公开(公告)号：US10060819B2

公开(公告)日：2018-08-28

申请号：US14945661

申请日：2015-11-19

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L7/00 ,  G01L9/12 ,  G01L19/00 ,  G01L19/14

CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L19/148

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

公开(公告)号：US09986354B2

公开(公告)日：2018-05-29

申请号：US13927865

申请日：2013-06-26

Applicant: Infineon Technologies AG

Inventor： Thomas Mueller ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl ,  Jochen Dangelmaier

IPC: H01L29/84 ,  H01L21/78 ,  H04R25/00 ,  B81C1/00 ,  H01L23/495 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04 ,  H04R1/08

CPC classification number: H04R31/00 ,  B81B2201/0257 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10158 ,  H01L2924/16195 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  Y10T29/49121 ,  H01L2924/00014

Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

公开(公告)号：US09978720B2

公开(公告)日：2018-05-22

申请号：US15201624

申请日：2016-07-05

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Gottfried Beer ,  Juergen Hoegerl

IPC: H01L21/00 ,  H01L25/065 ,  H01L23/522 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/5226 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An insulated chip comprising a semiconductor chip comprising at least one chip pad and an electrically insulating layer surrounding at least part of the semiconductor chip.

公开(公告)号：US09884757B2

公开(公告)日：2018-02-06

申请号：US14136199

申请日：2013-12-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Bernhard Winkler ,  Rainer Leuschner ,  Horst Theuss

IPC: H01L29/84 ,  B81B7/00 ,  G01L9/00 ,  G01L15/00 ,  G01L19/14

CPC classification number: B81B7/0058 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/015 ,  B81C2203/0154 ,  G01L9/0054 ,  G01L15/00 ,  G01L19/141 ,  G01L19/148 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

公开(公告)号：US09576872B2

公开(公告)日：2017-02-21

申请号：US14132296

申请日：2013-12-18

Applicant: Infineon Technologies AG

Inventor： Thomas Mueller ,  Horst Theuss

IPC: H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3157 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method includes arranging multiple semiconductor chips over a first carrier and depositing a first material layer over surfaces of the multiple semiconductor chips, wherein depositing the first material layer includes a vapor deposition, and wherein the first material layer includes at least one of an organic material and a polymer.

Abstract translation: 一种方法包括在第一载体上布置多个半导体芯片并在多个半导体芯片的表面上沉积第一材料层，其中沉积第一材料层包括气相沉积，并且其中第一材料层包括有机材料 和聚合物。

公开(公告)号：US09521499B2

公开(公告)日：2016-12-13

申请号：US13927873

申请日：2013-06-26

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H04R31/00 ,  H04R19/00

CPC classification number: H04R31/006 ,  H04R19/005 ,  H04R2201/003 ,  H04R2499/11 ,  Y10T29/49005

Abstract: An electronic device comprising a substrate, a cover delimiting at least a part of a main surface of the substrate to thereby form a cover-substrate arrangement enclosing a hollow space and having a through hole, an electroacoustic transducer configured for converting between an electric signal and an acoustic signal and being mounted on the substrate acoustically coupled with the hollow space in such a way that the hollow space constitutes a back volume of the electroacoustic transducer, wherein the electroacoustic transducer provides an acoustical coupling between the hollow space and an exterior of the cover-substrate arrangement via the through hole, an electronic chip mounted within the cover-substrate arrangement and electrically coupled with the electroacoustic transducer for communicating electric signals between the electronic chip and the electroacoustic transducer, and at least one electronic member mounted on the substrate within the cover-substrate arrangement and configured for providing an electronic function.

公开(公告)号：US20160317095A1

公开(公告)日：2016-11-03

申请号：US15141996

申请日：2016-04-29

Applicant: Infineon Technologies AG

Inventor： Jan Berger ,  Bernhard Wedl ,  Dirk Hammerschmidt ,  Walther Pachler ,  Horst Theuss ,  Harald Witschnig

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/145 ,  A61B5/026 ,  A61B5/024 ,  A61B5/05 ,  A61B5/01 ,  A61B5/0215

CPC classification number: A61B5/6862 ,  A61B5/0215 ,  A61B5/02444 ,  A61B2560/0214

Abstract: An implantable device includes a body part and a piezoelectric part. The body part is configured to grasp a pulsatile organic or inorganic tissue. The piezoelectric part is mechanically coupled to the body part and is configured to convert a varying shear force transferred from the body part to the piezoelectric part into voltage. An implantable system, comprises the implantable device and a stent like object configured to be inserted and deployed within a pulsatile or static tissue. The implantable device is configured to form a sealed junction with the pulsatile tissue while pressing against an outer circumference area of the stent.

Abstract translation: 可植入装置包括主体部分和压电部件。 身体部分配置成抓住脉动的有机或无机组织。 压电部件机械耦合到主体部分并且被配置为将从主体部分传递到压电部件的变化的剪切力转换成电压。 一种可植入系统，包括可植入装置和构造成插入和展开在脉动或静态组织内的支架样物体。 可植入装置构造成在与支架的外周区域相压的同时与脉动组织形成密封结。

公开(公告)号：US20160282259A1

公开(公告)日：2016-09-29

申请号：US15079840

申请日：2016-03-24

Applicant: Infineon Technologies AG ,  Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Inventor： Stefan Kolb ,  Alfons Dehe ,  Jochen Huber ,  Franz Jost ,  Horst Theuss ,  Wilhelm Wiedmeier ,  Juergen Woellenstein

IPC: G01N21/17

CPC classification number: G01N21/1702 ,  G01N29/022 ,  G01N29/2418 ,  G01N29/30 ,  G01N2021/1704 ,  G01N2291/0256

Abstract: Shown is a gas sensor including a sensor element, a measurement chamber and an emitter element. The sensor element has a MEMS membrane which is arranged in a first substrate region. Furthermore, the measurement chamber is embodied to receive a measurement gas.

Abstract translation: 示出了包括传感器元件，测量室和发射器元件的气体传感器。 传感器元件具有布置在第一衬底区域中的MEMS膜。 此外，测量室被实施为接收测量气体。

公开(公告)号：US20160241953A1

公开(公告)日：2016-08-18

申请号：US15043831

申请日：2016-02-15

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04R1/40 ,  H04R1/04

CPC classification number: H04R1/083 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/95 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15 ,  H01L2924/181 ,  H01L2924/19106 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/05 ,  H04R2499/11

Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

公开(公告)号：US09290379B2

公开(公告)日：2016-03-22

申请号：US14446361

申请日：2014-07-30

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H01L27/00 ,  B81C1/00 ,  B81B3/00 ,  H01L29/84 ,  H04R1/08

CPC classification number: B81C1/00333 ,  B81B3/0018 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/09 ,  B81C1/0023 ,  B81C1/00261 ,  B81C2203/0109 ,  B81C2203/0154 ,  H01L29/84 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/1815 ,  H04R1/08 ,  H01L2924/00014

Abstract: In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.

Abstract translation: 在各种实施例中，提供了一种用于制造芯片封装的方法。 该方法包括在衬底上布置芯片，芯片包括麦克风结构和麦克风结构的开口; 并且用封装材料封装芯片，使得开口保持至少部分地不包封封装材料。