公开(公告)号：US20130107481A1

公开(公告)日：2013-05-02

申请号：US13664577

申请日：2012-10-31

Applicant: Keisuke SHIMIZU ,  Yasuyuki Kurabe

Inventor： Keisuke SHIMIZU ,  Yasuyuki Kurabe

IPC: H05K7/14

CPC classification number: H05K3/0097 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/97 ,  H01L2224/12105 ,  H05K1/0271 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/10204

Abstract: A multi-piece substrate includes a frame portion, and a unit portion in which multiple wiring boards is arrayed. The frame portion is formed on the periphery of the unit portion, the wiring boards have semiconductor elements built in the wiring boards, respectively, and the frame portion has multiple slits formed such that the slits have openings on the periphery of the frame portion.

Abstract translation: 多片基板包括框架部分和布置多个布线板的单元部分。 框架部分形成在单元部分的周边上，布线板分别具有内置在布线板中的半导体元件，并且框架部分具有形成为使得狭缝在框架部分的周边上具有开口的多个狭缝。

公开(公告)号：US08337646B2

公开(公告)日：2012-12-25

申请号：US12197366

申请日：2008-08-25

Applicant: Mark J. LaPlante ,  Thomas Weiss

Inventor： Mark J. LaPlante ,  Thomas Weiss

IPC: B29C65/00 ,  B29C73/00 ,  C03B29/00 ,  C04B33/34

CPC classification number: H05K3/4061 ,  H05K3/225 ,  H05K2201/10204 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/163 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T83/04 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/107 ,  Y10T156/137

Abstract: A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate.

Abstract translation: 提供了一种用于在产品毛坯中填充通孔和/或修补产品毛坯中的通孔的方法和装置。 该方法和装置利用具有固定阵列中的填充通孔的转移毛坯，该通孔冲入产品毛坯中以修补或填充产品毛坯的通孔。 该方法和装置采用位置确定装置，例如相机，冲头和相应的冲头模具以及激活装置，以激活打孔头以冲压转移毛坯，以填充产品毛坯。 转移毛坯具有固定的填充通孔阵列，并且转移毛坯站采用固定板，该固定板具有位于转移毛坯的非通孔区域中的多个真空端口，该固定板在该方法期间固定转移毛坯。 产品毛坯由真空板保持。

公开(公告)号：US08045333B2

公开(公告)日：2011-10-25

申请号：US12008836

申请日：2008-01-14

Applicant: Christopher Lee Eriksen ,  Howard David Goldberg ,  John Charles Meyer

Inventor： Christopher Lee Eriksen ,  Howard David Goldberg ,  John Charles Meyer

IPC: H05K7/00 ,  H05K7/10 ,  H05K1/16

CPC classification number: H05K1/147 ,  H05K1/0256 ,  H05K2201/10204 ,  H05K2201/2036 ,  Y10T29/49826

Abstract: A compliant circuit element spacing system comprises a circuit board, a dummy spacer component, and a compliant circuit element. One or more active components are mounted to the circuit board. The dummy spacer component is also mounted to the circuit board, such that the dummy spacer component is electrically isolated from each active component mounted to the circuit board. The compliant circuit element is positionable proximate the circuit board, and spaced from the circuit board by the dummy spacer component. The spacing component isolates the compliant circuit element from each active component mounted to the circuit board.

Abstract translation: 兼容电路元件间隔系统包括电路板，虚拟间隔件部件和兼容电路元件。 一个或多个有源部件被安装到电路板。 虚拟间隔器部件也安装到电路板，使得虚拟间隔件部件与安装到电路板的每个有源部件电隔离。 柔性电路元件可靠近电路板定位，并且通过虚拟间隔器部件与电路板间隔开。 间隔部件将兼容电路元件与安装到电路板的每个有源部件隔离。

公开(公告)号：US20110253786A1

公开(公告)日：2011-10-20

申请号：US13087580

申请日：2011-04-15

Applicant: Andrew Campbell ,  Brian Docherty ,  James Churchman ,  Kevin Maidment ,  Nick McGarvey

Inventor： Andrew Campbell ,  Brian Docherty ,  James Churchman ,  Kevin Maidment ,  Nick McGarvey

IPC: G06K7/01

CPC classification number: G06K7/0013 ,  G06K7/0008 ,  H05K1/0219 ,  H05K1/0275 ,  H05K2201/09263 ,  H05K2201/10204

Abstract: A card reader terminal is provided with circuitry to detect wireless transmission of data from the card terminal from illicit transmitting equipment within the terminal in the form of a “shim” or otherwise. The detector circuit is connected to an A/D input of a microprocessor. Voltage level at the input may be measured rather than just treating it as digital input where the voltage level would be taken by the processor as either ON (signal present) or OFF (signal not present). Where the microprocessor (or other processing electronics) used does not have an analog to digital converter input, an external analog to digital circuit may be used. The terminal can determine the level of radio signal activity in its vicinity before a card is entered into the card slot, the level after the card is inserted and the level during the time the terminal is exchanging data with the card. If there is an abrupt increase in signal level when the card is inserted or when data exchange commences, the processor can ensure that the PIN is not sent to the card and can prevent all further transactions until the radio signal is no longer present.

Abstract translation: 读卡器终端设置有电路，用于以“垫片”或其他形式检测来自卡终端的数据从终端内的非法传送设备的无线传输。 检测器电路连接到微处理器的A / D输入。 可以测量输入端的电压电平，而不是将其视为数字输入，其中处理器将采取电压电平为ON（信号存在）或OFF（信号不存在）。 在使用微处理器（或其他处理电子设备）没有模数转换器输入的情况下，可以使用外部模拟数字电路。 在卡插入卡槽之前，终端可以确定其附近的无线电信号活动的水平，卡插入后的电平以及终端与卡交换数据期间的电平。 如果在插入卡或数据交换开始时信号电平突然增加，则处理器可以确保PIN不发送到卡，并且可以防止所有进一步的事务，直到无线电信号不再存在。

公开(公告)号：US20110013366A1

公开(公告)日：2011-01-20

申请号：US12835961

申请日：2010-07-14

Applicant: Luisa COPPOLA ,  Didier Cottet ,  Matteo Fabbri ,  Roland Schmidt

Inventor： Luisa COPPOLA ,  Didier Cottet ,  Matteo Fabbri ,  Roland Schmidt

IPC: H05K7/20

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: An electronic circuit board includes at least one conductor path and at least one component which is one of an electronic component, electric component and heat emitting component, and which is connected to the conductor path. At least one thermal capacitor is thermally connected to the conductor in vicinity to the at least one component. The at least one thermal capacitor is suitable for transmitting and/or buffering thermal energy of the at least one component.

Abstract translation: 电子电路板包括至少一个导体路径和至少一个作为电子部件，电气部件和发热部件之一的部件，并且连接到导体路径。 至少一个热电容器与至少一个部件附近的导体热连接。 所述至少一个热电容器适用于传输和/或缓冲所述至少一个部件的热能。

公开(公告)号：US20100246145A1

公开(公告)日：2010-09-30

申请号：US12424526

申请日：2009-04-15

Applicant: Xiao-Feng Ma ,  Zheng-Heng Sun

Inventor： Xiao-Feng Ma ,  Zheng-Heng Sun

IPC: H05K7/00 ,  H01R3/00 ,  H05K1/18

CPC classification number: H01R13/443 ,  G06F1/181 ,  H01R13/648 ,  H01R13/6658 ,  H05K1/0215 ,  H05K1/0295 ,  H05K2201/10189 ,  H05K2201/10204

Abstract: An electronic device includes a shell, a printed circuit board, and a dummy connector. The shell defines a through hole and accommodates the printed circuit board. The dummy connector includes a main body and a grounded portion. The main body includes a projection engaging the through hole. The grounded portion extends from the main body and is electrically fixed to the printed circuit board to be grounded.

Abstract translation: 电子设备包括外壳，印刷电路板和虚拟连接器。 壳体限定一个通孔并容纳印刷电路板。 虚拟连接器包括主体和接地部分。 主体包括与通孔接合的突起。 接地部分从主体延伸并电固定到印刷电路板上以接地。

公开(公告)号：US20100202125A1

公开(公告)日：2010-08-12

申请号：US12685306

申请日：2010-01-11

Applicant: Masahiro MURAKAMI ,  Masahiko Kushino ,  Akiteru Deguchi ,  Yoshihisa Amano

Inventor： Masahiro MURAKAMI ,  Masahiko Kushino ,  Akiteru Deguchi ,  Yoshihisa Amano

IPC: H05K7/00

CPC classification number: H05K1/0271 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/144 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/09136 ,  H05K2201/10204 ,  H01L2224/0401

Abstract: A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.

Abstract translation: 面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。 金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。 利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲 树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲 的顶板被淘汰。 这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

公开(公告)号：US20100091462A1

公开(公告)日：2010-04-15

申请号：US12527320

申请日：2008-02-13

Applicant: Masaharu Imazato ,  Masayasu Ono ,  Naoto Yamazaki

Inventor： Masaharu Imazato ,  Masayasu Ono ,  Naoto Yamazaki

IPC: H05K7/20

CPC classification number: H05K1/0216 ,  H05K1/0203 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/162 ,  H05K2201/10204 ,  H05K2201/1056

Abstract: A noise electric current flowing through a heat sink is efficiently discharged to the ground of a printed circuit board to reduce levels of clock signal harmonic noises generated from the heat sink. An electronic device-installed apparatus is provided with a printed circuit board (1), one or more of electronic devices (2, 3) that are mounted on the printed circuit board (1) and that operate in accordance with a clock signal, and a heat sink means set to hold the electronic devices (2, 3) together with the printed circuit board (1). The heat sink means (5) is connected with the ground of the printed circuit board (1) through a connecting unit (6) and a plurality of dielectric components (12), which are independent of the electronic devices (2, 3), are provided between portions of the printed circuit board except those on which the electronic devices (2, 3) are mounted and the heat sink means (5).

Abstract translation: 流过散热器的噪声电流被有效地放电到印刷电路板的地面，以减少从散热器产生的时钟信号谐波噪声的水平。 电子装置安装装置设置有印刷电路板（1），一个或多个安装在印刷电路板（1）上并根据时钟信号操作的电子设备（2,3），以及 设置用于将电子设备（2,3）与印刷电路板（1）一起保持的散热装置。 散热装置（5）通过连接单元（6）和独立于电子设备（2,3）的多个电介质部件（12）与印刷电路板（1）的接地连接， 设置在除了安装有电子设备（2,3）的那些部分之外的印刷电路板的部分和散热装置（5）之间。

公开(公告)号：US20100070204A1

公开(公告)日：2010-03-18

申请号：US12505758

申请日：2009-07-20

Applicant: Tomoko Monda ,  Minoru Mukai ,  Kenji Hirohata

Inventor： Tomoko Monda ,  Minoru Mukai ,  Kenji Hirohata

IPC: G06F19/00

CPC classification number: H05K3/3436 ,  H05K1/0268 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/163 ,  Y02P70/613

Abstract: A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.

Abstract translation: 损伤指数预测系统用于预测具有将电子部件电连接到安装电路板的焊点与一个或多个检测焊点的电子器件的焊点的损伤相关指数，该检测焊点被设计成具有 寿命比焊点短。 该系统包括：数据库，配置为存储检测焊点和焊点之间的断裂关系; 断裂检测器，被配置为检测所述检测焊点的断裂; 以及处理器，其被配置为基于与通过裂缝检测器获得的检测焊点的断裂有关的信息和存储在数据库中的断裂关系来计算焊点的损伤相关指数的预测值。

公开(公告)号：US20090279273A1

公开(公告)日：2009-11-12

申请号：US12343563

申请日：2008-12-24

Applicant: Mitsuhiko SUGANE ,  Kazuya NISHIDA ,  Akira OKADA

Inventor： Mitsuhiko SUGANE ,  Kazuya NISHIDA ,  Akira OKADA

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/341 ,  H05K2201/0715 ,  H05K2201/10204 ,  Y10T29/49124

Abstract: There is provided a multi-layer printed wiring board that can perform impedance control, concurrently maintaining the flexibility of a flexible portion with one or more signal lines. Such a multi-layer printed wiring board includes a plurality of rigid board units; and a flexible board unit, connecting outer layers or inner layers of the plurality of rigid board units and extending over the outer layers or the inner layers of the plurality of rigid board units. The flexible board unit includes a signal layer sending signals between the plurality of rigid board units; ground layers sandwiching the signal layer; and intermediate layers each interposed between the signal layer and one of the ground layers.

Abstract translation: 提供了可以执行阻抗控制的多层印刷线路板，同时保持具有一个或多个信号线的柔性部分的柔性。 这种多层印刷线路板包括多个刚性板单元; 以及柔性板单元，连接所述多个刚性板单元的外层或内层，并且在所述多个刚性板单元的外层或内层上延伸。 柔性板单元包括在多个刚性板单元之间发送信号的信号层; 夹层信号层的接地层; 以及每个介于信号层和一个接地层之间的中间层。