公开(公告)号：US20110073358A1

公开(公告)日：2011-03-31

申请号：US12892197

申请日：2010-09-28

Applicant: Katsura Hayashi

Inventor： Katsura Hayashi

IPC: H05K1/00 ,  B32B3/30 ,  B82Y30/00

CPC classification number: H05K1/0306 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/03 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4673 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1152 ,  Y10T428/24488 ,  Y10T428/24612

Abstract: A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.

Abstract translation: 电路基板包括树脂层; 以及无机绝缘层，其包括在厚度方向上贯穿无机绝缘层的槽部。 树脂层的一部分在槽部。

公开(公告)号：US20100310761A1

公开(公告)日：2010-12-09

申请号：US12734608

申请日：2008-11-11

Applicant: Masanori Tsubota ,  Hidekazu Shiomi ,  Hiroshi Ogata

Inventor： Masanori Tsubota ,  Hidekazu Shiomi ,  Hiroshi Ogata

IPC: H05K3/12

CPC classification number: H05K3/1208 ,  H05K3/182 ,  H05K3/207 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2203/0113 ,  H05K2203/0709

Abstract: [PROBLEMS] To provide a method for forming a high-definition electroconductive thin line free from blurring at low cost.[MEANS FOR SOLVING PROBLEMS] A resin film having a hardness of 20 to 70, as measured by a type A measuring method specified in JIS K 6253, is formed on a surface of a resin base material. A thin line pattern is formed on the resin film using an electroconductive paste by intaglio printing or stencil printing or using an electroless plating catalyst ink by intaglio printing or stencil printing. Subsequently, a metal film is formed on the thin line pattern by plating to form an electroconductive thin line.

Abstract translation: [问题]提供一种低成本地形成高分辨率导电细线不会模糊的方法。 解决问题的手段根据JIS K 6253规定的A型测定方法测定硬度为20〜70的树脂膜，形成在树脂基材的表面上。 使用导电糊通过凹版印刷或模板印刷或使用无电镀催化剂油墨通过凹版印刷或模版印刷在树脂膜上形成细线图案。 随后，通过电镀在薄线图案上形成金属膜以形成导电细线。

公开(公告)号：US20100249279A1

公开(公告)日：2010-09-30

申请号：US12727255

申请日：2010-03-19

Applicant: Yuta OGAWA ,  Shinichiro Fukuda ,  Katsuto Murata

Inventor： Yuta OGAWA ,  Shinichiro Fukuda ,  Katsuto Murata

IPC: C08K3/36

CPC classification number: H05K1/0373 ,  C08G59/226 ,  C08G59/38 ,  C08G75/08 ,  C08K3/36 ,  C08K5/3445 ,  C08L63/00 ,  C08L81/02 ,  H05K2201/0116 ,  H05K2201/0209 ,  C08L2666/14

Abstract: A thermally curable resin composition includes a linear thermally curable resin and amorphous silica fine particles having pore portions.

Abstract translation: 热固性树脂组合物包括线性热固性树脂和具有孔部分的无定形二氧化硅细颗粒。

公开(公告)号：US20100224396A1

公开(公告)日：2010-09-09

申请号：US12787415

申请日：2010-05-26

Applicant: Masato NOMIYA

Inventor： Masato NOMIYA

IPC: H05K1/00 ,  B32B3/26 ,  C04B35/84 ,  B32B18/00 ,  C04B37/00

CPC classification number: H05K3/4688 ,  B32B3/08 ,  B32B9/005 ,  B32B9/04 ,  B32B9/045 ,  B32B18/00 ,  B32B2250/40 ,  B32B2260/02 ,  B32B2260/046 ,  C04B35/111 ,  C04B2235/365 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5472 ,  C04B2235/6025 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2203/1147 ,  Y10T29/49163 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/249994 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.

Abstract translation: 具有优异的平坦度和少量剩余孔的高可靠性陶瓷复合多层基板可以以低成本制造，同时简化制造工艺，并且可以消除层与母板的分离或分离。 陶瓷复合多层基板包括含有第一陶瓷层和第二陶瓷层的层压体，第一陶瓷层和第二陶瓷层被设置成与第一陶瓷层接触并抑制第一陶瓷层的平面方向的烧成收缩。 层压体包括树脂/陶瓷复合层，其中多孔陶瓷浸渍有形成在层压体的至少一个主表面上的树脂。

公开(公告)号：US07754970B2

公开(公告)日：2010-07-13

申请号：US11922330

申请日：2006-05-31

Applicant: Yasushi Sasaki ,  Seiichiro Yokoyama

Inventor： Yasushi Sasaki ,  Seiichiro Yokoyama

IPC: H01B3/44

CPC classification number: H01P3/00 ,  C08J5/18 ,  C08J2367/02 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0271

Abstract: A high frequency electronic part comprising a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching. The void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm:ratio of the number of voids to film thickness (voids/μm)=the number of voids (voids) in film thickness direction/film thickness (μm).

Abstract translation: 一种高频电子部件，包括用于传输100MHz至100GHz的电信号的导体布线，以及由包含通过拉伸至少一个方向取向的热塑性树脂膜的空隙构成的绝缘层。 含有热塑性树脂薄膜的空隙含有3〜45体积％的空隙，薄膜的厚度方向的空隙数为5个以上，空隙数与膜厚的比率 以下等式为0.1〜10个空隙/μm的范围：空隙数与膜厚的比（空隙/μm）=膜厚方向的空隙数（空隙）/膜厚（μm）。

公开(公告)号：US07705458B2

公开(公告)日：2010-04-27

申请号：US11425353

申请日：2006-06-20

Applicant: Daewoong Suh ,  Yongki Min

Inventor： Daewoong Suh ,  Yongki Min

IPC: H01L23/488

CPC classification number: H01L24/10 ,  C22C45/10 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H05K1/09 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic glass electrical connection is used as a solder bump for communication between an integrated circuit device and external structures. A process of forming the foamed bulk metallic glass electrical connection includes mixing bulk metallic glass with a blowing agent.

Abstract translation: 在集成电路封装的基板上形成发泡体金属玻璃电连接。 发泡体金属玻璃电气连接显示出低冲击强度和动态载荷下的抗开裂性能。 发泡体金属玻璃电连接用作集成电路器件和外部结构之间的通信的焊料凸块。 形成发泡体金属玻璃电连接的方法包括将块状金属玻璃与发泡剂混合。

公开(公告)号：US20100021637A1

公开(公告)日：2010-01-28

申请号：US12487880

申请日：2009-06-19

Applicant: Frédéric Revol Cavalier ,  Nadine David ,  Sebastien Schoumacker

Inventor： Frédéric Revol Cavalier ,  Nadine David ,  Sebastien Schoumacker

IPC: B05D5/00

CPC classification number: H05K3/184 ,  D06M10/001 ,  D06M11/83 ,  D06M13/513 ,  D06M15/00 ,  D06M23/16 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0376 ,  H05K2203/1147

Abstract: Process for manufacturing an article comprising an approximately flat porous support and, within this support, defined zones in a chosen pattern, these zones being grafted with sensor molecules, such as metals, biological molecules, whereas the rest of the support remains free of this grafting.

Abstract translation: 用于制造包括大致平坦的多孔载体的制品的方法，并且在该载体内，以所选择的图案形成限定的区域，这些区域用传感器分子例如金属，生物分子接枝，而其余的载体保持不含该接枝 。

公开(公告)号：US20090255714A1

公开(公告)日：2009-10-15

申请号：US12232894

申请日：2008-09-25

Applicant: Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

Inventor： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC: B05D3/00 ,  B05D5/12 ,  H05K1/00

CPC classification number: H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

Abstract translation: 公开了一种绝缘片的制造方法，覆铜层压板的制造方法以及印刷电路板的制造方法以及使用这些方法制造的印刷电路板。 制造绝缘片的方法可以包括：形成热塑性增强材料，其包括由热塑性聚合物粘合剂固定的纤维，并且其中形成有孔; 形成热塑性树脂层，使得热塑性增强材料用热塑性树脂浸渍; 并热压热塑性增强材料和热塑性树脂层。 该方法可以用于制造绝缘片，其具有低吸湿率和极好的电性能，包括低介电常数（Dk）和低介电损耗（Df），并且其中纤维可以容易地浸渍 树脂。

公开(公告)号：US07586047B2

公开(公告)日：2009-09-08

申请号：US10586341

申请日：2005-01-13

Applicant: Fumihiro Hayashi ,  Yasuhito Masuda ,  Yasuhiro Okuda

Inventor： Fumihiro Hayashi ,  Yasuhito Masuda ,  Yasuhiro Okuda

IPC: H05K1/11 ,  B31D3/00

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions.With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.

Abstract translation: 本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。 提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。 通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。 含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中 或无纺布。 本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。

公开(公告)号：US07537667B2

公开(公告)日：2009-05-26

申请号：US11361678

申请日：2006-02-24

Applicant: Hisashi Satou

Inventor： Hisashi Satou

IPC: B32B37/14 ,  B32B38/04 ,  B32B38/10 ,  B32B38/08 ,  B32B37/26 ,  B32B37/06 ,  B32B37/04 ,  B32B38/18

CPC classification number: B23K26/18 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B32B38/04 ,  B32B2305/77 ,  B32B2310/0843 ,  B32B2315/02 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0029 ,  H05K3/007 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2203/0156 ,  Y10T83/0443 ,  Y10T83/0453 ,  Y10T83/0481 ,  Y10T156/1056 ,  Y10T156/1057

Abstract: A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.

Abstract translation: 制备包含无机粉末和有机粘合剂的生片和形成在其上的导电层的复合生片。 然后将复合生片放置在包含液体的基底构件的支撑表面上; 并且用激光照射复合生片，以便根据需要形成通孔，从而使包含在基体中的液体蒸发，从而清洁和除去残留在通孔内壁表面上的废物 。 结果，导电层在穿透导电层的通孔的内壁处露出。