公开(公告)号：US20130250603A1

公开(公告)日：2013-09-26

申请号：US13799579

申请日：2013-03-13

Applicant: JOANEL INC.

Inventor： Aldjia BEGRICHE ,  Olivier VERMEERSCH

IPC: F21V33/00 ,  F21V21/14 ,  F21V8/00

CPC classification number: F21V33/0004 ,  A45C15/06 ,  F21V21/14 ,  F21Y2115/10 ,  G02B6/0005 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/189 ,  H05K3/0067 ,  H05K3/4015 ,  H05K2201/0281 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10287

Abstract: A method and a system for illumination of a personal item, the system comprising at least one light source activated by a textile switch, the light source and the textile switch being secured to a textile substrate and connected by conductors on the textile substrate, the textile substrate being secured on the personal item. The method comprises securing at least one light source and a textile switch on a substrate, connecting the light source and the textile switch by conductors on the substrate, connecting the light source and the textile switch to a powering unit, securing the substrate to the personal item and operating the textile switch.

Abstract translation: 一种用于照明个人物品的方法和系统，所述系统包括由纺织开关激活的至少一个光源，所述光源和所述纺织品开关固定到纺织品基底并通过所述织物基底上的导体连接，所述纺织品 底物被固定在个人物品上。 该方法包括将至少一个光源和织物开关固定在基板上，通过基板上的导体连接光源和纺织开关，将光源和纺织开关连接到供电单元，将基板固定到个人 项目并操作纺织品开关。

公开(公告)号：US20130107485A1

公开(公告)日：2013-05-02

申请号：US13638536

申请日：2011-03-31

Applicant: Pulugurtha Markondeya Raj ,  Nitesh Kumbhat ,  Venkatesh Sundaram ,  Rao R. Tummala

Inventor： Pulugurtha Markondeya Raj ,  Nitesh Kumbhat ,  Venkatesh Sundaram ,  Rao R. Tummala

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/18

CPC classification number: H05K1/0213 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/413 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/45147 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81385 ,  H01L2224/81399 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2224/8185 ,  H01L2224/81897 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15791 ,  H01R12/52 ,  H01R12/714 ,  H05K1/18 ,  H05K3/107 ,  H05K3/3436 ,  H05K2201/0248 ,  H05K2201/0281 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (μm). The interconnect structure comprises a dielectric body element and at least one interconnection array that provides a conductive path between two electronic components. Each interconnection array comprises a plurality of wires that provide both conductivity and compliance to the overall interconnect structure. The versatility and scalability of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures.

Abstract translation: 本发明的各种实施例提供了一种应力消除的二级互连结构，其低成本并且适应低TCE封装和PCB之间的TCE不匹配。 互连结构的各种实施例是可再加工的，并且可以缩放到约1毫米（mm）至约150微米（母体）的间距。 互连结构包括介电体元件和提供两个电子部件之间的导电路径的至少一个互连阵列。 每个互连阵列包括提供导电性和整体互连结构的柔性的多条导线。 本发明的互连结构的多功能性和可扩展性使其成为在目前的二维和不断发展的三维IC结构中使用的理想结构。

公开(公告)号：US20130020313A1

公开(公告)日：2013-01-24

申请号：US13628287

申请日：2012-09-27

Applicant: Stanley Shigezo Swallow ,  Asha Peta-Thompson

Inventor： Stanley Shigezo Swallow ,  Asha Peta-Thompson

IPC: H05B3/34

CPC classification number: D03D15/00 ,  D03D1/0088 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2211/02 ,  D10B2211/04 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/16 ,  D10B2403/02431 ,  H01H2203/0085 ,  H01H2203/01 ,  H05K3/10 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/3033 ,  Y10T442/3382 ,  Y10T442/339

Abstract: Electrical components are formed in a fabric during the weaving process by a series of crossing conductors in the warp and weft fibres of the fabric. Some of the crossing points provide permanent Separation of the crossing conductors, others permanent connection of the crossing conductors and others connection upon the application of pressure to the fabric. The structure provides the possibility of forming a greater range of components and more reliable component characteristics than heretofore possible.

Abstract translation: 在织造过程中，织物中的织物经纱和纬纱中的一系列交叉导体形成电气部件。 一些交叉点提供了交叉导体的永久分离，其他交叉导体和其他连接在施加压力时连接到织物上。 该结构提供了形成更大范围的部件和比迄今为止更可靠的部件特性的可能性。

公开(公告)号：US20120300426A1

公开(公告)日：2012-11-29

申请号：US13513434

申请日：2010-09-02

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Kou Noguchi ,  Tetsuga Shimomura

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Kou Noguchi ,  Tetsuga Shimomura

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C09J9/02 ,  C09J11/04 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0281 ,  H05K2201/0394

Abstract: There are provided a connection structure of printed circuit boards, and so forth, the connection structure including a first printed circuit board, a second printed circuit board located above the first printed circuit board, and an anisotropic conductive adhesive configured to establish a conductive connection between a conductor of the first printed circuit board and a conductor of the second printed circuit board, in which the anisotropic conductive adhesive contains a conductive filler, and in which the conductive filler is formed of crystallized metal-particle wires produced by allowing metal particles to crystallize and grow linearly. It is thus possible to easily achieve sufficiently high connection strength while a flying lead of one printed circuit board is electrically connected to a conductive lead (substrate pad) of the other printed circuit board.

Abstract translation: 提供了印刷电路板的连接结构等等，连接结构包括第一印刷电路板，位于第一印刷电路板上方的第二印刷电路板和各向异性导电粘合剂，其被配置为在第一印刷电路板之间建立导电连接 第一印刷电路板的导体和第二印刷电路板的导体，其中各向异性导电粘合剂包含导电填料，并且其中导电填料由通过使金属颗粒结晶而产生的结晶金属 - 微粒线形成 并线性增长。 因此，可以容易地实现足够高的连接强度，同时将一个印刷电路板的引线电连接到另一个印刷电路板的导电引线（基板焊盘）。

公开(公告)号：US08153908B2

公开(公告)日：2012-04-10

申请号：US12173371

申请日：2008-07-15

Applicant: Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

Inventor： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K9/00 ,  H05K3/38 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/2072 ,  Y10T29/49155

Abstract: The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.

Abstract translation: 即使基部构件和电缆层的热膨胀系数明显不同，电路板也能够将基座构件上的电缆层紧密接合。 电路板包括：基座部件; 并且电缆层被层压在具有锚定图案的基底构件上，锚定图案是形成在基底构件的表面上的导电层。

公开(公告)号：US20110318600A1

公开(公告)日：2011-12-29

申请号：US13254733

申请日：2010-06-25

Applicant: Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa ,  Tetsuro Sato

Inventor： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa ,  Tetsuro Sato

IPC: B32B5/18 ,  B05D5/12 ,  B05D3/00 ,  B32B3/26

CPC classification number: C25D1/08 ,  B01D39/2041 ,  B01D2239/10 ,  B01D2239/1208 ,  C25D1/04 ,  C25D3/04 ,  C25D7/00 ,  H01M4/74 ,  H01M4/75 ,  H01M4/80 ,  H01M4/808 ,  H05K1/09 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/0355 ,  Y10T428/12042 ,  Y10T428/12424 ,  Y10T428/12431 ,  Y10T428/12479 ,  Y10T428/249986

Abstract: A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

Abstract translation: 本发明的多孔金属箔包括由金属纤维构成的二维网状结构体。 该多孔金属箔具有优异的性能，可以以高生产率和成本有效的方式获得。

公开(公告)号：US20110036448A1

公开(公告)日：2011-02-17

申请号：US12989461

申请日：2009-04-22

Applicant: Liesbeth Van Pieterson ,  Rabin Bhattacharya ,  Koen Van Os

Inventor： Liesbeth Van Pieterson ,  Rabin Bhattacharya ,  Koen Van Os

IPC: D03D15/00

CPC classification number: H05K1/0269 ,  H05K1/0266 ,  H05K1/038 ,  H05K1/189 ,  H05K3/303 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/083 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/166 ,  Y02P70/613

Abstract: The invention relates to a textile (1) for mounting a first electronic component at a first designated position (121) on the textile, and for mounting a second electronic component at a second designated position (122) on the textile, the textile comprising a first marker pattern (111, 112) associated with the first designated position, and a second marker pattern (113, 114) associated with the second designated position. With the textile according to the invention, an electronic textile can be reliably manufactured using conventional equipment known from the electronics assembly industry, such as a pick-and-place apparatus, whereby the electronic components are properly provided at their respective designated positions on the textile.

Abstract translation: 本发明涉及一种用于将第一电子部件安装在织物上的第一指定位置（121）并用于将第二电子部件安装在纺织品上的第二指定位置（122）的纺织品（1），所述纺织品包括 与第一指定位置相关联的第一标记图案（111,112）以及与第二指定位置相关联的第二标记图案（113,114）。 对于根据本发明的纺织品，可以使用从电子组装工业已知的常规设备（例如拾放设备）可靠地制造电子织物，由此电子部件在其各自的指定位置适当地设置在纺织品上 。

公开(公告)号：US20110024275A1

公开(公告)日：2011-02-03

申请号：US12807446

申请日：2010-09-07

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: H01H1/02

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based key actuators and other switching devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the key actuators and other switching devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

Abstract translation: 主要致动器和其他开关装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 可以使用诸如注射成型压缩成型或挤出的方法来形成导电负载的树脂基键致动器和其他开关装置。 用于形成关键致动器和其它开关装置的导电负载树脂基材料也可以是易于切割成所需形状的薄柔性机织织物的形式。

公开(公告)号：US20100317187A1

公开(公告)日：2010-12-16

申请号：US12814305

申请日：2010-06-11

Applicant: Akio KAWABATA ,  Shintaro SATO

Inventor： Akio KAWABATA ,  Shintaro SATO

IPC: H01L21/768

CPC classification number: D01F9/127 ,  B82Y10/00 ,  B82Y30/00 ,  H01L21/76885 ,  H01L23/373 ,  H01L23/485 ,  H01L23/5226 ,  H01L23/53276 ,  H01L24/13 ,  H01L2221/1094 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  Y10S977/742 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An aggregate structure of carbon fibers, organized by a plurality of carbon fibers, includes, an aggregate of the carbon fibers aligned in a lengthwise direction, in which a density of the carbon fibers at one side end is different from a density of the carbon fibers at the other side end.

公开(公告)号：US07849888B2

公开(公告)日：2010-12-14

申请号：US12389932

申请日：2009-02-20

Applicant: Eleni Karayianni ,  Eduardo Munoz ,  George W. Coulston ,  Stacey B. Burr ,  Thomas A. Micka

Inventor： Eleni Karayianni ,  Eduardo Munoz ,  George W. Coulston ,  Stacey B. Burr ,  Thomas A. Micka

IPC: D03D15/08 ,  D03D15/06 ,  D03D23/00

CPC classification number: H05K1/038 ,  D02G3/32 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0027 ,  D03D15/0066 ,  D03D15/0077 ,  D03D15/0088 ,  D03D15/08 ,  D04B1/14 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2201/04 ,  D10B2211/02 ,  D10B2211/04 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/061 ,  D10B2401/16 ,  D10B2403/0114 ,  D10B2403/02431 ,  D10B2501/00 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/3024 ,  Y10T442/3976 ,  Y10T442/40 ,  Y10T442/413 ,  Y10T442/45

Abstract: A surface functional electro-textile fabric incorporates energy-active, electrically conductive or optically conductive fibers and nonconductive fibers in a woven or knitted textile fabric. The weave or knit pattern is selected so as to form floats of the electrically conductive fibers on at least one surface of the electro-textile fabric. The electro-textile fabric can be incorporated into an antenna structure that interacts with high frequency electromagnetic radiation, particularly in the frequency range of DC to 100 GHz.

Abstract translation: 表面功能性电纺织物在机织或针织纺织织物中结合能量活性，导电或光导纤维和非导电纤维。 选择编织或编织图案以在电纺织物的至少一个表面上形成导电纤维的浮子。 电纺织物可以结合到与高频电磁辐射相互作用的天线结构中，特别是在DC至100GHz的频率范围内。