automotive windows or building fenestrations

Abstract translation: 该制品包括具有第一主表面的基底，其中主表面具有不大于0.2的发射率和在第一主表面上的暴露的硬涂层，所述硬涂层包含粘合剂，其中所述硬涂层具有小于200纳米的厚度并且具有刮痕 通过实施例中的线性磨损试验确定的不大于1的等级。 本文所述的物品例如对于具有绝缘性能的太阳控制窗膜是有用的。 这种膜被应用在汽车窗户的内部或外部表面或建筑开窗上