公开(公告)号：US06872902B2

公开(公告)日：2005-03-29

申请号：US10608294

申请日：2003-06-27

Applicant: Michael B. Cohn ,  Ji-Hai Xu

Inventor： Michael B. Cohn ,  Ji-Hai Xu

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01H59/00 ,  H01H57/00

CPC classification number: H01H59/0009 ,  B81B7/0077 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/093 ,  B81C1/00301 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01H2059/0018 ,  H01H2059/0072

Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch. Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.

Abstract translation: 公开了MEMS器件及其制造方法。 在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。 基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。 可移动结构在接合过程中形成的密封空腔内移动。 信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。 在操作中，信号被发送到信号路径中。 当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许 信号通过微型开关传播。 在结合之前，MEMS结构在第一晶片上退火，并且导电迹线和其它金属在第二晶片上进行退火，以允许使用不同工艺（例如不同的退火温度）分别对每个晶片进行加工。

公开(公告)号：US20040216988A1

公开(公告)日：2004-11-04

申请号：US10425861

申请日：2003-04-29

Inventor： Rogier Receveur ,  Philippe Habets ,  Ralph B. Danzl ,  Richard P.M. Houben ,  Michael F. Mattes

IPC: H01H057/00

CPC classification number: H01H59/0009 ,  B81B3/0054 ,  B81B2201/018 ,  B81B2203/051 ,  H01H2001/0042 ,  H01H2001/0078 ,  Y10T29/49105

Abstract: A micro electromechanical (MEMS) switch suitable for use in medical devices is provided, along with methods of producing and using MEMS switches. In one aspect, a micro electromechanical switch including a moveable member configured to electrically cooperate with a receiving terminal is formed on a substrate. The moveable member and the receiving terminal each include an insulating layer proximate to the substrate and a conducting layer proximate to the insulating layer opposite the substrate. In various embodiments, the conducting layers of the moveable member and/or receiving terminal include a protruding region that extends outward from the substrate to switchably couple the conducting layers of the moveable member and the receiving terminal to thereby form a switch. The switch may be actuated using, for example, electrostatic energy.

Abstract translation: 提供了适用于医疗设备的微机电（MEMS）开关，以及生产和使用MEMS开关的方法。 一方面，在基板上形成包括被配置为与接收端子电配合的可移动部件的微机电开关。 可移动构件和接收端子各自包括靠近衬底的绝缘层和靠近与衬底相对的绝缘层的导电层。 在各种实施例中，可移动构件和/或接收端子的导电层包括从基板向外延伸的可突出地连接可移动构件和接收端子的导电层从而形成开关的突出区域。 可以使用例如静电能来致动开关。

公开(公告)号：US20040023429A1

公开(公告)日：2004-02-05

申请号：US10210315

申请日：2002-08-01

Applicant: Motorola Inc.

Inventor： Juergen A. Foerstner ,  Steven M. Smith ,  Raymond Mervin Roop

IPC: H01L021/00

CPC classification number: B81C1/0038 ,  B81B2201/018 ,  B81B2201/0292 ,  B81C1/00246 ,  B81C2201/0164 ,  B81C2203/0735 ,  H01G5/18

Abstract: A method is provided for making a MEMS structure (69). In accordance with the method, a CMOS substrate (51) is provided which has interconnect metal (53) deposited thereon. A MEMS structure is created on the substrate through the plasma assisted chemical vapor deposition (PACVD) of a material selected from the group consisting of silicon and silicon-germanium alloys. The low deposition temperatures attendant to the use of PACVD allow these materials to be used for MEMS fabrication at the back end of an integrated CMOS process.

公开(公告)号：US20030214045A1

公开(公告)日：2003-11-20

申请号：US10390994

申请日：2003-03-17

Inventor： Syamal Kumar Lahiri ,  Frank Swiatowiec ,  Fu Chiung Chong ,  Sammy Mok ,  Erh-Kong Chieh ,  Roman L. Milter ,  Joseph M. Haemer ,  Chang-Ming Lin ,  Yi-Hsing Chen ,  David Thanh Doan

IPC: H01L021/48 ,  H01L023/52

CPC classification number: G01R3/00 ,  B81B3/0072 ,  B81B2201/018 ,  G01R1/06761 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/14 ,  H01R12/57 ,  H01R12/718 ,  H01R13/24 ,  H01R13/2442 ,  H05K3/4092 ,  H05K7/1061

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

公开(公告)号：US20030117257A1

公开(公告)日：2003-06-26

申请号：US10290807

申请日：2002-11-08

Applicant: Coventor, Inc.

Inventor： Shawn Jay Cunningham

IPC: H01C010/50

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。

公开(公告)号：US06522452B2

公开(公告)日：2003-02-18

申请号：US09842602

申请日：2001-04-26

Applicant: Robert L. Wood

Inventor： Robert L. Wood

IPC: G02B2600

CPC classification number: G02B26/0841 ,  B81B3/0054 ,  B81B2201/018 ,  H01H2001/0042 ,  H02K99/20

Abstract: Mounting systems for micro-electromechanical system (MEMS) structures are provided including a non-Newtonian fluid having a threshold viscosity that is positioned between a MEMS base member and the MEMS structure so as to position the MEMS structure relative to the base member. A MEMS actuator is coupled to the MEMS structure. The MEMS actuator is positioned to cause movement of the MEMS structure relative to the MEMS base member by generating a force sufficient to exceed the threshold viscosity of the non-Newtonian fluid when the MEMS actuator is actuated. The MEMS structure may be a MEMS mirror positioned for pivotal movement about a bearing member to control tilt of the MEMS mirror.

公开(公告)号：US20020158547A1

公开(公告)日：2002-10-31

申请号：US09842602

申请日：2001-04-26

Inventor： Robert L. Wood

IPC: H02N010/00

CPC classification number: G02B26/0841 ,  B81B3/0054 ,  B81B2201/018 ,  H01H2001/0042 ,  H02K99/20

Abstract: Mounting systems for micro-electromechanical system (MEMS) structures are provided including a non-Newtonian fluid having a threshold viscosity that is positioned between a MEMS base member and the MEMS structure so as to position the MEMS structure relative to the base member. A MEMS actuator is coupled to the MEMS structure. The MEMS actuator is positioned to cause movement of the MEMS structure relative to the MEMS base member by generating a force sufficient to exceed the threshold viscosity of the non-Newtonian fluid when the MEMS actuator is actuated. The MEMS structure may be a MEMS mirror positioned for pivotal movement about a bearing member to control tilt of the MEMS mirror.

Abstract translation: 提供了用于微机电系统（MEMS）结构的安装系统，其包括具有阈值粘度的非牛顿流体，该阈值粘度位于MEMS基座构件和MEMS结构之间，以便相对于基座构件定位MEMS结构。 MEMS致动器耦合到MEMS结构。 MEMS致动器被定位成通过在MEMS致动器致动时产生足以超过非牛顿流体的阈值粘度的力来引起MEMS结构相对于MEMS基底构件的移动。 MEMS结构可以是定位成围绕轴承构件枢转运动以控制MEMS反射镜的倾斜的MEMS镜。

公开(公告)号：US20020096421A1

公开(公告)日：2002-07-25

申请号：US09997671

申请日：2001-11-28

Inventor： Michael B. Cohn ,  Ji-Hai Xu

IPC: H01H057/00

CPC classification number: H01H59/0009 ,  B81B7/0077 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/093 ,  B81C1/00301 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01H2059/0018 ,  H01H2059/0072

Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch. Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.

Abstract translation: 公开了MEMS器件及其制造方法。 在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。 基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。 可移动结构在接合过程中形成的密封空腔内移动。 信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。 在操作中，信号被发送到信号路径中。 当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许 信号通过微型开关传播。 在结合之前，MEMS结构在第一晶片上退火，并且导电迹线和其它金属在第二晶片上进行退火，以允许使用不同工艺（例如不同的退火温度）分别对每个晶片进行加工。

公开(公告)号：US6028343A

公开(公告)日：2000-02-22

申请号：US957568

申请日：1997-10-24

Applicant: Tsiu Chiu Chan ,  Melvin Joseph DeSilva

Inventor： Tsiu Chiu Chan ,  Melvin Joseph DeSilva

IPC: B81B3/00 ,  B81B7/02 ,  G01P15/135 ,  H01L29/82

CPC classification number: G01P15/135 ,  B81C1/00246 ,  B81B2201/018 ,  B81C2203/0735

Abstract: An integrated circuit and method are provided for sensing activity such as acceleration in a predetermined direction. The integrated released beam sensor preferably includes a switch detecting circuit region and a sensor switching region connected to and positioned adjacent the switch detecting circuit region. The sensor switching region preferably includes a fixed contact layer, remaining portions of a sacrificial layer on the fixed contact layer, and a floating contact on the remaining portions of the sacrificial layer and having only portions thereof directly overlying the fixed contact layer and in spaced relation therefrom in a normally open position and extending lengthwise generally transverse to the predetermined direction so that the floating contact contacts the fixed contact layer responsive to acceleration in the predetermined direction. The floating contact is preferably a released beam which is released by opening a window or removing unwanted portions of the sacrificial layer. The methods of forming an integrated sensor advantageously are preferably compatible with know integrated circuit manufacturing processes, such as for CMOS circuit manufacturing, with only slight variations therefrom.

Abstract translation: 提供集成电路和方法来感测诸如在预定方向上的加速度的活动。 集成释放的光束传感器优选地包括开关检测电路区域和连接到并且位于开关检测电路区域附近的传感器开关区域。 传感器切换区域优选地包括固定接触层，固定接触层上的牺牲层的剩余部分和牺牲层的其余部分上的浮动接触，并且仅具有直接覆盖固定接触层的部分并且间隔开 从而处于常开位置并且大致横向于预定方向延伸，使得浮动接触件响应于预定方向上的加速度而接触固定接触层。 浮动触点优选地是释放的光束，其通过打开窗口或去除牺牲层的不需要的部分来释放。 有利地形成集成传感器的方法优选地与知道的集成电路制造工艺相兼容，例如用于CMOS电路制造，仅具有轻微的变化。

公开(公告)号：US5867302A

公开(公告)日：1999-02-02

申请号：US908639

申请日：1997-08-07

Applicant: James G. Fleming

Inventor： James G. Fleming

IPC: B81B3/00 ,  G02B26/08 ,  G02B26/00

CPC classification number: G02B26/0841 ,  B81B3/0054 ,  G02B26/0825 ,  H01G5/16 ,  H01G5/38 ,  H01G5/40 ,  B81B2201/018 ,  B81B2201/045 ,  B81B2203/0109 ,  H01H2001/0042 ,  Y10S359/904

Abstract: A bistable microelectromechanical (MEM) actuator is formed on a substrate and includes a stressed membrane of generally rectangular shape that upon release assumes a curvilinear cross-sectional shape due to attachment at a midpoint to a resilient member and at opposing edges to a pair of elongate supports. The stressed membrane can be electrostatically switched between a pair of mechanical states having mirror-image symmetry, with the MEM actuator remaining in a quiescent state after a programming voltage is removed. The bistable MEM actuator according to various embodiments of the present invention can be used to form a nonvolatile memory element, an optical modulator (with a pair of mirrors supported above the membrane and moving in synchronism as the membrane is switched), a switchable mirror (with a single mirror supported above the membrane at the midpoint thereof) and a latching relay (with a pair of contacts that open and close as the membrane is switched). Arrays of bistable MEM actuators can be formed for applications including nonvolatile memories, optical displays and optical computing.

Abstract translation: 双稳态微机电（MEM）致动器形成在基板上并且包括大致矩形形状的应力膜，其在释放时呈现曲线形横截面形状，这是由于在中间点附接到弹性构件，并且在相对的边缘处与一对细长 支持。 应力膜可以在具有镜像对称性的一对机械状态之间静电切换，在执行编程电压之后，MEM致动器保持静止状态。 根据本发明的各种实施例的双稳态MEM致动器可以用于形成非易失性存储元件，光学调制器（在膜上方支撑并且当膜被切换时同步地移动的一对反射镜），可切换镜 具有在其中间点处支撑在膜上方的单个反射镜）和闭锁继电器（具有一对在膜被切换时打开和关闭的触点）。 双稳态MEM致动器的阵列可以形成用于包括非易失性存储器，光学显示器和光学计算的应用。