公开(公告)号：US20240341028A1

公开(公告)日：2024-10-10

申请号：US18744990

申请日：2024-06-17

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xianfeng YANG ,  Xianlei BI ,  Chuanyan LAN ,  Qian MA

IPC: H05K1/02 ,  G06F3/041 ,  H05K1/14

CPC classification number: H05K1/0218 ,  G06F3/0416 ,  H05K1/144 ,  G06F2203/04107 ,  H05K2201/041

Abstract: A circuit board module relates to the field of touch technologies. The above circuit board module includes a touch chip, a first circuit board, a second circuit board and at least one conductive connection portion. The touch chip includes at least one ground pin and a plurality of signal pins. The first circuit board includes a first ground portion and a plurality of signal pads; the signal pads are electrically connected to the signal pins; the first ground is electrically connected to the at least one ground pin. The second circuit board includes a second ground portion. The at least one conductive connection portion is electrically connected to the first ground portion and the second ground portion.

公开(公告)号：US20240291181A1

公开(公告)日：2024-08-29

申请号：US18570623

申请日：2022-06-22

Applicant: GUANGZHOU KANGLONG ELECTRONICS CO., LTD.

Inventor： Tielong KANG ,  Zhiming LIANG

IPC: H01R12/52 ,  H05K1/11 ,  H05K1/14

CPC classification number: H01R12/52 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09181

Abstract: A board-to-board connection structure for a PCB is disclosed. When a bottom board is welded to a functional board, weld legs thereof can be expanded in a perpendicular direction by means of a first bridge board, and the number of the weld legs of the bottom board to the functional board is no longer limited by the width of the functional board; a first partition board can prevent a short circuit between a third pad and a fourth pad on the functional board, and isolate a sixth pad on the first bridge board from a first pad on the bottom board; and at the same time, the first partition board can connect a second pad on the bottom board to a fifth pad of the first bridge board.

公开(公告)号：US20240268027A1

公开(公告)日：2024-08-08

申请号：US18569529

申请日：2022-06-15

Applicant: Rolls-Royce Deutschland Ltd & Co KG

Inventor： Stanley BUCHERT ,  Uwe WALTRICH

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10

CPC classification number: H05K1/144 ,  H05K3/0091 ,  H05K3/022 ,  H05K3/101 ,  H05K2201/041

Abstract: A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.

公开(公告)号：US12048086B2

公开(公告)日：2024-07-23

申请号：US17772185

申请日：2021-03-19

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xianfeng Yang ,  Xianlei Bi ,  Chuanyan Lan ,  Qian Ma

IPC: H05K1/02 ,  G06F3/041 ,  H05K1/14

CPC classification number: H05K1/0218 ,  G06F3/0416 ,  H05K1/144 ,  G06F2203/04107 ,  H05K2201/041

Abstract: A circuit board module relates to the field of touch technologies. The above circuit board module includes a touch chip, a first circuit board, a second circuit board and at least one conductive connection portion. The touch chip includes at least one ground pin and a plurality of signal pins. The first circuit board includes a first ground portion and a plurality of signal pads; the signal pads are electrically connected to the signal pins; the first ground is electrically connected to the at least one ground pin. The second circuit board includes a second ground portion. The at least one conductive connection portion is electrically connected to the first ground portion and the second ground portion.

公开(公告)号：US12041720B2

公开(公告)日：2024-07-16

申请号：US18312708

申请日：2023-05-05

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ren Xiong ,  Fan Li ,  Qiang Tang ,  Fei Shang ,  Haijun Qiu ,  Yuanyuan Chai ,  Huiqiang Song

IPC: H05K1/11 ,  G06F3/041 ,  G06F3/044 ,  H01R12/61 ,  H05K3/36 ,  H05K1/18 ,  H10K59/131 ,  H10K59/179

CPC classification number: H05K1/118 ,  G06F3/0412 ,  G06F3/0443 ,  G06F3/0446 ,  H01R12/61 ,  H05K3/363 ,  G06F3/04164 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09481 ,  H05K2201/10128 ,  H10K59/131 ,  H10K59/179

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

公开(公告)号：US20240204268A1

公开(公告)日：2024-06-20

申请号：US18533970

申请日：2023-12-08

Applicant: Robert Bosch GmbH

Inventor： Holger Wernerus ,  Andrej Stepanov ,  Christoph Klee

IPC: H01M10/42 ,  H01M10/48 ,  H05K1/09 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01M10/4257 ,  H01M10/486 ,  H05K1/09 ,  H05K1/111 ,  H05K3/341 ,  H05K3/368 ,  H01M2220/30 ,  H05K2201/041 ,  H05K2201/10151

Abstract: An energy storage unit for an electrical consumer includes at least one energy storage cell, a first printed circuit board for electrically contacting the at least one energy storage cell having a first and a second power supply contact of the energy storage unit. The first printed circuit board is arranged adjacent to the at least one energy storage cell and comprises at least one temperature sensor for sensing a temperature of the at least one energy storage cell. At least one further printed circuit board is electromechanically connected to the first printed circuit board and the at least one temperature sensor is arranged on the at least one further printed circuit board. The energy storage unit can be used with an electrical consumer such as a hand-held power tool with the energy storage unit designed as a removeable battery pack.

公开(公告)号：US20240147622A1

公开(公告)日：2024-05-02

申请号：US18118217

申请日：2023-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Yoon LEE ,  Seung Eun LEE

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/14 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/185 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10984 ,  H05K2201/2081

Abstract: A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

公开(公告)号：US20240130044A1

公开(公告)日：2024-04-18

申请号：US18484616

申请日：2023-10-11

Applicant: Taicang Manaflex Technology Co., Ltd.

Inventor： Robert C. Lane

IPC: H05K1/14 ,  B23K35/02 ,  B23K35/28

CPC classification number: H05K1/144 ,  B23K35/0255 ,  B23K35/286 ,  B23K2101/42 ,  H05K2201/041

Abstract: A circuit board weld structure comprises a first circuit board connected with and a second circuit board. A surface of the first circuit board is provided with a first covering film, the first covering film is provided with a first through hole, and a first welding pad is formed on the surface of the first circuit board. A surface of the second circuit board is provided with a second covering film, the second covering film is provided with a second through hole, and a second welding pad is formed on the surface of the second circuit board. The first welding pad is welded or coupled to the second welding pad through a filler piece.

公开(公告)号：US20240064899A1

公开(公告)日：2024-02-22

申请号：US17892685

申请日：2022-08-22

Applicant: Motorola Mobility LLC

Inventor： Wayne G Morrison ,  Puckpol Chutakanonta

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/145 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2203/167

Abstract: An electronic device includes a first circuit board, a second circuit board, and an interposer circuit board. The interposer circuit board defines a walled interface mechanically attaching the first circuit board to the second circuit board. One or more electronic circuit components are positioned within the walled interface and are mechanically attached to one of the first circuit board or the second circuit board. An electronic circuit interface component is mechanically attached to the first circuit board outside the walled interface. The electronic circuit interface component is electronically coupled to the one or more electronic circuit components

公开(公告)号：US20240049392A1

公开(公告)日：2024-02-08

申请号：US18355199

申请日：2023-07-19

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K1/028 ,  H05K1/115 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/0939 ,  H05K2201/09481

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.