公开(公告)号：US07090924B2

公开(公告)日：2006-08-15

申请号：US10309720

申请日：2002-12-04

Applicant: Jyoti Sharma ,  Martin Choate ,  Steve Peters ,  Kevin Rafferty

Inventor： Jyoti Sharma ,  Martin Choate ,  Steve Peters ,  Kevin Rafferty

IPC: B32B15/06 ,  B32B15/18 ,  B32B17/04 ,  B32B27/18 ,  B32B27/26

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/04 ,  B32B27/04 ,  B32B27/18 ,  B32B2307/20 ,  B32B2307/3065 ,  B32B2309/022 ,  B32B2309/12 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  C08K5/06 ,  C08K5/14 ,  C08L51/003 ,  C08L51/04 ,  C08L53/02 ,  C08L55/02 ,  C08L67/06 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y10T428/249933 ,  Y10T428/249939 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31616 ,  Y10T428/31645 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31786 ,  Y10T428/31794 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T442/2631 ,  C08L2666/02 ,  C08L2666/14

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as the prepregs, laminates and composites made from the thermosetting resin composition.

公开(公告)号：US07071027B2

公开(公告)日：2006-07-04

申请号：US10741439

申请日：2003-12-22

Applicant: Jeong-Woo Seo

Inventor： Jeong-Woo Seo

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/48 ,  H01L23/49816 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/112 ,  H05K3/28 ,  H05K3/3457 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09472 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A ball grid array package utilizing a layer of an elastic insulating material to protect conductive ball lands from deformation during subsequent processing and use of the resulting device and a method of manufacturing the same are disclosed. The elastic insulating layer preferably has a modulus of elasticity no greater than about 20 MPa or less to absorb and or distribute mechanical stress applied to conductive ball lands directly or through solder ball joints or other structures and thereby improve the solder joint reliability (SJR) of the resulting device.

Abstract translation: 公开了一种使用弹性绝缘材料层的球栅阵列封装，以在后续处理和使用所得器件期间保护导电球焊台免受变形，以及制造该器件的方法。 弹性绝缘层优选具有不大于约20MPa或更小的弹性模量，以直接或通过焊球接头或其他结构吸收和分布施加到导电球台的机械应力，从而提高焊接可靠性（SJR） 产生的设备。

公开(公告)号：US07042077B2

公开(公告)日：2006-05-09

申请号：US10825400

申请日：2004-04-15

Applicant: Michael J. Walk ,  Hamid Azimi ,  John S. Guzek ,  Charan K. Gurumurthy

Inventor： Michael J. Walk ,  Hamid Azimi ,  John S. Guzek ,  Charan K. Gurumurthy

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

Abstract translation: 系统可以包括无芯衬底，附着到衬底的材料层，具有比衬底更低的弹性模量的材料层，耦合到材料层的插入器以及耦合到插入器的电容层。

公开(公告)号：US20060091548A1

公开(公告)日：2006-05-04

申请号：US11258940

申请日：2005-10-26

Applicant: Masahiro Naiki ,  Koji Hayashi ,  Katsutoshi Hirashima

Inventor： Masahiro Naiki ,  Koji Hayashi ,  Katsutoshi Hirashima

IPC: H01L23/48

CPC classification number: H05K1/028 ,  C08L79/08 ,  C08L2205/02 ,  C09D179/08 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/285 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0394 ,  C08L2666/20 ,  H01L2924/00

Abstract: A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.

Abstract translation: 公开了一种具有改进的阻燃性的带状载体封装的柔性布线板。 柔性布线基板具有：具有弯曲狭缝的绝​​缘膜，形成在其上的布线图案，并且与弯曲狭缝交叉;将布线图案粘合到绝缘膜上的粘合剂层;保护弯曲狭缝处的布线图案的柔性树脂层;以及 保护由固化性树脂组合物获得的外涂层的布线图案的外涂层，当固化成膜的形式时，该膜在25℃下的初始模量为10〜1500MPa，电绝缘性 足够的水平，260℃下的10秒的耐焊接性和超过22.0的氧指数。

公开(公告)号：US07034688B2

公开(公告)日：2006-04-25

申请号：US10118092

申请日：2002-04-09

Applicant: Manfred Rietzler ,  Francisco Martinez de Velasco Cortina

Inventor： Manfred Rietzler ,  Francisco Martinez de Velasco Cortina

IPC: G08B13/14

CPC classification number: C23F1/02 ,  G06K19/0723 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/0776 ,  G06K19/07771 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/16 ,  G06K19/18 ,  G06K2019/0629 ,  H01L2924/0002 ,  H01Q1/22 ,  H01Q9/27 ,  H01Q13/10 ,  H05K1/0393 ,  H05K3/067 ,  H05K3/068 ,  H05K2201/0133 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T29/49016 ,  H01L2924/00

Abstract: A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation fo devices thereby are provided. The method involves selectively exposing the metallized surface to a demetallizing (i.e., an oxidizing) chemical solution. The metallized layer can be selectively exposed to the demetallizing solution using a flexographic printing process wherein printing rollers are used to transfer the demetallizing solution to the metallized surface. An identification device including, for example, a holographic, retro-reflective, or other metallized material and a radio-frequency transponder are also provided. The radio-frequency transponder includes an RF chip and an antenna in electrical communication with the chip. The identification device including the holographic image allows both electronic identification through the reading of identification data stored in the chip and optical identification via the holographic image.

公开(公告)号：US20060079609A1

公开(公告)日：2006-04-13

申请号：US11280328

申请日：2005-11-17

Applicant: Takashi Nishioka ,  Hirofumi Goto ,  Katsumi Inomata ,  Shin-ichirou Iwanaga

Inventor： Takashi Nishioka ,  Hirofumi Goto ,  Katsumi Inomata ,  Shin-ichirou Iwanaga

IPC: C08L63/00

CPC classification number: H05K1/0271 ,  C08J5/18 ,  C08J2363/00 ,  H01L23/293 ,  H01L23/49894 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4626 ,  H05K2201/0133 ,  H05K2201/0212 ,  H01L2924/00

Abstract: A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics such as stress relaxation property (low stress properties), electric insulation properties, heat shock resistance, and heat resistance can be produced from the heat curable resin.

Abstract translation: 一种具有低弹性模量的热固性树脂组合物，其包含（A）环氧树脂，（B）交联的细颗粒和（C）固化剂，其在通过热固化时产生弹性模量小于 提供1 GPa。 可以从热固性树脂制造出具有应力松弛性（低应力性），电绝缘性，耐热冲击性，耐热性等特性优异的固化物。

公开(公告)号：US20060040567A1

公开(公告)日：2006-02-23

申请号：US10711076

申请日：2004-08-20

Applicant: William Bernier ,  Tien-Jen Cheng ,  Marie Cole ,  David Eichstadt ,  Mukta Farooq ,  John Fitzsimmons ,  Lewis Goldmann ,  John Knickerbocker ,  Tasha Lopez ,  David Welsh

Inventor： William Bernier ,  Tien-Jen Cheng ,  Marie Cole ,  David Eichstadt ,  Mukta Farooq ,  John Fitzsimmons ,  Lewis Goldmann ,  John Knickerbocker ,  Tasha Lopez ,  David Welsh

IPC: H05K1/00 ,  H01R12/00 ,  H01R13/42

CPC classification number: H01L21/563 ,  H01L23/3171 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13566 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R43/0256 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/0401

Abstract: Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.

Abstract translation: 公开了一种形成集成电路结构的方法，其在器件上形成无铅连接器，用可压缩膜围绕无铅连接器，将器件连接到载体（无铅连接器将器件电连接到载体上 ），并用绝缘底部填充物填充载体和装置之间的间隙。

公开(公告)号：US06995814B2

公开(公告)日：2006-02-07

申请号：US10935572

申请日：2004-09-07

Applicant: Tsutomu Kanatsu

Inventor： Tsutomu Kanatsu

IPC: G02F1/1333 ,  G02F1/1345

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K1/147 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/10681

Abstract: In a flat panel display device, in which a display panel 1 loosely fitted on a main surface of a chassis 4 and circuit substrates held in hook portions provided on side surfaces of the chassis are connected each other through TCP's by bending the latter TCP's, and a method for manufacturing the same device, a main slit for a rounded portion of each TCP is formed in a rounded portion of the TCP and an auxiliary sub slit is also formed adjacent to the main slit. In order to reduce the peeling force exerted on connecting/fixing portions between the TCP's and the display panel, the circuit substrate is pulled up by bending the main and sub slits and then returning the sub slit to a flat state to insert the circuit substrate into the hook portions.

Abstract translation: 在平板显示装置中，其中松散地装配在底盘4的主表面上的显示面板1和保持在设置在底盘的侧表面上的钩部中的电路基板通过TCP相互连接，通过弯曲后者TCP，并且 制造同一装置的方法中，每个TCP的圆形部分的主狭缝形成在TCP的圆形部分中，辅助副狭缝也形成在与主狭缝相邻的位置。 为了减少施加在TCP和显示面板之间的连接/固定部分上的剥离力，通过弯曲主和副狭缝将电路基板拉起，然后将副狭缝返回到平坦状态以将电路基板插入 钩部。

公开(公告)号：US20060024989A1

公开(公告)日：2006-02-02

申请号：US11237091

申请日：2005-09-27

Applicant: Scott Lindsey ,  Charles Miller ,  David Royster ,  Stuart Wenzel

Inventor： Scott Lindsey ,  Charles Miller ,  David Royster ,  Stuart Wenzel

IPC: H01R12/00

CPC classification number: G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

公开(公告)号：US20060014083A1

公开(公告)日：2006-01-19

申请号：US11070028

申请日：2005-03-01

Applicant: Robert Carlson

Inventor： Robert Carlson

IPC: G03F1/00 ,  G03G17/04

CPC classification number: G03F1/60 ,  B81B2201/058 ,  B81C1/00182 ,  G03F1/50 ,  H05K1/0283 ,  H05K1/032 ,  H05K3/102 ,  H05K3/184 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0236 ,  H05K2203/095 ,  H05K2203/1173

Abstract: The present invention provides methods and systems for fabricating electronic and/or microfluidic structures on elastomeric substrates. In one method, a protective structure is positioned onto a portion of a surface of the hydrophobic substrate. An unprotected portion of the surface is activated to become hydrophilic, wherein the protected portion of the surface of the substrate remains hydrophobic. The protective structure is removed from the surface of the substrate and material is deposited on the hydrophobic portion to form a structure on the substrate.

Abstract translation: 本发明提供了用于在弹性体基底上制造电子和/或微流体结构的方法和系统。 在一种方法中，将保​​护结构定位在疏水性基材表面的一部分上。 表面的无保护部分被活化以变得亲水，其中基底表面的受保护部分保持疏水性。 保护结构从衬底的表面去除，并且材料沉积在疏水部分上以在衬底上形成结构。