Abstract:
A vehicle window visible ray transmittance remote sensing system emits a plurality of laser beams to a driving vehicle, estimates transmittance of a window of the vehicle by acquiring a plurality of point data of a plurality of points from which a plurality of laser beams are reflected from a surface of the vehicle, and distinguishes a vehicle that deviates from a transmittance reference based on the estimated window transmittance.
Abstract:
An apparatus and method of performing photothermal chemical nanoidentification of a sample includes positioning a tip of a probe at a region of interest of the sample, with the tip-sample separation being less than about 10 nm. Then, IR electromagnetic energy having a selected frequency, ω, is directed towards the tip. Using PFT mode AFM operation, absorption of the energy at the region of interest is identified. calorimetry may also be performed with the photothermal PFT system.
Abstract:
A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement.
Abstract:
To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.
Abstract:
An optical system suitable for determining a characteristic as a function of time of at least a part of a liquid volume comprising a plurality of objects. The optical system provides a fast detection of a change in the liquid volume. The optical system comprises—an optical detection assembly comprising at least one image acquisition device configured to acquire images of an image acquisition area; —a sample device comprising at least one sample container suitable for holding a sample of said liquid volume; —a translating arrangement configured to translate said image acquisition area through at least one part of said sample container to perform a scan along a scanning path through said part of said sample container; and—an image analyzing processing system. The optical system is programmed to perform consecutive scans through said at least one part of said sample container, wherein each scan comprises acquiring images at a plurality of image acquiring positions of the image acquisition area by the optical detection assembly along at least one scanning path of the scan. The image analyzing processing system is programmed to determine a set of features in the form of a set of values for each of a plurality of objects captured on said images from each respective scan and to determine for each scan at least one derived result, the derived result is derived from a plurality of the sets of values, and to present said derived result obtained from the respective, consecutive scans as a function of time.
Abstract:
Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).
Abstract:
This document relates to systems and method for latent fingerprint detection using specular reflection (glare). An exemplary system may include a light source alignment portion configured to align a light source at an illumination angle relative to a sample surface such that the light source illuminates a sample surface so that the surface produces specular reflection. The system may also include a specular reflection discriminator that directs the produced specular reflection to an optical detector aligned relative to said sample surface at an alignment angle that is substantially equal to an angle of reflection of the produced specular reflection. Preferably, the directed specular reflection does not saturate the optical detector; and the optical detector captures the specular reflection from the sample surface and generates image data using essentially only the specular reflection.
Abstract:
Scatterometry for measuring overlay. A second set of superimposed gratings are superposed over a first set of superimposed gratings. The second set of gratings have a different periodicity from the first set of gratings or a different orientation. Consequently the first order diffraction pattern from the second set of superimposed gratings can be distinguished from the first order diffraction pattern from the first set of superimposed gratings.
Abstract:
In one embodiment, apparatus and methods for determining a parameter of a target are disclosed. A target having an imaging structure and a scatterometry structure is provided. An image of the imaging structure is obtained with an imaging channel of a metrology tool. A scatterometry signal is also obtained from the scatterometry structure with a scatterometry channel of the metrology tool. At least one parameter, such as overlay error, of the target is determined based on both the image and the scatterometry signal.
Abstract:
Methods and systems for detecting defects on a wafer are provided. One system includes an illumination subsystem configured to direct light to at least one spot on a wafer. The system also includes at least one element configured to block first portion(s) of light scattered from the at least one spot from reaching a detector while allowing second portion(s) of the light scattered from the at least one spot to be detected by the detector. The first portion(s) of the light are scattered from one or more patterned features in a logic region on the wafer. The second portion(s) of the light are not scattered from the one or more patterned features. The detector is not an imaging detector. The system further includes a computer subsystem configured to detect defects on the wafer based on output of the detector.